公开(公告)号：US20060288567A1

公开(公告)日：2006-12-28

申请号：US11468231

申请日：2006-08-29

Applicant: Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

Inventor： Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

IPC: H01H11/00 ,  H05K3/30 ,  H05K3/00

CPC classification number: H01L23/62 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10181 ,  H05K2201/10204 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10T29/49105 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Abstract translation: 一种器件包括衬底。 衬底还包括包括多个焊盘的第一主表面和第二主表面。 至少一个部件附接到第一主表面上的多个焊盘中的至少一些。 至少一个牺牲部件附接到第一主表面。 所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。 第二个高度大于第一个高度。 牺牲部件包括保险丝。

公开(公告)号：US07094975B2

公开(公告)日：2006-08-22

申请号：US10717839

申请日：2003-11-20

Applicant: Suresh K. Chengalva ,  David W. Ihms ,  Bruce A. Myers

Inventor： Suresh K. Chengalva ,  David W. Ihms ,  Bruce A. Myers

IPC: H05K1/03

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.

Abstract translation: 一种电路板组件，包括层压基板和表面安装装置，所述表面安装装置的CTE小于层压基板的CTE，并且与至少一个焊接接头连接到层叠基板的第一表面。 组件还包括附着到层叠基板的第二表面以便与电路装置直接相对的局部加强件。 局部加强件由材料形成并且被成形为使得当附接到层叠基板时，加强件能够增加将该装置附接到基板的一个或多个焊点的热循环疲劳寿命。

公开(公告)号：US07015823B1

公开(公告)日：2006-03-21

申请号：US10966593

申请日：2004-10-15

Applicant: Robert Joseph Gillen ,  Todd Scott Grimes

Inventor： Robert Joseph Gillen ,  Todd Scott Grimes

IPC: G08B21/00 ,  G08B13/00

CPC classification number: G08B13/128 ,  G08B21/0213 ,  H05K1/0275 ,  H05K1/0286 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10204 ,  H05K2201/10212

Abstract: A physical barrier for a circuit board also functions as a tampering sensor or sensors monitored by electrical circuitry that generates a tamper signal for erasing information critical for the operation of the circuit board in the event of sensed tampering. One or more routing matrices configured in at least one programmable device is programmed to interconnect operating as well as optional dummy components on the board so that routing information is erased in the event of sensed tampering.

Abstract translation: 用于电路板的物理屏障还用作由电路监控的篡改传感器或传感器，该传感器或传感器产生篡改信号，以在发生篡改的情况下擦除对电路板操作至关重要的信息。 配置在至少一个可编程设备中的一个或多个路由矩阵被编程为在板上互连操作以及可选的虚拟部件，使得在感测到的篡改的情况下擦除路由信息。

公开(公告)号：US06995321B2

公开(公告)日：2006-02-07

申请号：US10039942

申请日：2002-01-03

Applicant: Bruce W. Lee ,  Jesse L. Pedigo

Inventor： Bruce W. Lee ,  Jesse L. Pedigo

IPC: H05K1/00

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.

公开(公告)号：US20050235490A1

公开(公告)日：2005-10-27

申请号：US10832321

申请日：2004-04-27

Applicant: Chih-Chung Chen

Inventor： Chih-Chung Chen

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/0052 ,  H05K1/0269 ,  H05K3/225 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/10204 ,  H05K2201/10598 ,  H05K2203/0143 ,  H05K2203/0191 ,  H05K2203/0228 ,  H05K2203/0278 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49718 ,  Y10T29/49721 ,  Y10T29/49723 ,  Y10T29/49725 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/49732 ,  Y10T29/49734 ,  Y10T29/4975

Abstract: A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting the printed circuit board area block plan, selecting the printed circuit boards, cutting out the area blocks, cutting the selected area blocks, applying the adhesive and fitting area blocks, adjusting the area block alignment, roller tamping the plastic band, curing the adhesive, and tearing off the plastic band. Following the reworking operations, defective printed circuit boards are restored into a good products capable of continuous use such that printed circuit board fabrication and production is even more economical and environmentally protective and, furthermore, printed circuit board manufacturing reaches maximum utilization rates, thereby effectively increasing practical production value.

Abstract translation: 一种印刷电路板缺陷区域移植修复方法，其中确定为有缺陷的印刷电路板经历一系列返工程序，其包括绘制印刷电路板区域块图，选择印刷电路板，切割区域块，切割 所选区域块，涂抹粘合剂和装配区域块，调整区域块对齐，辊夯塑料带，固化粘合剂，撕下塑料带。 在返工操作之后，有缺陷的印刷电路板被恢复成能够连续使用的良好产品，使得印刷电路板的制造和生产更加经济和环境保护，此外，印刷电路板制造达到最大利用率，从而有效地增加 实用生产价值。

公开(公告)号：US06787711B2

公开(公告)日：2004-09-07

申请号：US10195547

申请日：2002-07-16

Applicant: Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

Inventor： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

IPC: H05K111

CPC classification number: H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.

Abstract translation: 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。

公开(公告)号：US20040165361A1

公开(公告)日：2004-08-26

申请号：US10788463

申请日：2004-03-01

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

IPC: H05K001/18

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

公开(公告)号：US20030011098A1

公开(公告)日：2003-01-16

申请号：US10201416

申请日：2002-07-22

Inventor： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

IPC: B28B001/48

CPC classification number: H05K3/1233 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  Y10T29/49165

Abstract: Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

Abstract translation: 用于改进电子基板通孔和通孔填充的方法，特别是通过使用通过控制深度钻孔超大非贯穿孔形成的钻孔支座以及使用插入的支撑柱来防止在填充期间底板的松弛。 特别地，通过使用：（1）适于与包括至少两个要填充的通孔的基板一起使用的通孔填充支架，每个通孔具有X密耳的直径，所述支座包括至少一个 通过直径至少为12X密耳的孔的控制深度钻孔形成的凹陷; 和（2）适于与包括要填充的至少一个通孔的基板一起使用的通孔填充支座，所述支座包括：至少一个凹部; 以及定位在所述凹部内的至少一个支撑柱，其中所述支撑柱不是所述支座的组成部分。

公开(公告)号：US6131277A

公开(公告)日：2000-10-17

申请号：US360788

申请日：1999-07-26

Applicant: Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

Inventor： Jonathan Cadenhead ,  Terry Richard Fleegle ,  Michael Carlos Menard

IPC: H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/62 ,  H05K3/363 ,  H05K2201/10204 ,  H05K2201/10242 ,  H05K2203/167 ,  H05K3/341 ,  H05K3/4015 ,  Y10S439/931 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electrical circuit includes a substrate having at least two alignment pads on the substrate that are accurately aligned with a first set of electrical interconnect pads, and also includes a corresponding number of alignment posts that are cylindrical and have flat bases that are geometrically similar to and smaller than a corresponding shape of each of the at least two alignment pads by a predetermined solder fillet radius. Each of the at least two alignment posts is reflow soldered to one of the at least two alignment pads. An electrical part can be accurately aligned to the substrate using the alignment posts, during attachment of the electrical part.

Abstract translation: 电路包括具有至少两个对准焊盘的衬底，衬底上的至少两个对准焊盘与第一组电互连衬垫精确对准，并且还包括相应数量的对准柱，其为圆柱形并且具有几何等同于 小于所述至少两个对准焊盘中的每一个的相应形状，并通过预定的焊料圆角半径。 所述至少两个对准柱中的每一个被回流焊接到所述至少两个对准焊盘中的一个。 在电气部件的附接期间，可以使用对准柱将电气部件精确地对准到基板。

公开(公告)号：US5116440A

公开(公告)日：1992-05-26

申请号：US475945

申请日：1990-02-06

Applicant: Kazunori Takeguchi ,  Kohji Hirata

Inventor： Kazunori Takeguchi ,  Kohji Hirata

IPC: B32B37/18 ,  H05K1/18 ,  H05K3/46

CPC classification number: B32B37/182 ,  B32B37/0023 ,  H05K3/4697 ,  B29L2031/3425 ,  B32B2457/08 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/10204 ,  H05K2203/063 ,  H05K2203/1147

Abstract: In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.

Abstract translation: 在制造具有用于安装电子装置的空腔的多层印刷线路板中，橡胶或复合橡胶片安装在空腔中以防止预浸料树脂流入空腔。 在将压力和温度施加到由待粘合的板和它们之间的预浸料组成的组件之后，将橡胶片或复合橡胶片除去。 这消除了当树脂流入空腔时可能导致的不良粘合。