Method and apparatus for repairing printed circuits
    232.
    发明授权
    Method and apparatus for repairing printed circuits 失效
    修复印刷电路的方法和装置

    公开(公告)号:US3775579A

    公开(公告)日:1973-11-27

    申请号:US3775579D

    申请日:1972-05-30

    Applicant: IBM

    Abstract: A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.

    Abstract translation: 一种用于修复印刷电路板上的印刷电路线中的开放或空隙的方法和装置,其中板被定位成在接合头下方开放,并且金属带材料被定位在接合到电路线上的开放的热压缩上 一侧打开,切割长度,然后热压接在电路线的另一侧开放。

    FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES
    240.
    发明申请
    FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES 审中-公开
    柔性电路板用于LED照明设备

    公开(公告)号:WO2015069808A1

    公开(公告)日:2015-05-14

    申请号:PCT/US2014/064183

    申请日:2014-11-05

    Abstract: Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

    Abstract translation: 公开了用于制造使用可附着有SMD的金属导体的柔性层叠电路板的技术。 可以将导电金属条层压以形成柔性基板,然后可以穿过金属条以放置LED封装引线。 LED封装可以使用焊料或导电环氧树脂附着到导电条,并且上层叠层可以包括暴露金属条的部分以穿过LED封装的穿孔。 或者,可以通过将LED封装连接到导电条上来制造LED封装串,并且这些串可以层压在柔性片之间以形成层压LED电路。 塑料外壳可能有助于将LED封装连接到导电条上。 塑料外壳和/或层压片可以由反射材料制成。

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