公开(公告)号：WO01069999A1

公开(公告)日：2001-09-20

申请号：PCT/SE2001/000105

申请日：2001-01-22

IPC: B41F17/34 ,  H05K1/00 ,  H05K3/12 ,  H05K9/00

CPC classification number: H05K9/0092 ,  H05K1/0284 ,  H05K3/1275 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2203/0113 ,  H05K2203/0534

Abstract: The invention concerns a method for printing of a conductive coating on an electronic unit (22) by means of tampon printing. During the tampon printing phase a tampon pad (1, 15) is moving in small movements in one or more directions in relation to the electronic unit. The movements are made at the same time as the tampon pad (1, 15) is in contact with the surface to be printed.

Abstract translation: 本发明涉及通过棉塞印刷在电子单元（22）上印刷导电涂层的方法。 在棉塞印刷阶段期间，棉塞垫（1,15）相对于电子单元在一个或多个方向上以小的运动移动。 在棉塞垫（1,15）与要印刷的表面接触的同时进行移动。

公开(公告)号：WO01039583A1

公开(公告)日：2001-06-07

申请号：PCT/SE2000/002407

申请日：2000-12-01

IPC: H01R12/71 ,  H05K1/00 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/147 ,  H01R12/716 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/10189

Abstract: A slanted connector and a method for mounting the same, having first connector means (20) extended in a first direction and second connector means (29a-c) extended in a slanted direction in relation to the first connector means (20).According to the invention the slanted connector comprises a first part (2) comprising the first connector means (20) and a second part (21a-e) comprising the second connector means (29a-c). The second part (21a-e) is connectable to the first connector means (20) and has a bent form in order to engage the first connector means (20) in a first direction and provide the second connector means (29a-c) protruding in at least one second direction slanted to the first direction, the second part (21a-e) having a circuit pattern to connect the first connector means (20) to the second connector means (29a-c).

Abstract translation: 一种倾斜连接器及其安装方法，具有沿第一方向延伸的第一连接器装置（20）和相对于第一连接器装置（20）沿倾斜方向延伸的第二连接器装置（29a-c）。根据 本发明的倾斜连接器包括包括第一连接器装置（20）的第一部分（2）和包括第二连接器装置（29a-c）的第二部分（21a-e）。 第二部分（21a-e）可连接到第一连接器装置（20）并且具有弯曲形式，以便沿第一方向接合第一连接器装置（20），并且提供第二连接器装置（29a-c）突出 在朝向第一方向倾斜的至少一个第二方向上，第二部分（21a-e）具有将第一连接器装置（20）连接到第二连接器装置（29a-c）的电路图案。

公开(公告)号：WO00072378A1

公开(公告)日：2000-11-30

申请号：PCT/DE2000/001497

申请日：2000-05-11

IPC: H01L21/60 ,  H01L23/13 ,  H05K3/34 ,  H01L23/498

CPC classification number: H01L23/13 ,  B29L2031/3493 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2201/09845 ,  Y02P70/613 ,  H01L2924/00

Abstract: A substrate (S) with at least two metallized polymer bumps (PS), especially a polymer stud grid array, is configured in such a way that the polymer bumps (PS) have at least one step (ST) and at least one elevation (E). The geometry of the solder bumps (PS) ensures that the soldered connections to the wiring (V) are secure and guarantees reproducible layer thickness for the solder (L).

Abstract translation: 的基板（S）具有至少两个金属化的聚合物柱（PS），特别是形成聚合物螺柱栅阵列，以便具有至少一个级（ST）和至少一个增加（E）的聚合物螺柱（PS）。 焊料凸块（PS）的这种几何形状确保了与焊料（L）的布线（V）和可再现的层厚度可靠焊点。

公开(公告)号：WO99058373A1

公开(公告)日：1999-11-18

申请号：PCT/US1999/009754

申请日：1999-05-04

IPC: B60R16/02 ,  B60R16/023 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/18 ,  H05K3/36

CPC classification number: B60R16/0238 ,  H05K1/095 ,  H05K1/119 ,  H05K1/144 ,  H05K3/182 ,  H05K3/368 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2203/0113 ,  Y10S439/949

Abstract: An electrical junction box has a first insulating polymeric portion and a second polymeric portion defining multiple electrically conductive circuits. The circuits are at least partially separated by the first insulating polymeric portion and at least some of the circuits electrically connect together wire harness connector portions. A further aspect of the present invention junction box causes a section of the first insulating polymeric portion to concurrently act as a segment of an outer protective cover for the junction box.

Abstract translation: 电接线盒具有限定多个导电电路的第一绝缘聚合物部分和第二聚合物部分。 电路至少部分地由第一绝缘聚合物部分分开，并且至少一些电路将线束连接器部分电连接在一起。 本发明接线盒的另一方面使得第一绝缘聚合物部分的一部分同时作为用于接线盒的外部保护盖的部分。

公开(公告)号：WO99056517A1

公开(公告)日：1999-11-04

申请号：PCT/SE1999/000685

申请日：1999-04-27

IPC: G12B17/02 ,  H05K1/00 ,  H05K1/09 ,  H05K3/12 ,  H05K9/00

CPC classification number: H05K9/0092 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1275 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2203/0534

Abstract: The invention relates to an electrically conductive unit (1) extending by means of electrically conductive paths (10, 29), which are directly or indirectly applied onto a case (2), for creating a screening against electromagnetic radiation and/or for the draining of electrical currents.

Abstract translation: 本发明涉及通过直接或间接地施加到壳体（2）上的导电路径（10,29）延伸的导电单元（1），用于产生对电磁辐射的屏蔽和/或排水 的电流。

公开(公告)号：WO98041070A1

公开(公告)日：1998-09-17

申请号：PCT/EP1998/001188

申请日：1998-03-03

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/02 ,  H05K3/08 ,  H05K3/24 ,  H05K3/28

CPC classification number: H01L21/4846 ,  H01L21/4853 ,  H01L2924/15159 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/135 ,  H05K2203/175

Abstract: Metallization is initially applied to a support to form metal conductor models with solderable and/or bondable connection areas (CA1, LA1) on electrically insulating supports (U1) and subsequently removed at least from areas adjacent to the desired conductor model. Galvanic deposition of a solderable and/or bondable terminal surface (E) on the connection areas (CA1; LA1) is conducted thereafter. The method does not require clean rooms.

Abstract translation: 有关电绝缘性基材形成具有可焊接和/或粘合的连接区域（CA1，LA1）金属导体图案（U1）的金属化首先被施加到基底上并至少在邻近期望的导体图案的区域再次除去。 现在，可焊接和/或粘合的端部表面的电沉积发生（E）到Anschlussereiche（CA1; LA1）。 洁净室条件不是必需的。

公开(公告)号：WO1997042799A1

公开(公告)日：1997-11-13

申请号：PCT/GB1997001180

申请日：1997-05-01

Applicant: FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED

Inventor： FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED ,  TODD, Michael, George ,  SINKUNAS, Peter, Joseph ,  GLOVATSKY, Andrew, Zachary

IPC: H05K03/46

CPC classification number: H05K3/462 ,  H01L2924/1515 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10666 ,  H05K2203/167 ,  Y10S438/977

Abstract: A three-dimensional multi-layer moulded electronic device and method for manufacturing same, wherein the device comprises at least two moulded, three-dimensional substrates (12, 14) having mating surfaces (20, 22), each substrate including a layer (16, 18) of patterned conductive material on at least one surface and electrically conductive vias (24, 26) at selected locations of the substrate for interconnection of the conductive layers (16, 18), wherein the substrates (20, 22) are electrically joined at their mating surfaces and the circuit layers (16, 18) are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include moulded-in structural features.

Abstract translation: 一种三维多层成型电子器件及其制造方法，其中该器件包括具有配合表面（20,22）的至少两个模制的三维衬底（12,14），每个衬底包括一层（16 ，18）在至少一个表面上的图案化导电材料，以及在所述衬底的选定位置处的导电通孔（24,26），用于导电层（16,18）的互连，其中所述衬底（20,22）电连接 在它们的配合表面和电路层（16,18）被对准和互连以形成多层三维电路，其可以包括模制的结构特征。

公开(公告)号：WO1996016796A1

公开(公告)日：1996-06-06

申请号：PCT/US1995016044

申请日：1995-11-30

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  CROTZER, David, R. ,  DEAN, Gregory, E.

IPC: B32B03/00

CPC classification number: H01H1/06 ,  H01H1/60 ,  H05K3/102 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/023 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/095 ,  H05K2203/1168 ,  H05K2203/1344 ,  Y10S439/931 ,  Y10T428/24917

Abstract: The present invention comprises an electrical contact (84) having solid homogeneous conductive particles on the contact (84) surface. The particles are of greater hardness than that of the contact (84) material to deform the contact (84) material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact (84) surface by a technique which results in the particles being intimately bonded to the contact (84) surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact (84) surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact (84) material.

Abstract translation: 本发明包括在接触（84）表面上具有固体均匀导电颗粒的电接触（84）。 颗粒的硬度大于接触材料（84）的硬度，使接触材料（84）材料变形，并引起氧化物或其它污染层的破裂或断裂，或穿透污染层。 颗粒通过导致颗粒紧密结合到接触（84）表面的技术施加到接触（84）表面，通常作为一层颗粒。 用于这种颗粒应用的优选技术是超高速氧燃料喷射（HVOF）或等离子体喷涂，通过该喷涂将颗粒嵌入在接触（84）表面上，以在施加的颗粒和接触（84）材料之间提供基本上永久的颗粒间粘合 。

公开(公告)号：WO1996003851A1

公开(公告)日：1996-02-08

申请号：PCT/US1995009224

申请日：1995-07-21

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： MINNESOTA MINING AND MANUFACTURING COMPANY ,  BIERNATH, Rolf, W.

IPC: H05K03/04

CPC classification number: H01R13/035 ,  H01R13/03 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/045 ,  H05K3/107 ,  H05K3/326 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2203/025

Abstract: A process for selective metalization for electrically isolating areas of a substrate (40) is disclosed. The process employs placing microridges (60) onto a surface (42), the microridge (60) protruding from the plane formed by the surface (42). The surface (42), including the microridge (60), is then metalized (66) and a portion of the metalized microridge (60) beyond the surface plane (42) is removed. This removal process creates electrically isolated areas (68) without affecting the integrity of the substrate (40).

Abstract translation: 公开了用于电隔离衬底（40）的区域的选择性金属化的方法。 该方法采用将微脊（60）放置在表面（42）上，微脊（60）从由表面（42）形成的平面突出。 然后，包括微环（60）的表面（42）被金属化（66），并且去除超过表面平面（42）的金属化微波（60）的一部分。 该去除工艺在不影响衬底（40）的完整性的情况下产生电隔离区域（68）。

公开(公告)号：WO1989005066A1

公开(公告)日：1989-06-01

申请号：PCT/US1988003586

申请日：1988-10-17

Applicant: MOTOROLA, INC.

Inventor： MOTOROLA, INC. ,  URBISH, Glenn, F. ,  MCKEE, John, M. ,  MCKINLEY, Martin, J. ,  SUPPLESA, Anthony, B.

IPC: H04B01/08

CPC classification number: H04B1/08 ,  H05K1/0278 ,  H05K1/119 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: This invention pertains to housings for electronic devices, and more particularly, to a molded housing for a radio receiver. Typical prior art housings require a large number of individual parts, and the variety of manufacturing processes and materials necessary to manufacture these parts elevates manufacturing costs. To reduce the total number of individual parts, the present invention comprises a molded thermoplastic housing (100) including a base (102) and cover (104) members joined by a living hinge (106). Solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (120 and 122). The printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge.

Abstract translation: 本发明涉及用于电子设备的壳体，更具体地，涉及用于无线电接收器的模制外壳。 典型的现有技术外壳需要大量的单独部件，并且制造这些部件所需的各种制造工艺和材料提高了制造成本。 为了减少单个部件的总数，本发明包括模制的热塑性壳体（100），其包括基座（102）和由活动铰链（106）连接的盖子（104）。 可焊接印刷电路图案（112,114,116和118）被真空沉积到两个壳体构件的内表面和外表面上。 基座和盖构件的相对表面上的印刷电路图案通过导电通孔（120和122）连接。 底座和盖构件的内表面上的印刷电路图案通过真空沉积到活动铰链上的互连印刷电路图案（124）连接起来。