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    ELECTROLESS COPPER DEPOSITION SOLUTIONS
    22.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTIONS 未知

    公开(公告)号：CA1163056A

    公开(公告)日：1984-03-06

    申请号：CA393444

    申请日：1981-12-30

    Applicant: MACDERMID INC

    Inventor： FERRIER DONALD R ,  RHODENIZER HAROLD L ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

    IPC: C23C3/02

    Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a nonformaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140.degree. to 160.degree.F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

    23.
    发明专利
    未知

    公开(公告)号：DE2920766A1

    公开(公告)日：1979-11-29

    申请号：DE2920766

    申请日：1979-05-22

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS.
    24.
    发明公开
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS. 失效
    方法生产多层半导体板。

    公开(公告)号：EP0288507A4

    公开(公告)日：1989-06-13

    申请号：EP87906862

    申请日：1987-09-10

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  FERRIER DONALD R ,  LARSON GARY B ,  GALLEGOS DANIEL ,  CASTALDI STEVEN A

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    CPC classification number: H05K3/181 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10S428/901

    Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

    ADDITIVE METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING AQUEOUS ALKALINE DEVELOPABLE AND STRIPPABLE PHOTORESISTS.
    25.
    发明公开
    ADDITIVE METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING AQUEOUS ALKALINE DEVELOPABLE AND STRIPPABLE PHOTORESISTS. 失效
    制造加成法印刷电路IN USE碱性水溶液可显影和剥离光致抗蚀剂。

    公开(公告)号：EP0312551A4

    公开(公告)日：1989-11-27

    申请号：EP88901675

    申请日：1988-01-15

    Applicant: MACDERMID INC

    Inventor： FERRIER DONALD R

    IPC: G03F7/26 ,  B05D1/32 ,  B05D3/10 ,  G03F7/00 ,  H05K3/18 ,  H05K3/42

    CPC classification number: B05D5/12 ,  G03F7/00 ,  H05K3/184 ,  H05K3/426 ,  H05K2203/0565 ,  H05K2203/0769 ,  H05K2203/0786

    Abstract: An additive process for making printed circuit boards utilizing aqueous alkaline strippable resists, in which a suitable insulating substrate is patterned with the resist, the resist-patterned substrate catalyzed to electroless metal deposition, the resist then stripped completely from the substrate, utilizing an aqueous alkaline solution, preferably containing a reducing agent, and the electroless metal then deposited over the areas of the substrate catalyzed in the desired pattern.

    Abstract translation: 用于制造印刷电路板利用wässrige碱性剥离抗蚀剂，其中合适的绝缘基片进行图案化抗蚀剂中的添加剂的过程中，抗蚀剂的图案化衬底催化无电金属沉积，对抗蚀剂然后汽提完全从基板呼叫，利用wässrige碱性的 溶液，优选含有还原剂，然后将无电金属淀积在所希望的图案催化的底物的区域。

    ELECTROLESS COPPER DEPOSITION SOLUTIONS.
    26.
    发明公开
    ELECTROLESS COPPER DEPOSITION SOLUTIONS. 失效
    免费电铜沉淀的解决方案。

    公开(公告)号：EP0096034A4

    公开(公告)日：1984-05-03

    申请号：EP82900581

    申请日：1981-12-21

    Applicant: MACDERMID INC

    Inventor： FERRIER DONALD R ,  RHODENIZER HAROLD L ,  KUKANSKIS PETER E ,  GRUNWALD JOHN

    IPC: H05K3/18 ,  C23C18/40 ,  C23C3/02

    CPC classification number: C23C18/40

    Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a non-formaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140 to 160 F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

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