公开(公告)号：US3958075A

公开(公告)日：1976-05-18

申请号：US522564

申请日：1974-11-11

Applicant: Lance R. Kaufman

Inventor： Lance R. Kaufman

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/09 ,  H05K3/20 ,  H05K3/34 ,  H01B7/34

CPC classification number: H05K3/3405 ,  H01L23/3672 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L23/5389 ,  H01L25/16 ,  H05K1/0263 ,  H01L2224/48247 ,  H01L2924/13034 ,  H05K1/092 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/202 ,  H05K3/3421 ,  Y10T29/49149 ,  Y10T29/5178

Abstract: The lead frame for a thick film circuit has inwardly extending strip portions of substantial area which are positioned and dimensioned to substantially match and overlie selected thick film conductors to increase the current carrying capacity thereof and to act as mounting elements and heat diffusers for diodes, SCRs (silicon controlled rectifiers) and other heat-generating components.

Abstract translation: 用于厚膜电路的引线框架具有大致面积的向内延伸的带状部分，其位置和尺寸被设计成基本上匹配并覆盖所选择的厚膜导体以增加其载流能力，并且用作用于二极管，SCR的安装元件和热扩散器 （可控硅整流器）和其他发热元件。

公开(公告)号：US3775579A

公开(公告)日：1973-11-27

申请号：US3775579D

申请日：1972-05-30

Applicant: IBM

Inventor： BURGHART A ,  HOUSER D ,  KIEFFER J ,  WALLACE G

IPC: B23K11/00 ,  H05K3/22 ,  H05K3/32 ,  B23K1/02

CPC classification number: B23K11/0046 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49718

Abstract: A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.

Abstract translation: 一种用于修复印刷电路板上的印刷电路线中的开放或空隙的方法和装置，其中板被定位成在接合头下方开放，并且金属带材料被定位在接合到电路线上的开放的热压缩上 一侧打开，切割长度，然后热压接在电路线的另一侧开放。

公开(公告)号：US3554793A

公开(公告)日：1971-01-12

申请号：US3554793D

申请日：1968-02-20

Applicant: SIEMENS AG

Inventor： KRIEGER FRIEDRICH

IPC: B23K1/20 ,  H01R12/00 ,  H05K3/34 ,  B41M3/08 ,  H05K3/02

CPC classification number: H05K3/3468 ,  B23K1/20 ,  B23K2201/42 ,  H05K2201/1028 ,  H05K2203/044 ,  H05K2203/0723 ,  H05K2203/1105

Abstract: SOLDERING MATERIAL IS SPRAYED OVER AN ELECTRICAL CIRCUIT PATTERN POSITIONED ON AN INSULATING CARRIER. THE SOLDER IS IN THE LIQUID STATE, BUT IS BELOW THE TEMPERATURE AT WHICH THE SOLDER FORMS AN ALLOY WITH THE METAL CIRCUIT PATTERN. THE LAYER OF SOLDER IS THEN HEATED TO ITS ALLOYING TEMPERATURE CAUSING THE SOLDER TO CNTRACT, BY SURFACE TENSION, ONTO THE METAL CIRCUIT PATTERN FORMING AN ALLOY THEREWITH AND LEAVING THE INSULATING CARRIER SUBSTANTIALLY FREE OF SOLDER, WHICH COULD CAUSE A SHORT CIRCUIT.

公开(公告)号：US3292051A

公开(公告)日：1966-12-13

申请号：US33382563

申请日：1963-12-27

Applicant: GEN ELECTRIC

Inventor： OLNEY JR FRED D ,  PRICE DONALD R

IPC: H05K1/18 ,  H05K7/06

CPC classification number: H05K1/18 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10651 ,  H05K2201/10962

公开(公告)号：US3234629A

公开(公告)日：1966-02-15

申请号：US20241762

申请日：1962-06-14

Applicant: DEFIANCE PRINTED CIRCUIT CORP

Inventor： WHEELER JAMES C

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/34 ,  H05K3/38 ,  H05K7/06

CPC classification number: H05K3/103 ,  H05K1/0266 ,  H05K3/0005 ,  H05K3/3447 ,  H05K3/386 ,  H05K7/06 ,  H05K2201/0373 ,  H05K2201/09936 ,  H05K2201/1028 ,  Y10T29/49142 ,  Y10T29/49155

公开(公告)号：US1941411A

公开(公告)日：1933-12-26

申请号：US48606430

申请日：1930-10-03

Applicant: HARTFORD EMPIRE CO

Inventor： VERGIL MULHOLLAND

IPC: C03B5/235 ,  H05K1/00 ,  H05K3/10

CPC classification number: C03B5/235 ,  H05K1/0289 ,  H05K3/107 ,  H05K2201/098 ,  H05K2201/1028 ,  Y02P40/535

公开(公告)号：WO2018063171A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054053

申请日：2016-09-28

Applicant: INTEL CORPORATION

Inventor： LONG, Brian, J.

IPC: H05K1/02 ,  H05K1/11 ,  H01L23/367

CPC classification number: H05K1/0204 ,  G06F1/181 ,  G06F1/203 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/144 ,  H05K1/181 ,  H05K3/36 ,  H05K7/20336 ,  H05K7/20818 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10734 ,  H01L2924/014 ,  H01L2224/29099

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through -hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end or the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

Abstract translation: 实施例的各方面包括边缘卡及其制造方法。 边缘卡可以包括包括第一端和第二端的印刷电路板（PCB），第一端包括被配置为与边缘连接器对接的多个金属接触指，并且第二端包括通孔，该通孔被配置为 与螺钉柱接合，所述PCB还包括靠近所述第二端或所述PCB的孔。 PCB还可以包括固定到PCB的热传导元件，热传导元件支撑集成电路封装，集成电路封装由孔接收，其中热传导元件在通孔附近接触PCB并且热传导 元件被配置为从集成电路向印刷电路板的第二部分传导热量。

公开(公告)号：WO2017037828A1

公开(公告)日：2017-03-09

申请号：PCT/JP2015/074639

申请日：2015-08-31

Applicant: オリンパス株式会社

Inventor： 宮脇　貴秀

IPC: A61B1/04 ,  G02B23/24 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L27/14 ,  H04N5/225 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/181 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/042 ,  G02B23/24 ,  G02B23/2423 ,  G02B23/2446 ,  G02B23/2484 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/111 ,  H05K1/14 ,  H05K1/141 ,  H05K3/284 ,  H05K3/32 ,  H05K3/3426 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10977 ,  H05K2203/0285

Abstract: 内視鏡９は、撮像ユニット１を挿入部８０の先端部８１に有し、前記撮像ユニット１が、第１の電極パッド３２と第２の電極パッド３４とが配設されているチップ部品３０と、第３の電極パッド２２が配設されている撮像素子２０と、フライングリード４１を有する配線板４０と、を具備し、チップ部品３０と撮像素子２０との間隙にフライングリード４１が挿入されており、第１の電極パッド３２とフライングリード４１とが第１のバンプ３３を介して接合されており、接合部が第１の封止樹脂３９により封止されており、第２の電極パッド３４と第３の電極パッド２２とが、第１のバンプ３３よりも高さの高い第２のバンプ３５を介して接合されており、第１の封止樹脂３９よりもヤング率が小さい第２の封止樹脂２９により封止されている。

Abstract translation: 内窥镜9设置有芯片部件30，其在插入部80的前端部81处具有摄像单元1，所述摄像单元1设置有第一电极焊盘32和第二电极焊盘34 ; 设置有第三电极焊盘22的图像拾取元件20; 以及具有飞行引线41的布线板40.飞铅41插入到芯片部件30和图像拾取元件20之间的间隙中，第一电极焊盘32和飞行引线41通过具有 第一凸起33之间，第一密封树脂39密封接合部分，并且第二电极焊盘34和第三电极焊盘22之间通过其间具有高于第一凸起33的第二凸起35彼此接合， 并且通过比第一密封树脂39小的杨氏模量的第二密封树脂29密封。

公开(公告)号：WO2016024953A1

公开(公告)日：2016-02-18

申请号：PCT/US2014/050708

申请日：2014-08-12

Applicant: ADVANCED BIONICS AG ,  LI, Lin ,  XIE, Jian ,  WALTER, Jeryle

Inventor： LI, Lin ,  XIE, Jian ,  WALTER, Jeryle

IPC: H05K3/32 ,  H01R4/02

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract translation: 将导线（126）连接到馈通引脚（104）和包括连接到馈通引脚的导线的装置的方法。

公开(公告)号：WO2015069808A1

公开(公告)日：2015-05-14

申请号：PCT/US2014/064183

申请日：2014-11-05

Applicant: OSRAM SYLVANIA INC.

Inventor： SPEER, Richard ,  HAMBY, David ,  SELVERIAN, John

IPC: H05K3/10 ,  H05K1/18 ,  H01L33/48 ,  F21S4/00 ,  H05K1/02 ,  H01L25/13

CPC classification number: H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/0287 ,  H05K1/181 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/2054 ,  H05K2203/063 ,  H01L2924/00

Abstract: Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

Abstract translation: 公开了用于制造使用可附着有SMD的金属导体的柔性层叠电路板的技术。 可以将导电金属条层压以形成柔性基板，然后可以穿过金属条以放置LED封装引线。 LED封装可以使用焊料或导电环氧树脂附着到导电条，并且上层叠层可以包括暴露金属条的部分以穿过LED封装的穿孔。 或者，可以通过将LED封装连接到导电条上来制造LED封装串，并且这些串可以层压在柔性片之间以形成层压LED电路。 塑料外壳可能有助于将LED封装连接到导电条上。 塑料外壳和/或层压片可以由反射材料制成。