公开(公告)号：EP1926784B1

公开(公告)日：2010-01-13

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP1475170B1

公开(公告)日：2008-09-03

申请号：EP04252631.9

申请日：2004-05-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Shimoda, Kohei, c/o Osaka Works of Sumitomo ,  Majima, Masatoshi, c/o Osaka Works of Sumitomo ,  Koyama, Keiji, c/o Osaka Works of Sumitomo ,  Okada, Issei, c/o Osaka Works of Sumitomo ,  Kuwabara, Tetsuya, c/o Osaka Works of Sumitomo

IPC: B22F1/00 ,  B22F9/24

CPC classification number: H05K3/321 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C08K3/08 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0248 ,  C08L21/00

公开(公告)号：EP1946626A1

公开(公告)日：2008-07-23

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder (8) is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder (8) has a flake or dendrite shape including a core segment (8a) of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment (8b) of the metal with good-wettability for the molten solder and to be solid-solved in the core segment (8a) molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles (18) . Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

公开(公告)号：EP1060141B1

公开(公告)日：2002-10-30

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce E. ,  ROBERTSON, Walter, J.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

Abstract translation: 本发明提供了用非研磨固体颗粒浸渍的玻璃纤维丝束，其在丝束内的相邻纤维之间提供至少3微米的间隙，这对于增强复合材料是有用的。

公开(公告)号：EP0763562A3

公开(公告)日：1997-12-03

申请号：EP96306669.1

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: C08K7/02 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or electrically insulating short fibers dispersed in the semi-cured thermosetting resin and, if necessary, the prepreg being provided on a carrier film is suitable for producing multi-layer printed circuit boards of reduced thickness, high wiring density and high connection reliability with high productivity and low production cost.

公开(公告)号：EP0416518B1

公开(公告)日：1995-12-06

申请号：EP90116931.8

申请日：1990-09-04

Applicant: IDEMITSU KOSAN COMPANY LIMITED

Inventor： Nakano, Akikazu

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

公开(公告)号：EP0305846B1

公开(公告)日：1995-03-29

申请号：EP88113614.7

申请日：1988-08-22

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Inoue, Masakazu ,  Asai, Kuniaki ,  Hieda, Kazuo ,  Kobayashi, Tadayasu

IPC: C08L67/00 ,  C08K7/04 ,  C08K3/26 ,  H05K1/00

CPC classification number: H05K1/0373 ,  C08K3/26 ,  C08K7/04 ,  H05K1/0326 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251 ,  C08L67/00

公开(公告)号：EP0305846A3

公开(公告)日：1990-06-20

申请号：EP88113614.7

申请日：1988-08-22

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Inoue, Masakazu ,  Asai, Kuniaki ,  Hieda, Kazuo ,  Kobayashi, Tadayasu

IPC: C08L67/00 ,  C08K7/04 ,  C08K3/26 ,  H05K1/00

CPC classification number: H05K1/0373 ,  C08K3/26 ,  C08K7/04 ,  H05K1/0326 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251 ,  C08L67/00

Abstract: A resin composition for printed circuit board comprising:
(A) 30 - 90% by weight of a liquid crystal polyester, (B) 3 - 50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 µm or below and an average length of 200 µm or below, and (C) 3 - 30% by weight of an alkaline earth metal carbonate.

公开(公告)号：EP2440024A4

公开(公告)日：2012-12-05

申请号：EP10783253

申请日：2010-05-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K3/32 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

公开(公告)号：EP2525398A1

公开(公告)日：2012-11-21

申请号：EP11732925.0

申请日：2011-01-13

Applicant: Kyocera Corporation

Inventor： ISHIMINE,Yuusaku ,  MORIYAMA,Masayuki ,  KOMATSUBARA,Kenji

IPC: H01L23/15 ,  H01L23/13 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.