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    23.
    发明专利
    未知

    公开(公告)号：DE69819929D1

    公开(公告)日：2003-12-24

    申请号：DE69819929

    申请日：1998-09-18

    Applicant: KLA TENCOR CORP

    Inventor： VAEZ-IRAVANI MEHDI ,  STOKOWSKI STANLEY ,  ZHAO GUOHENG

    IPC: G01N21/956 ,  G01J3/44 ,  G01N21/00 ,  G01N21/21 ,  G01N21/47 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  H01L21/66 ,  G01N21/86 ,  G01B11/24 ,  G01B7/34

    Abstract: A curved mirrored surface (78) is used to collect radiation scattered by a sample surface (76a) and originating from a normal illumination beam (70) and an oblique illumination beam (90). The collected radiation is focused to a detector (80). Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams (70, 90) on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors 78 to restrict detection to certain azimuthal angles.

    DARK FIELD INSPECTION SYSTEM WITH RING ILLUMINATION
    25.
    发明公开
    DARK FIELD INSPECTION SYSTEM WITH RING ILLUMINATION 审中-公开

    公开(公告)号：EP2457251A4

    公开(公告)日：2017-11-08

    申请号：EP10802700

    申请日：2010-07-16

    Applicant: KLA-TENCOR CORP

    Inventor： ZHAO GUOHENG ,  VAEZ-IRAVANI MEHDI ,  YOUNG SCOTT ,  BHASKAR KRIS

    IPC: G01N21/95 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8822

    Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.

    LED SOLAR ILLUMINATOR
    26.
    发明申请
    LED SOLAR ILLUMINATOR 审中-公开
    LED太阳能照明灯

    公开(公告)号：WO2012138460A2

    公开(公告)日：2012-10-11

    申请号：PCT/US2012028910

    申请日：2012-03-13

    Applicant: KLA TENCOR CORP ,  ZHAO GUOHENG ,  LEVY ADY ,  SALNIK ALEX ,  VAEZ-IRAVANI MEHDI ,  NICOLAIDES LENA ,  NGAI SAMUEL S H

    Inventor： ZHAO GUOHENG ,  LEVY ADY ,  SALNIK ALEX ,  VAEZ-IRAVANI MEHDI ,  NICOLAIDES LENA ,  NGAI SAMUEL S H

    IPC: G01N21/01 ,  F21S2/00 ,  F21V8/00 ,  G01R31/26

    CPC classification number: H05B33/0803

    Abstract: An apparatus for illuminating a target surface, the apparatus having a plurality of LED arrays, where each of the arrays has a plurality of individually addressable LEDs, and where at least one of the arrays is disposed at an angle of between about forty-five degrees and about ninety degrees relative to the target surface, where all of the arrays supply light into a light pipe, the light pipe having interior walls made of a reflective material, where light exiting the light pipe illuminates the target surface, and a controller for adjusting an intensity of the individually addressable light sources.

    Abstract translation: 一种用于照射目标表面的装置，该装置具有多个LED阵列，其中每个阵列具有多个独立可寻址的LED，并且其中至少一个阵列以大约四十五度之间的角度设置 并且相对于目标表面大约九十度，其中所有阵列将光提供到光管中，光管具有由反射材料制成的内壁，其中离开光管的光照射目标表面，以及用于调节的控制器 独立寻址光源的强度。

    IN-SITU DIFFERENTIAL SPECTROSCOPY
    27.
    发明申请
    IN-SITU DIFFERENTIAL SPECTROSCOPY 审中-公开
    现场差异光谱

    公开(公告)号：WO2009137706A3

    公开(公告)日：2010-02-25

    申请号：PCT/US2009043185

    申请日：2009-05-07

    Applicant: KLA TENCOR CORP ,  VAEZ-IRAVANI MEHDI ,  NASSER GHODSI MEHRAN ,  ZHAO GUOHENG

    Inventor： VAEZ-IRAVANI MEHDI ,  NASSER GHODSI MEHRAN ,  ZHAO GUOHENG

    IPC: G01J3/00 ,  G01J3/42

    CPC classification number: H01J37/244 ,  G01N2223/079 ,  G01N2223/086 ,  G01N2223/33 ,  H01J37/256 ,  H01J2237/24495 ,  H01J2237/2511 ,  H01J2237/2807

    Abstract: A spectrometer having an electron beam generator for generating an electron beam that is directed at a sample. An electron beam positioner directs the electron beam onto a position of the sample, and thereby produces a secondary emitted stream from the sample, where the secondary emitted stream includes at least one of electrons and x-rays. An secondary emitted stream positioner positions the secondary emitted stream onto a detector array, which receives the secondary emitted stream and detects both the amounts and the received positions of the secondary emitted stream. A modulator modulates the electron beam that is directed onto the sample, and thereby sweeps the electron beam between a first position and a second position on the sample. An extractor is in signal communication with both the modulator and the detector array.

    Abstract translation: 具有用于产生针对样品的电子束的电子束发生器的光谱仪。 电子束定位器将电子束引导到样品的位置，从而产生来自样品的二次发射流，其中二次发射流包括电子和X射线中的至少一个。 二次发射流定位器将二次发射流定位在检测器阵列上，检测器阵列接收二次发射流并检测二次发射流的量和接收位置。 调制器调制被引导到样品上的电子束，从而在样品上的第一位置和第二位置之间扫描电子束。 提取器与调制器和检测器阵列进行信号通信。

    MULTI-SPOT SCANNING SYSTEM AND METHOD
    28.
    发明申请
    MULTI-SPOT SCANNING SYSTEM AND METHOD 审中-公开
    多点扫描系统和方法

    公开(公告)号：WO2009111407A3

    公开(公告)日：2009-11-26

    申请号：PCT/US2009035749

    申请日：2009-03-02

    Applicant: KLA TENCOR CORP ,  ZHAO GUOHENG ,  RUNYON REX ,  VAEZ-IRAVANI MEHDI

    Inventor： ZHAO GUOHENG ,  RUNYON REX ,  VAEZ-IRAVANI MEHDI

    IPC: H01L21/66

    CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2201/10 ,  G01N2201/104 ,  G02B26/123 ,  Y10S359/90

    Abstract: A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes performing a plurality of scan line cycles, wherein each scan line cycle can fill in gaps left by previous scan line cycles. This 'delay and fill' scan allows large spacing between spots, thereby eliminating cross-talk at the detector plane. In one embodiment, the scan is begun and ended outside a desired scan area on the wafer to ensure full scan coverage.

    Abstract translation: 使用在点之间具有预定间隙的点阵列的多点扫描技术可以有利地为大量点提供可缩放性以及消除信道之间的串扰。 多点扫描技术可以为点阵列（1D或2D）选择多个点，确定点之间的分隔以最小化串扰，并且使用点阵列和全视场在晶片上执行扫描（ FOV）。 执行扫描包括执行多个扫描线周期，其中每个扫描线周期可以填充先前扫描线周期留下的间隙。 这种“延迟和填充”扫描允许点之间具有大的间距，从而消除检测器平面处的串扰。 在一个实施例中，扫描在晶片上的期望扫描区域之外开始并结束，以确保全扫描覆盖。

    IN-SITU METALIZATION MONITORING USING EDDY CURRENT MEASUREMENTS AND OPTICAL MEASUREMENTS
    29.
    发明申请
    IN-SITU METALIZATION MONITORING USING EDDY CURRENT MEASUREMENTS AND OPTICAL MEASUREMENTS 审中-公开
    使用EDDY电流测量和光学测量的现场金属化监测

    公开(公告)号：WO0146684A9

    公开(公告)日：2002-05-23

    申请号：PCT/US0035358

    申请日：2000-12-22

    Applicant: KLA TENCOR CORP ,  LEHMAN KURT R ,  LEE SHING M ,  JOHNSON WALT ,  FIELDEN JOHN ,  ZHAO GUOHENG ,  NIKOONAHAD MEHRDAD

    Inventor： LEHMAN KURT R ,  LEE SHING M ,  JOHNSON WALT ,  FIELDEN JOHN ,  ZHAO GUOHENG ,  NIKOONAHAD MEHRDAD

    IPC: G01B7/06 ,  B24B37/013 ,  B24B49/10 ,  G01B7/00 ,  G01B11/06 ,  G01N27/72

    CPC classification number: B24B37/013 ,  B24B49/105 ,  G01N27/72

    Abstract: Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed. Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe.

    Abstract translation: 公开了一种在除去膜的过程中使用涡流探针在原位获取样品的膜的方法。 涡流探头具有至少一个感测线圈。 交流电压被施加到涡流探头的感测线圈上。 当感测线圈靠近样品的膜定位时，在涡流探针的感测线圈中测量一个或多个第一信号。 当感测线圈靠近具有与感测线圈的固定成分和/或距离的参考材料定位时，在涡流探针的感测线圈中测量一个或多个第二信号。 第一信号基于第二信号进行校准，从而校正第一信号内的不期望的增益和/或相位变化。 基于校准的第一信号确定胶片的属性值。 还公开了一种用于执行上述方法的装置。 此外，公开了一种用抛光剂抛光样品并监测样品的化学机械抛光（CMP）系统。 CMP系统包括抛光台，布置成将样品保持在抛光台上的样品载体和涡流探针。

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