公开(公告)号：DE102004048201A1

公开(公告)日：2006-04-13

申请号：DE102004048201

申请日：2004-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  HOSSEINI KHALIL ,  KESSLER ANGELA

IPC: H01L23/10 ,  B82B3/00 ,  C01B31/00 ,  C08J5/24 ,  C09C1/44 ,  C09D5/25 ,  C09J5/06 ,  H01L21/56 ,  H01L21/58

Abstract: A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

公开(公告)号：DE10104267B4

公开(公告)日：2006-04-06

申请号：DE10104267

申请日：2001-01-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED

IPC: C08F132/00 ,  H01L21/58 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H05K1/03

Abstract: An electronic component and a method of producing it, with at least one insulating layer is encompassed by the invention. The insulating layer includes a polymer including norbornene monomers. The polymer retains a double ring structure of the monomer C 7 H 10 while there is breaking of a carbon double bond of the norbornene monomer. This breaking of the carbon double bond is created by a homopolymerization of the monomers to form crosslinked norbornene monomers with polar fluorocarbon bonds.

公开(公告)号：DE102004035368A1

公开(公告)日：2006-02-16

申请号：DE102004035368

申请日：2004-07-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS ,  PRESSEL KLAUS ,  MENGEL MANFRED

IPC: B82B1/00 ,  B82B3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

公开(公告)号：DE10359424A1

公开(公告)日：2005-07-28

申请号：DE10359424

申请日：2003-12-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS

IPC: B82B1/00 ,  H01L23/498 ,  H01L23/50 ,  H01R13/60

Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 mum, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

公开(公告)号：DE102013106438A1

公开(公告)日：2014-01-02

申请号：DE102013106438

申请日：2013-06-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  HAIMERL ALFRED ,  KESSLER ANGELA ,  SCHOBER WOLFGANG

IPC: H01L23/495 ,  H01L21/58 ,  H01L21/60

Abstract: Es ist ein Chipgehäuse (210) vorgesehen, welches aufweist: einen Chipträger (102), einen Chip (104), der über einer Chipträgeroberseite (106) angeordnet ist und elektrisch damit verbunden ist, ein elektrisch isolierendes Material (108), das über dem Chip (104) angeordnet ist und diesen zumindest teilweise umgibt, ein oder mehrere elektrisch leitende Kontaktgebiete (112), die über dem elektrisch isolierenden Material (108) ausgebildet sind und in elektrischer Verbindung mit dem Chip (104) stehen, und ein weiteres elektrisch isolierendes Material (114), das über einer Chipträgerunterseite angeordnet ist, wobei ein elektrisch leitendes Kontaktgebiet (112) auf der Chipträgerunterseite von dem weiteren elektrisch isolierenden Material (114) befreit ist.

公开(公告)号：DE102005005750B4

公开(公告)日：2009-06-04

申请号：DE102005005750

申请日：2005-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: C09J5/00 ,  B29C65/02 ,  B29C70/70 ,  B32B27/08 ,  C08J5/00

公开(公告)号：DE102006056363A1

公开(公告)日：2008-06-05

申请号：DE102006056363

申请日：2006-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/48 ,  H01L25/04

Abstract: A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

公开(公告)号：DE102006045415A1

公开(公告)日：2008-04-03

申请号：DE102006045415

申请日：2006-09-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  HAIMERL ALFRED ,  KESSLER ANGELA ,  MAHLER JOACHIM ,  SCHOBER WOLFGANG

IPC: H01L23/28 ,  H01L23/12

Abstract: The assembly has a carrier (100) e.g. printed circuit board (PCB), and a component e.g. semiconductor component (200), in a housing. A molding material (400) completely surrounds the carrier and the component, and partially surrounds an electrical contact strip (300). The component is superimposed on the carrier that is provided with a hole (500). The electrical contact strip is directly connected with the carrier, and the holes are formed beneath the component. An independent claim is also included for a method for producing a component assembly.

公开(公告)号：DE102004035368B4

公开(公告)日：2007-10-18

申请号：DE102004035368

申请日：2004-07-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS ,  PRESSEL KLAUS ,  MENGEL MANFRED

IPC: H01L23/50 ,  B82B1/00 ,  B82B3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

公开(公告)号：DE102005025083B4

公开(公告)日：2007-05-24

申请号：DE102005025083

申请日：2005-05-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: B32B27/08 ,  B29C70/70 ,  B32B7/04 ,  B32B27/06 ,  C08J5/12 ,  C09J5/10 ,  C09J11/04 ,  H01L23/28

Abstract: Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.