公开(公告)号：EP2453726A1

公开(公告)日：2012-05-16

申请号：EP11192441.1

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a2) of preparing a base material including an electrode (22) for connection using an adhesive (30) and an electrode (26) for connection using solder (50); a step (b2) of covering only the electrode (26) for connection using solder with an organic film (15) formed by OSP treatment or a noble metal plating film, the electrode for connection using solder being arranged on the base material; a step (c2) of joining the electrode (26) for connection using solder to a connection conductor (42) using solder by solder reflow treatment in a non-oxidizing atmosphere; and after the step (c2), a step (d2) of bonding the electrode (22) for connection using an adhesive to a connection conductor (12) with an adhesive (30) mainly containing a thermosetting resin to establish electrical connection.

Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂（30）连接的电极（22）和用于使用焊料（50）连接的电极（26）的基材的步骤（a2）。 仅使用焊料与OSP处理形成的有机膜（15）或贵金属电镀膜覆盖用于连接的电极（26）的工序（b2），使用焊料的连接用电极配置在基材上; 在非氧化气氛中通过焊料回流处理使用焊料将用于使用焊料连接的电极（26）连接到连接导体（42）的步骤（c2） 在步骤（c2）之后，用主要包含热固性树脂的粘合剂（30）将用粘合剂连接的电极（22）与连接导体（12）接合以建立电连接的步骤（d2）。

公开(公告)号：EP2377903A1

公开(公告)日：2011-10-19

申请号：EP09834689.3

申请日：2009-12-03

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： TOSHIOKA, Hideaki ,  OKUDA, Yasuhiro

IPC: C09J7/00 ,  C09J11/04 ,  C09J133/14 ,  C09J163/00 ,  C09J171/10 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01L21/52 ,  H01L21/60

CPC classification number: C09J171/00 ,  C08G2650/40 ,  C08G2650/56 ,  C08L33/068 ,  C08L63/00 ,  C08L71/00 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/068 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0248 ,  H05K2203/104 ,  Y10T428/24174 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.

Abstract translation: 提供了具有高柔性和高粘合强度并且易于通过混合制备的胶粘剂。 膜粘合剂作为必要成分含有分子量为30,000以上的双酚A苯氧基树脂，分子量为500以下的环氧树脂，甲基丙烯酸缩水甘油酯共聚物，橡胶改性环氧树脂和潜在的 硬化剂。 优选地，每环氧当量的甲基丙烯酸缩水甘油酯共聚物的重量为1000以下。

公开(公告)号：EP2191043A4

公开(公告)日：2011-09-28

申请号：EP08798196

申请日：2008-08-19

Applicant: SHOCKING TECHNOLOGIES INC

Inventor： KOSOWSKY LEX ,  FLEMING ROBERT ,  WU JUNJUN

IPC: H05K1/02 ,  H01C7/10

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

公开(公告)号：EP2229041A1

公开(公告)日：2010-09-15

申请号：EP10250424.8

申请日：2010-03-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Kariya, Ayao ,  Satou, Katsuhiro ,  Okuda, Yasuhiro

IPC: H05K3/32

CPC classification number: H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract translation: 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13电连接，多个第二电极22和23彼此相邻设置 第二板21通过包含导电颗粒31并具有各向异性导电性的粘合剂30。 通过加热和压制相互面对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

公开(公告)号：EP2122050A2

公开(公告)日：2009-11-25

申请号：EP08713082.9

申请日：2008-01-09

Applicant: Siemens Energy, Inc.

Inventor： STEVENS, Gary ,  SMITH, James D.B. ,  WOOD, John W.

IPC: D21H17/13 ,  D21H17/62 ,  H01L21/316 ,  H02K3/40 ,  H05K1/03

CPC classification number: D21H25/005 ,  D21H13/44 ,  D21H17/13 ,  D21H17/20 ,  D21H27/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249953

Abstract: A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.

公开(公告)号：EP2001941A1

公开(公告)日：2008-12-17

申请号：EP07748819.5

申请日：2007-01-03

Applicant: Siemens Energy, Inc.

Inventor： SMITH, James D.B. ,  STEVENS, Gary ,  WOOD, John W.

IPC: C08K3/00 ,  C08K9/00

CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，该方法包括将HTC晶种42添加到主体树脂基质中。 HTC种子已被表面官能化而不会彼此实质性反应。 种子然后积累HTC积木42，并且HTC积木也已经被表面官能化以基本上不彼此反应。 然后将HTC构建块与HTC种子组装以在宿主树脂基质内生产HTC树枝状填充剂40。

公开(公告)号：EP1926784A2

公开(公告)日：2008-06-04

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP0873047B1

公开(公告)日：2008-02-13

申请号：EP98106742.4

申请日：1998-04-14

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Kobayashi, Kazuhito ,  Kumashiro, Yasushi ,  Takahashi, Atsushi ,  Morita, Koji ,  Tanabe, Takahiro ,  Yamamoto, Kazunori ,  Nakaso, Akishi ,  Arike, Shigeharu ,  Otsuka, Kazuhisa ,  Urasaki, Naoyuki ,  Fujimoto, Daisuke ,  Takano, Nozomu

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

公开(公告)号：EP1672969A1

公开(公告)日：2006-06-21

申请号：EP04792343.8

申请日：2004-10-06

Applicant: Neomax Materials Co., Ltd.

Inventor： KIKUI, Fumiaki ,  MORISHITA, Akio ,  YASUOKA, Masato

IPC: H05K1/05

CPC classification number: H05K1/056 ,  H05K1/053 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.

Abstract translation: 根据本发明的基板包括金属板和绝缘膜，其设置在金属板的表面上并且包括针状氧化铝颗粒和颗粒状颗粒。 本发明的基材具有优异的绝缘性，可以在工业上以可接受的效率制造。

公开(公告)号：EP0633295A1

公开(公告)日：1995-01-11

申请号：EP94905218.7

申请日：1994-01-27

Applicant: OTSUKA KAGAKU KABUSHIKI KAISHA

Inventor： TASAKA, Takio, 332-9, Aza Hachikitakaitaku ,  MONDE, Hiroyuki, Mezondofurora 505

IPC: C08L101/00 ,  C08K7/04

CPC classification number: C08K7/08 ,  C08K7/10 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO₂ as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

Abstract translation: 本发明的目的在于提供一种作为电气电子设备用电路基板材料的电子部件用树脂组合物，其介电常数低，介电损耗因数低，耐热性高。 该树脂由热塑性树脂或热固性树脂组成，硅灰石或云母石，以CaO.SiO 2为主要成分的纤维材料，以与树脂混合的增强纤维为基准，混合比例为5-60％ 树脂和纤维。