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    23.
    发明专利
    未知

    公开(公告)号：DE69129523D1

    公开(公告)日：1998-07-09

    申请号：DE69129523

    申请日：1991-09-17

    Applicant: CANON KK

    Inventor： OZAWA KUNITAKA ,  KADOSAWA TSUNEAKI ,  NAKAMURA TAKASHI ,  KOGA EIJI ,  WATANABE HITOSHI

    IPC: G06F9/46 ,  G06F9/48

    Abstract: An information processing system having a memory for storing a plurality of programs executed in a parallel processing manner, an instruction interpretation section for interpreting instructions in the programs, and an instruction execution section for executing the interpreted instructions. Cues for registering the numbers of the steps of the programs to be executed, wherein the numbers of the steps to be executed next are registered in the cues, the number of each step registered in the cues is read out, the processing to be performed in accordance with the step corresponding to the step number read out is interpreted, and instructions are given to the instruction interpretation section according to the content of the step interpreted. The step numbers of other steps to be executed are registered in the cues, and the plurality of programs are executed in parallel based on the order of the cues.

    24.
    发明专利
    未知

    公开(公告)号：DE69223202T2

    公开(公告)日：1998-04-16

    申请号：DE69223202

    申请日：1992-08-28

    Applicant: CANON KK

    Inventor： MORI MAKIKO ,  OZAWA KUNITAKA ,  AMEMIYA MITSUAKI

    IPC: G03F7/20 ,  H01L21/027

    Abstract: In an SOR exposure system for transferring patterns on masks to semiconductor wafers by using SOR light (4) reflected by an X-ray reflecting mirror (9A,9B), a first shutter device (5A,5B) for shielding at least gamma rays and a second shutter device (8A,8B) for shielding X-rays are provided between the SOR ring and the mirror inside a beam port, and an exposure adjustment device (11A,11B) for adjusting the amount of exposure when a circuit pattern on a mask (12A,12B) is transferred to a wafer (13A,13B) is provided between the mirror and the wafer. As a result, the human body can be protected against radiation rays, such as gamma rays, generated from the SOR ring when electrons are injected or when the SOR ring is stopped. Damage to the X-ray reflecting mirror caused by radiation rays is reduced, and stable reflectance of the mirror can be obtained. Maintenance of the SOR exposure system is also made easier.

    26.
    发明专利
    未知

    公开(公告)号：DE68921033T2

    公开(公告)日：1995-06-22

    申请号：DE68921033

    申请日：1989-09-11

    Applicant: CANON KK

    Inventor： MORI MAKIKO ,  OZAWA KUNITAKA ,  UDA KOJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI ,  SAKAMOTO FIJI

    IPC: G03F1/76 ,  G03F7/20 ,  H01L21/027

    Abstract: A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. During the wafer being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed the exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, the thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.

    27.
    发明专利
    未知

    公开(公告)号：DE68921033D1

    公开(公告)日：1995-03-23

    申请号：DE68921033

    申请日：1989-09-11

    Applicant: CANON KK

    Inventor： MORI MAKIKO ,  OZAWA KUNITAKA ,  UDA KOJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI ,  SAKAMOTO FIJI

    IPC: G03F1/76 ,  G03F7/20 ,  H01L21/027

    Abstract: A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. During the wafer being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed the exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, the thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.

    Variable mode facsimile apparatus
    29.
    发明专利
    Variable mode facsimile apparatus 未知

    公开(公告)号：GB2148664A

    公开(公告)日：1985-05-30

    申请号：GB8428040

    申请日：1984-11-06

    Applicant: CANON KK

    Inventor： AYATA NAOKI ,  SAITO SEIJI ,  SUZUKI HIDETOSHI ,  OZAWA KUNITAKA ,  KOUMURA NOBORU ,  KAZUMA KOJI

    IPC: H04N1/04 ,  H04N1/333 ,  H04N1/393 ,  H04N1/50 ,  H04N1/00

    Abstract: A printing apparatus has at least one first recording head and at least one second recording head. These recording heads allow recording in binary and halftone modes, or normal and fine modes. A printing system has at least two recording units. One recording unit has a plurality of recording heads for recording in yellow, cyan and magenta, and the other recording unit has a recording head for recording in black. Upon a signal scanning operation, the printing system is capable of printing a plurality of copies at high speed and with good quality. A change in size of the original does not result in a problem since the apparatus is capable of feeding a recording paper sheet of corresponding size or printing only for a desired length.

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