公开(公告)号：IL288535D0

公开(公告)日：2022-01-01

申请号：IL28853521

申请日：2021-11-29

Applicant: IBM ,  BRONN NICHOLAS T ,  BOGORIN DANIELA F ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE B ,  ORCUTT JASON S

Inventor： BRONN NICHOLAS T ,  BOGORIN DANIELA F ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE B ,  ORCUTT JASON S

IPC: G06N10/00 ,  H01L23/00 ,  H04B10/70

Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.

公开(公告)号：SG11202110013PA

公开(公告)日：2021-10-28

申请号：SG11202110013P

申请日：2020-03-18

Applicant: IBM

Inventor： HART SEAN ,  GAMBETTA JAY ,  GUMANN PATRYK

IPC: G06N10/00 ,  H10N60/01 ,  H10N60/80 ,  H10N69/00

Abstract: A superconducting coupling device includes a resonator structure. The resonator structure has a first end configured to be coupled to a first device and a second end configured to be coupled to a second device. The device further includes an electron system coupled to the resonator structure, and a gate positioned proximal to a portion of the electron system. The electron system and the gate are configured to interrupt the resonator structure at one or more predetermined locations forming a switch. The gate is configured to receive a gate voltage and vary an inductance of the electron system based upon the gate voltage. The varying of the inductance induces the resonator structure to vary a strength of coupling between the first device and the second device.

公开(公告)号：AU2020297857A1

公开(公告)日：2021-10-14

申请号：AU2020297857

申请日：2020-05-21

Applicant: IBM

Inventor： BRONN NICHOLAS ,  BOGORIN DANIELA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE

IPC: G06N10/00 ,  H01L27/18

Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.

公开(公告)号：AU2020296292A1

公开(公告)日：2021-10-14

申请号：AU2020296292

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L23/367

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：CA3143363A1

公开(公告)日：2020-12-24

申请号：CA3143363

申请日：2020-05-21

Applicant: IBM

Inventor： BRONN NICHOLAS ,  BOGORIN DANIELA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE

IPC: G06N10/40 ,  G06N10/70 ,  H01L27/18

Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.

公开(公告)号：CA3135532A1

公开(公告)日：2020-10-08

申请号：CA3135532

申请日：2020-03-19

Applicant: IBM

Inventor： HART SEAN ,  GUMANN PATRYK

Abstract: A superconducting coupling device includes a resonator structure. The resonator structure has a first end configured to be coupled to a first device and a second end configured to be coupled to a second device. A gate is positioned proximal to a portion of the resonator structure. The gate is configured to receive a gate voltage and vary a kinetic inductance of the portion of the resonator based upon the gate voltage. The varying of the kinetic inductance induces the resonator structure to vary a strength of coupling between the first superconducting device and the second superconducting device.

公开(公告)号：AU2021417883B2

公开(公告)日：2025-01-30

申请号：AU2021417883

申请日：2021-12-30

Applicant: IBM

Inventor： GUMANN PATRYK ,  GRENDANIN VALERIO ,  HART SEAN ,  MCKAY DAVID ,  CHOW JERRY ,  ZARSKY DAVID ,  BAUER GILBERT

IPC: F25D19/00 ,  F25B9/10 ,  F25B9/12 ,  F25B9/14

Abstract: A cryostat (100), comprising: a thermal shield (210) extending between a thermal stage (141) and a base structure (160) coupled to a bottom plate (116) of an outer vacuum chamber (110), the thermal stage (141) coupled to a top plate (114) of the outer vacuum chamber (110), the thermal shield (210) providing access to a sample mounting surface (430) encompassed within the thermal shield (210) from a region external to the outer vacuum chamber (110) via the top and bottom plates (114, 116) of the outer vacuum chamber (110).

公开(公告)号：IL288973B2

公开(公告)日：2025-01-01

申请号：IL28897321

申请日：2021-12-13

Applicant: IBM ,  BRONN NICHOLAS ,  BOGORIN DANIELA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE

Inventor： BRONN NICHOLAS ,  BOGORIN DANIELA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE

IPC: G06N10/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H04B10/90

Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.

公开(公告)号：AU2020296292B2

公开(公告)日：2022-10-13

申请号：AU2020296292

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L23/367

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：IL288977D0

公开(公告)日：2022-02-01

申请号：IL28897721

申请日：2021-12-13

Applicant: IBM ,  JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L21/265 ,  H01L23/367 ,  H01L23/44

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.