公开(公告)号：DE10319984A1

公开(公告)日：2004-12-09

申请号：DE10319984

申请日：2003-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STOCKEN CHRISTIAN ,  HUBER THOMAS ,  SCHROEDER STEPHAN ,  PROELL MANFRED

IPC: G06F1/20 ,  H01L23/367 ,  H01L23/433 ,  H01L23/34 ,  H01L23/38 ,  H01L25/11 ,  H05K7/20

Abstract: Device for cooling memory modules in a computer, especially a PC, comprises elements for thermally coupling two or more individual memory modules, especially DIMM modules. In particular the device comprises a comb-shaped base body (10) that can connected to a fan if necessary.

公开(公告)号：DE10259300B4

公开(公告)日：2004-10-07

申请号：DE10259300

申请日：2002-12-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STOCKEN CHRISTIAN ,  DOBLER MANFRED

IPC: G11C29/02 ,  G11C29/00

Abstract: Semiconductor component testing method, especially for testing stacked chip modules, has the following steps: writing of a first value to a memory cell of a first semiconductor component; writing of a different value to a memory cell of a second semiconductor component and simultaneous application of a first valve corresponding to the first signal to a pin of the first component and a second value corresponding to the second signal to a pin of the second component. The invention also relates to a corresponding semiconductor test unit and test system.

公开(公告)号：DE10152916A1

公开(公告)日：2003-05-22

申请号：DE10152916

申请日：2001-10-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STOCKEN CHRISTIAN ,  CORDES ERIC ,  WIRTH NORBERT ,  TASKIN NAZIF

IPC: G11C5/00 ,  G06F12/00 ,  G11C8/18

Abstract: The module (52) incorporating an EEPROM, has an information containing unit (56) that contains information relating to the memory module. A memory chip (54) arranged on the memory module has the information containing unit arranged in a distributed way. The information containing unit has flip flops for permanently programming information that relates to operational parameters of the memory module.