公开(公告)号：US07812489B2

公开(公告)日：2010-10-12

申请号：US12030272

申请日：2008-02-13

Applicant: Toshifumi Hino ,  Nobuhiko Sato

Inventor： Toshifumi Hino ,  Nobuhiko Sato

IPC: H02K5/22 ,  H02K3/50

CPC classification number: H05K3/445 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K3/0061 ,  H05K3/306 ,  H05K3/3421 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10287

Abstract: The present invention provides a motor that enables a lead of a coil to be appropriately led through holes, while allowing the lead of the coil to be fixed without contacting a wall surface of the hole in a base. Cuts 14b are formed in an insulating sheet or a printed circuit board 14; the cuts 14b extend substantially radially or spirally from a lead lead-out portion 14a as a center. Thus, even if an end of the lead 7a abuts against an area located outside the lead lead-out portion 14a, the abutting area and a nearby area located in the vicinity of the abutting area are pushed open along the cuts 14b extending from the lead lead-out portion 14a and guide the end of the lead 7a toward the lead lead-out portion 14a. The end of the lead 7a is thus appropriately guided into the lead lead-out portion 14a.

Abstract translation: 本发明提供一种电动机，其能够使线圈的引线适当地引导通孔，同时允许线圈的引线固定而不接触基座中的孔的壁表面。 切屑14b形成在绝缘片或印刷电路板14中; 切口14b从作为中心的引出引出部分14a基本上径向或螺旋地延伸。 因此，即使引线7a的端部与引线引出部分14a的外侧的区域抵接，位于邻接区域附近的邻接区域和附近区域也沿着从引线延伸的切口14b被推开 引出部分14a并且引导引线7a的端部朝向引线引出部分14a。 引线7a的端部被适当地引导到引出引出部分14a中。

公开(公告)号：US07811856B2

公开(公告)日：2010-10-12

申请号：US12487330

申请日：2009-06-18

Applicant: Tatsuhiro Urushido

Inventor： Tatsuhiro Urushido

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/4985 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/189 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base substrate; forming a eutectic alloy by contacting the wiring with the electrode and by heating and pressurizing, and; forming the eutectic alloy so as a part of the eutectic alloy enters between the wiring and the base substrate.

Abstract translation: 一种制造半导体器件的方法，包括：将具有电极的半导体芯片安装在具有基底基板和形成在基底基板上的布线的布线基板上; 通过使布线与电极接触并通过加热和加压来形成共晶合金; 形成共晶合金，使得共晶合金的一部分进入布线和基底之间。

公开(公告)号：US20100203747A1

公开(公告)日：2010-08-12

申请号：US12576252

申请日：2009-10-09

Applicant: NAN HU ,  HAN-MING ZHANG

Inventor： NAN HU ,  HAN-MING ZHANG

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R12/7076 ,  H01R12/772 ,  H05K1/118 ,  H05K1/189 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10189 ,  H05K2201/10393

Abstract: A flexible printed circuit board (20) for electrically connecting an insulator substrate (21) and a plurality of elongate conductors (21a) laminated over the insulator substrate by an upper layer. The conductor has a contact engaging portion (211a) exposed over the insulator substrate at end thereof. The contact engaging portion (211a) defines an embossed portion (212) for engaging against the mating component.

Abstract translation: 一种柔性印刷电路板（20），用于通过上层电绝缘基板（21）和层压在绝缘体基板上的多个细长导体（21a）电连接。 导体具有在绝缘体基板的端部露出的接触接合部分（211a）。 接触接合部分（211a）限定用于与配合部件接合的压花部分（212）。

公开(公告)号：US20100112284A1

公开(公告)日：2010-05-06

申请号：US12691782

申请日：2010-01-22

Applicant: Yuichi IIDA ,  Osamu CHIKAGAWA

Inventor： Yuichi IIDA ,  Osamu CHIKAGAWA

IPC: B32B3/10 ,  B32B3/00 ,  B29C65/02 ,  B29C65/56

CPC classification number: H05K1/186 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/091 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T156/1002 ,  Y10T428/24322 ,  Y10T428/24612 ,  Y10T428/24926 ,  Y10T428/24942

Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

Abstract translation: 层压体包括基材层和设置在其间的层间约束层。 所述基材层由包含玻璃材料和第一陶瓷材料的第一粉末的烧结体形成，所述中间层约束层包括第二粉末，所述第二粉末包括在用于熔化所述玻璃的温度下不被烧结的第二陶瓷材料 并且处于这样的状态，即第二粉末通过在烘烤时包含在基材层中的包含玻璃材料的第一粉末的一部分的扩散或流动而粘附在一起。 所引入的元件处于其整个外围被层间限制层覆盖的状态。

公开(公告)号：US07703889B2

公开(公告)日：2010-04-27

申请号：US11113459

申请日：2005-04-25

Applicant: Hirosumi Ito

Inventor： Hirosumi Ito

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/05

CPC classification number: H05K3/4007 ,  B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/0058 ,  H05K3/321 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10977 ,  H05K2203/0195

Abstract: There is disclosed a printed wiring board comprising: an electrically insulating flexible layer which has on one of its opposite sides a protrusion which forms a corresponding recess on the other side of the flexible layer; an electrically conducting layer formed on the protrusion; and a wire formed on the flexible layer, connected to the conducting layer, and extending in a direction. The conducting layer has a shape long in the direction of extension of the wire.

Abstract translation: 公开了一种印刷电路板，包括：电绝缘柔性层，其在其相对侧的一侧上具有在柔性层的另一侧上形成相应凹部的突起; 形成在所述突起上的导电层; 以及形成在柔性层上的导线，连接到导电层并沿一个方向延伸。 导电层具有沿导线延伸方向长的形状。

公开(公告)号：US20100092742A1

公开(公告)日：2010-04-15

申请号：US12635782

申请日：2009-12-11

Applicant: Osamu CHIKAGAWA

Inventor： Osamu CHIKAGAWA

IPC: B32B18/00

CPC classification number: H05K1/186 ,  B32B18/00 ,  C04B35/632 ,  C04B35/634 ,  C04B35/63404 ,  C04B35/653 ,  C04B37/008 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/656 ,  C04B2235/6583 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/091 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T428/24926

Abstract: In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.

Abstract translation: 在制造陶瓷多层基板的方法中，当通过堆叠多个陶瓷生片制备的生坯陶瓷堆叠与设置在生陶瓷堆叠内的陶瓷芯片电子部件同时烧制并且包括外部端子电极以制造陶瓷多层基板 内部具有陶瓷芯片电子部件的基板，预先在陶瓷芯片电子部件和绿色陶瓷叠层之间设置糊状层，将其烧成。

公开(公告)号：US07649715B2

公开(公告)日：2010-01-19

申请号：US11553892

申请日：2006-10-27

Applicant: Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

Inventor： Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

IPC: G11B5/58

CPC classification number: H05K3/3442 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/189 ,  H05K3/326 ,  H05K3/3494 ,  H05K2201/091 ,  H05K2201/10727 ,  H05K2203/107 ,  Y02P70/613

Abstract: A magnetic head assembly is provided. The magnetic head assembly includes a slider in which a head element is mounted. A flexure supports the slider. The flexure includes a pair of outriggers, a connection portion, and a tongue portion. A flexible wiring substrate is fixedly bonded to the surface of the flexure. An electrode pad of the slider and an electrode pad of the flexible wiring substrate are bonded to each other by solder. A plurality of solder bonded portions are arranged on the connection portion. A deformable portion is formed in the pair of outriggers and located on an extended line on which the solder bonded portions are arranged, so that the free end side of the flexure is deformable.

Abstract translation: 提供磁头组件。 磁头组件包括其中安装有头元件的滑块。 挠性件支撑滑块。 挠曲件包括一对外伸支架，连接部分和舌部。 柔性布线基板固定地粘合到挠曲件的表面上。 滑块的电极焊盘和柔性布线基板的电极焊盘通过焊料彼此接合。 多个焊接接合部分布置在连接部分上。 可变形部分形成在该对外伸支架中并且位于其上布置焊料接合部分的延伸线上，使得挠曲件的自由端侧可变形。

公开(公告)号：US20090314524A1

公开(公告)日：2009-12-24

申请号：US12549289

申请日：2009-08-27

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H05K1/02 ,  B32B15/04

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

Abstract translation: 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US20090273925A1

公开(公告)日：2009-11-05

申请号：US12499171

申请日：2009-07-08

Applicant: John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

Inventor： John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

IPC: F21S4/00 ,  H01L33/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。

公开(公告)号：US07491892B2

公开(公告)日：2009-02-17

申请号：US10402087

申请日：2003-03-28

Applicant: Sigurd Wagner ,  Stephanie Perichon Lacour ,  Zhigang Suo

Inventor： Sigurd Wagner ,  Stephanie Perichon Lacour ,  Zhigang Suo

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2203/0271

Abstract: The present invention relates to stretchable interconnects which can be made in various geometric configurations, depending on the intended application. The stretchable interconnects can be formed of an electrically conducting film or an elastomer material to provide elastic properties in which the interconnects can be reversibly stretched in order to stretch and relax the elastomer material to its original configuration. Alternatively, stretchable interconnects can be formed of an electrically conducting film or a plastic material to provide stretching of the material to a stretched position and retaining the stretched configuration. The stretchable interconnect can be formed of a flat 2-dimensional conductive film covering an elastomeric or plastic substrate. When this structure is stretched in one or two dimensions, it retains electrical conduction in both dimensions. Alternatively, the stretchable and/or elastic interconnects can be formed of a film or stripe that is formed on an elastomeric or plastic substrate such that it is buckled randomly, or organized in waves with long-range periodicity. The buckling or waves can be induced by various techniques, including: release of built-in stress of the conductive film or conductive stripe; pre-stretching the substrate prior to the fabrication of the conductive film or conductive stripe; and patterning of the surface of the substrate prior to the fabrication of the metal film. The stretchable interconnect can be formed of a plurality of conductive films or conductive stripes embedded between a plurality of layers of a substrate formed of an elastomer or plastic.

Abstract translation: 本发明涉及根据预期应用可以制成各种几何构型的可拉伸互连。 可拉伸互连可以由导电膜或弹性体材料形成，以提供弹性，其中互连可以可逆地拉伸，以便将弹性体材料拉伸和松弛到其初始构型。 或者，可拉伸互连可以由导电膜或塑料材料形成，以将材料拉伸到拉伸位置并保持拉伸构型。 可拉伸互连可以由覆盖弹性体或塑料基底的平坦的二维导电膜形成。 当这种结构在一个或两个维度上被拉伸时，它在两个维度上保持电传导。 或者，可拉伸和/或弹性互连可以由形成在弹性体或塑料基底上的膜或条形成，使得其随机弯曲，或以具有远程周期性的波浪组织。 屈曲或波浪可以通过各种技术引起，包括：释放导电膜或导电条纹的内在应力; 在制造导电膜或导电条之前预拉伸基板; 以及在制造金属膜之前对衬底的表面进行图案化。 可拉伸互连可以由嵌入在由弹性体或塑料形成的基底的多个层之间的多个导电膜或导电条形成。