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公开(公告)号：KR1020150007469A
公开(公告)日：2015-01-21
申请号：KR1020130081423
申请日：2013-07-11
Applicant: (주)큐엠씨
CPC classification number: H01L2224/48091 , H01L2924/181 , H01L33/502 , H01L33/56 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
Abstract: 실시예에 따른 발광소자 제조방법 및 장비는, 패키지에 추가할 합성수지(발광물질이 포함된 합성수지)의 양을 산출하고, 산출된 양의 합성수지를 추가 주입하여 색좌표를 보정한 후, 합성수지의 발광물질을 침전시키므로 목표하는 색좌표를 만족하는 발광소자를 고수율로 제조할 수 있다.
Abstract translation: 根据本发明的实施方式的发光装置的制造方法和设备，由于计算添加到包装中的合成树脂的量，并且将合成树脂的计算量另外注入 正确的颜色坐标，并且合成树脂的发光材料沉淀。 因此，可以高产率地制造满足目标色坐标的发光装置。
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公开(公告)号：KR1020140056420A
公开(公告)日：2014-05-12
申请号：KR1020120118857
申请日：2012-10-25
Applicant: (주)큐엠씨
IPC: H01L21/78 , H01L21/301 , H01L21/02 , H01L33/00
Abstract: Disclosed is a chip fixing apparatus for preventing the deviation of a chip divided by a chip package process. The chip fixing apparatus includes a cover part which has a cover which covers the upper part of the chip package and at least one column member which protrudes from the cover to the lower part and touches the chip package; and a pusher which applies a push pressure to the cover.
Abstract translation: 公开了一种芯片定影装置，用于防止由芯片封装处理所划分的芯片偏离。 芯片固定装置包括盖部，盖部覆盖芯片封装体的上部，至少一个列部件从盖部向下部突出并与芯片封装接触; 以及对盖施加推压的推动器。
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公开(公告)号：KR101261266B1
公开(公告)日：2013-05-09
申请号：KR1020100108527
申请日：2010-11-03
IPC: B23K26/38 , B23K26/70 , H01L21/301
Abstract: 레이저를사용하여소재를가공하는레이저가공장치및 이를이용한레이저가공방법에관한것으로, 보다상세하게는공정시간을단축시켜생산성을향상시킬수 있는레이저가공장치및 이를이용한레이저가공방법에관하여개시한다. 본발명은상술한바와같은레이저가공장치를이용한레이저가공방법에있어서, 피더가카세트리프터에장착된웨이퍼카세트에서웨이퍼를인출하여웨이퍼얼라이너로이송하는웨이퍼인출단계; 웨이퍼얼라이너가웨이퍼의양측면을가압하여웨이퍼를정렬시키고, 에지디텍터가작동하여웨이퍼에고정된웨이퍼의외곽형상이미지를검출하는웨이퍼정렬및 에지디텍팅단계; 트랜스퍼암이작동하여에지디텍팅이완료된웨이퍼를워크스테이지로이송하는웨이퍼로딩단계; 및워크스테이지와레이저가공부가동작하여웨이퍼를가공하는웨이퍼가공단계;를포함하는레이저가공방법을제공한다.
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公开(公告)号：KR101200708B1
公开(公告)日：2012-11-20
申请号：KR1020100080154
申请日：2010-08-19
IPC: B23K26/70 , B23K26/04 , B23K26/042
Abstract: 본 발명은 레이저빔 광원; 상기 레이저빔 광원으로부터 방출된 레이저빔을 가공하기 위한 광학유닛; 상기 광학유닛을 통과한 레이저빔이 조사되는 가공대상물을 지지하는 스테이지; 및 상기 광학유닛과 상기 스테이지 사이에 배치되어 상기 광학유닛을 통과한 레이저빔의 일부를 필요에 따라 선택적으로 검출하는 검출유닛을 포함하는 것을 특징으로 하는 레이저 가공장치를 포함한 것을 특징으로 한다. 이에,
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公开(公告)号：KR1020120050256A
公开(公告)日：2012-05-18
申请号：KR1020100111678
申请日：2010-11-10
Abstract: PURPOSE: A laser lift off machine having an image acquisition device and a laser machining method using the same are provided to easily recognize machining processes of each chip by recording the ID of each chip as an index tag in a moving picture file. CONSTITUTION: A laser lift off machine comprises a work stage(200), an inspection camera(110), a process camera(120), and an illuminator(130). A wafer(W) is loaded and fixed on the work stage. The inspection camera is vertically arranged on the work stage in order to prevent the distortion of a wafer image. The process camera is obliquely arranged on one side of a laser beam source and acquires a moving picture during a wafer machining process in a machining area. The illuminator is arranged on the other side of the laser beam source and provides visible light to the machining area.
Abstract translation: 目的：提供一种具有图像采集装置和使用其的激光加工方法的激光剥离机，通过将每个芯片的ID作为索引标签记录在运动图像文件中来容易地识别每个芯片的加工过程。 构成：激光剥离机包括工作台（200），检查照相机（110），处理照相机（120）和照明器（130）。 将晶片（W）装载并固定在工作台上。 检查照相机垂直布置在工作台上，以防止晶片图像的变形。 处理相机倾斜地布置在激光束源的一侧上，并且在加工区域中的晶片加工过程期间获取运动图像。 照明器布置在激光束源的另一侧，并向加工区域提供可见光。
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Patent Agency Ranking
公开(公告)号：KR1020120046957A
公开(公告)日：2012-05-11
申请号：KR1020100108527
申请日：2010-11-03
IPC: B23K26/38 , B23K26/70 , H01L21/301
Abstract: PURPOSE: A laser processing apparatus and method are provided to discharge a completed wafer and lead in the next wafer to be processed while processing a wafer. CONSTITUTION: A laser processing apparatus comprises a cassette lifter, a wafer aligner, an edge detector, a feeder, a work stage(140), a transfer arm, and a laser processing unit. The wafer aligner is formed on the exit side of the cassette lifter. The edge detector detects the outline of a wafer located in the wafer aligner. The feeder lifts a wafer by reciprocating between the cassette lifter and the wafer aligner. The work stage implements three-axis transfer and a z-axis rotation. The transfer arm exchanges wafers placed on the wafer aligner and the work stage. The laser processing unit provides processing laser beams to the work stage.
Abstract translation: 目的：提供一种激光加工设备和方法，以便在处理晶片时，将完成的晶片放电并在待处理的下一晶片中引出。 构成：激光加工装置包括盒式升降机，晶片对准器，边缘检测器，进料器，工作台（140），传送臂和激光处理单元。 晶片对准器形成在盒式升降机的出口侧。 边缘检测器检测位于晶片对准器中的晶片的轮廓。 进料器通过在盒式升降器和晶片对准器之间往复运动来提升晶片。 工作台实现三轴转动和z轴旋转。 转移臂交换放置在晶片对准器和工作台上的晶片。 激光处理单元向工作台提供加工激光束。
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公开(公告)号：KR1020120012590A
公开(公告)日：2012-02-10
申请号：KR1020100074628
申请日：2010-08-02
IPC: B23K26/073 , G02B26/00 , G02B27/09
Abstract: PURPOSE: A processing device using laser is provided to precisely control the position and shape of spot in a substrate by selecting and switching a right group of lens depending on a processing condition. CONSTITUTION: A processing device(1) using laser comprises a laser source(10), a beam shaping module(20), focusing lens(30), and a control unit(50). The laser source generates laser beams. The beam shaping module corrects the divergent angle of the laser beam. The focusing lens collect the laser beam corrected in a target to form spot. The control unit controls the laser source, the beam shaping module, and the focusing lens. The beam shaping module comprises a plurality of switchable groups of lens.
Abstract translation: 目的：提供使用激光的处理装置，通过根据处理条件选择和切换右组透镜来精确地控制基板中的光斑的位置和形状。 构成：使用激光的处理装置（1）包括激光源（10），光束整形模块（20），聚焦透镜（30）和控制单元（50）。 激光源产生激光束。 光束整形模块校正激光束的发散角。 聚焦透镜收集在目标物体中校正的激光束以形成光点。 控制单元控制激光源，光束整形模块和聚焦透镜。 光束整形模块包括多个可切换的透镜组。
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公开(公告)号：KR1020110093301A
公开(公告)日：2011-08-18
申请号：KR1020100013254
申请日：2010-02-12
CPC classification number: G01R31/2887
Abstract: PURPOSE: A rotating device, a rotating driving method, and a rotating system are provided to reduce costs and process time by rotating and translating a rotation member which supports an object. CONSTITUTION: A rotating device(100) includes a rotation member(110), a transmission member(120), and a driver(130). The rotation member is installed in a support frame and includes a holding member which holds an object. The transmission member is connected to the rotation member. The driver is connected to the transmission member. The transmission member changes the rotation movement of the driver into the intermittent rotation and translation of the rotation member.
Abstract translation: 目的：提供旋转装置，旋转驱动方法和旋转系统，以通过旋转和平移支撑物体的旋转构件来降低成本和处理时间。 构成：旋转装置（100）包括旋转构件（110），传动构件（120）和驱动器（130）。 旋转构件安装在支撑框架中并且包括保持物体的保持构件。 传动构件连接到旋转构件。 驱动器连接到传输部件。 传动构件将驾驶员的旋转运动改变为旋转构件的间歇旋转和平移。
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公开(公告)号：KR101035688B1
公开(公告)日：2011-05-19
申请号：KR1020090120519
申请日：2009-12-07
Inventor： 유병소
IPC: H01L33/48
CPC classification number: H01L21/67271 , H01L21/67259 , H01L33/48 , H05K13/0015 , H05K13/08
Abstract: PURPOSE: An LED chip aligning unit and an LED chip classifying device are provided to smoothly test and unload an LED chip by correcting the position of the LED chip loaded on a loading member before and after the LED chip is tested. CONSTITUTION: A supply unit(2) supplies an LED chip to a test position(TP) and includes a loading member(21), a rotating member(22), and a rotating unit(23). The loading member includes a contact member and a first loading body. The rotating member successively positions the loading member at the test position. The rotating unit rotates the rotating member around a rotation axis(22a).
Abstract translation: 目的：提供LED芯片对准单元和LED芯片分选装置，通过在LED芯片测试前后校正装载元件上的LED芯片的位置，平滑地测试和卸载LED芯片。 构成：供电单元（2）向测试位置（TP）供应LED芯片，并包括一个装载构件（21），一个旋转构件（22）和一个旋转单元（23）。 装载构件包括接触构件和第一装载体。 旋转构件将加载构件连续地定位在测试位置。 旋转单元围绕旋转轴线（22a）旋转旋转构件。
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