公开(公告)号：DE69724159D1

公开(公告)日：2003-09-18

申请号：DE69724159

申请日：1997-09-19

Applicant: IBM

Inventor： BIEBUYCK HANS ,  MICHEL BRUNO ,  SCHMID HEINZ

IPC: G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  G03F1/14

Abstract: Optical lithography scheme making use of light coupling structures, and elastomeric light coupling structures in particular. These light coupling structures comprise protruding portions and connecting portions. The protruding elements are designed to be brought into conformal contact with a resist to be exposed such that the light guided into the protruding elements is coupled from there directly into the resist. The lateral shape and size of the protruding elements defines 1:1 the lateral size and shape of small features to be exposed in the resist.

公开(公告)号：AU4944700A

公开(公告)日：2001-01-09

申请号：AU4944700

申请日：2000-06-15

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  KIND HANNES ,  MICHEL BRUNO

IPC: C23C18/18 ,  C23C18/16 ,  H05K3/18

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

公开(公告)号：DE69516528D1

公开(公告)日：2000-05-31

申请号：DE69516528

申请日：1995-08-04

Applicant: IBM

Inventor： BIEBUYCK ANDRE ,  MICHEL BRUNO

IPC: B41K1/02 ,  B41F31/18 ,  B41K1/00 ,  C23F1/00 ,  G03F7/00 ,  H01L21/306 ,  H01L21/768 ,  B41C1/02

Abstract: A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a pattern. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.

公开(公告)号：DE112017001985T5

公开(公告)日：2019-01-03

申请号：DE112017001985

申请日：2017-03-17

Applicant: IBM

Inventor： LOERTSCHER EMANUEL ,  MICHEL BRUNO ,  PAREDES STEPHAN ,  RUCH PATRICK

IPC: H02S40/42

Abstract: Beschrieben sind eine Photovoltaikanlage (1) und eine zugehörige Anlage und ein Verfahren zum Kühlen einer solchen Photovoltaikanlage (1). Die Photovoltaikanlage (1) weist Photovoltaikzellen (10) auf, die nebeneinander angeordnet sind, um ein Feld (5) aus Photovoltaikzellen (10) zu bilden. Ferner beinhaltet diese eine Kühleinheit (20), die eine oder mehrere Schichten (21 bis 23) aufweist, wobei sich die Schichten (21 bis 23) gegenüber dem Feld (5) aus Photovoltaikzellen (10) erstrecken und mit diesem in thermischer Verbindung stehen, um die Zellen (10) im Betrieb zu kühlen. Die eine oder die mehreren Schichten (21 bis 23) sind derart strukturiert, dass ein Wärmewiderstand der Photovoltaikanlage (1) über das Feld (5) aus Photovoltaikzellen (10) variiert, um im Betrieb aus Photovoltaikzellen (10) des Feldes (5) Wärme mit unterschiedlichen Wärmeableitungsraten abzuleiten.

公开(公告)号：DE112011103811B4

公开(公告)日：2015-08-20

申请号：DE112011103811

申请日：2011-11-30

Applicant: IBM

Inventor： MICHEL BRUNO ,  RUCH PATRICK

IPC: F25B17/08 ,  F25B35/04 ,  F28F13/18

Abstract: Verfahren zum Herstellen einer integrierten Adsorptions- und Wärmeaustauschereinheit (20, 30, 45, 52) für ein Festkörpersorptionskühlsystem (1), wobei das Verfahren das Bilden von sowohl einer porösen Adsorptionsstruktur (21, 31, 44, 53), die durchlässig für ein Adsorbat des Systems (1) ist, als auch einer Wärmeaustauscherstruktur (22, 32), die undurchlässig für das Adsorbat ist, für einen Wärmeaustausch mit der porösen Adsorptionsstruktur (21, 31, 44, 53) während des Betriebs des Festkörpersorptionskühlsystems (1), in einem festen Material aufweist und dadurch gekennzeichnet ist, dass das Bilden der Wärmeaustauscherstruktur (22, 32) das Bearbeiten eines Teils des festen Materials beinhaltet, um jenen Teil nicht-porös zu machen.

公开(公告)号：GB2498310B

公开(公告)日：2014-03-12

申请号：GB201307552

申请日：2011-10-21

Applicant: IBM

Inventor： BAROWSKI HARRY ,  HUBER ANDREAS ,  HARRER HUBERT ,  NIGGEMEIER TIM ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

IPC: H01L23/50 ,  H01L23/36

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

公开(公告)号：GB2504503A

公开(公告)日：2014-02-05

申请号：GB201213579

申请日：2012-07-31

Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC

Inventor： ESCHER WERNER ,  GOICOCHEA JAVIER V ,  KHALIL AHMED ,  MICHEL BRUNO ,  ONG CHIN LEE ,  PAREDES STEPHEN

IPC: B01D61/36 ,  B01D3/00 ,  B01D5/00 ,  C02F1/04 ,  C02F1/44

Abstract: A desalination system (1) for producing a distillate from a feed liquid comprises: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam sec­tion (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22) , which are separated by a wall (23). The steam raising device (2), the membrane distillation device (3) and the heat exchange de­vice (4) are implemented such that raw liquid fed into the second liquid section (22) of the heat exchanger-boiler device (4) is heated by brine liquid from the liquid section (6) of the steam raising device (2), such that permeate from the steam section (6) of the steam raising device (2) is condensed in the first steam section (11) of the membrane distillation device (3), thereby heating heated feed liquid from the heat exchange device (4). A method for operating a desalination system is also disclosed. Advantageously the desalination system operates at a reduced total thermal energy consumption.

公开(公告)号：DE602004024585D1

公开(公告)日：2010-01-21

申请号：DE602004024585

申请日：2004-08-23

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  MICHEL BRUNO

IPC: H01L21/768 ,  G03F7/00 ,  H01L21/027

Abstract: A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.

公开(公告)号：DE69724159T2

公开(公告)日：2004-05-06

申请号：DE69724159

申请日：1997-09-19

Applicant: IBM

Inventor： BIEBUYCK HANS ,  MICHEL BRUNO ,  SCHMID HEINZ

IPC: G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  G03F1/14

Abstract: Optical lithography scheme making use of light coupling structures, and elastomeric light coupling structures in particular. These light coupling structures comprise protruding portions and connecting portions. The protruding elements are designed to be brought into conformal contact with a resist to be exposed such that the light guided into the protruding elements is coupled from there directly into the resist. The lateral shape and size of the protruding elements defines 1:1 the lateral size and shape of small features to be exposed in the resist.

公开(公告)号：DE69817329D1

公开(公告)日：2003-09-25

申请号：DE69817329

申请日：1998-06-02

Applicant: IBM

Inventor： BERNARD ANDRE ,  MICHEL BRUNO ,  BIEBUYCK HANS ,  SCHMID HEINZ ,  DELAMARCHE EMMANUEL

IPC: G01N13/02 ,  G01N33/483