公开(公告)号：CA2673660A1

公开(公告)日：2008-07-10

申请号：CA2673660

申请日：2007-12-21

Applicant: SAINT GOBAIN CERAMICS

Inventor： CHERIAN ISAAC K ,  VEDANTHAM RAMANUJAM ,  CHINNAKARUPPAN PALANIAPPAN ,  SIMPSON MATTHEW A ,  TANIKELLA BRAHMANANDAM V ,  RIZZUTO ROBERT A

IPC: C30B29/20

Abstract: A sapphire substrate includes a generally planar surface having a crystal lographic orientation selected from the group consisting of a-plane, r-plane , m-plane, and c-plane orientations, and having a nTTV of not greater than a bout 0.037 µm/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diamete r not less than about 9.0 cm.

公开(公告)号：HK1050913A1

公开(公告)日：2003-07-11

申请号：HK03103083

申请日：2003-04-30

Applicant: SAINT GOBAIN CERAMICS

Inventor： GARG AJAY K ,  TANIKELLA BRAHMANANDAM V ,  DELANEY WILLIAM R

IPC: B24B37/00 ,  C01F7/44 ,  C09G20090101 ,  C09G1/02 ,  C09K20090101 ,  C09K3/14 ,  H01L20090101 ,  H01L21/304 ,  H01L21/321

Abstract: CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm.

公开(公告)号：AU754060B2

公开(公告)日：2002-10-31

申请号：AU7090200

申请日：2000-08-30

Applicant: SAINT GOBAIN CERAMICS

Inventor： GARG AJAY K ,  TANIKELLA BRAHMANANDAM V ,  DELANEY WILLIAM R

IPC: B24B37/00 ,  C01F7/44 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/321

Abstract: CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm.

公开(公告)号：AU5464700A

公开(公告)日：2001-01-02

申请号：AU5464700

申请日：2000-06-06

Applicant: SAINT GOBAIN CERAMICS AND PLASTICS INC

Inventor： GARG AJAY K ,  TANIKELLA BRAHMANANDAM V ,  KHAUND ARUP

IPC: B24B37/00 ,  C01F17/00 ,  C09K3/14 ,  H01L21/304 ,  H01L21/306

Abstract: A polishing slurry, useful in optical or CMP applications, comprises a ceria with a BET surface area of at least 10 m2/gm. The slurry may be made by subjecting a commercial ceria slurry comprising agglomerates to a mechano-chemical treatment at a pH of from 9 to 11 using media that are low purity alpha alumina or zirconia. Preferred slurries maintain a positive surface charge at all pH values. CMP slurries preferably comprise in addition an anionic surfactant to aid in removal of surface residues.

公开(公告)号：CA2673660C

公开(公告)日：2012-07-24

申请号：CA2673660

申请日：2007-12-21

Applicant: SAINT GOBAIN CERAMICS

Inventor： TANIKELLA BRAHMANANDAM V ,  SIMPSON MATTHEW A ,  CHINNAKARUPPAN PALANIAPPAN ,  RIZZUTO ROBERT A ,  CHERIAN ISAAC K ,  VEDANTHAM RAMANUJAM

IPC: C30B29/20

Abstract: A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 µm/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

公开(公告)号：CA2673523A1

公开(公告)日：2008-07-10

申请号：CA2673523

申请日：2007-12-21

Applicant: SAINT GOBAIN CERAMICS

Inventor： CHINNAKARUPPAN PALANIAPPAN ,  RIZZUTO ROBERT A ,  VEDANTHAM RAMANUJAM ,  TANIKELLA BRAHMANANDAM V ,  CHERIAN ISAAC K

IPC: B24B1/00 ,  B24B7/22

Abstract: A method of machining a sapphire substrate comprises grinding a first sur face of a sapphire substrate using a first fixed abrasive and grinding said first surface of the sapphire substrate using a second fixed abrasive, where in the second fixed abrasive has a smaller average grain size than the first fixed abrasive, and wherein the second, fixed abrasive is self -dressing.

公开(公告)号：CA2374373C

公开(公告)日：2005-04-05

申请号：CA2374373

申请日：2000-06-06

Applicant: SAINT GOBAIN CERAMICS

Inventor： GARG AJAY K ,  KHAUND ARUP ,  TANIKELLA BRAHMANANDAM V

IPC: B24B37/00 ,  C01F17/00 ,  C09K3/14 ,  H01L21/304 ,  H01L21/306

Abstract: A polishing slurry, useful in optical or CMP applications, comprises a ceria with a BET surface area of at least 10 m2/gm. The slurry may be made by subjecting a commercial ceria slurry comprising agglomerates to a mechano- chemical treatment at a pH of from 9 to 11 using media that are low purity alpha alumina or zirconia. Preferred slurries maintain a positive surface charge at all pH values. CMP slurries preferably comprise in addition an anionic surfactant to aid in removal of surface residues.

公开(公告)号：BR0014755A

公开(公告)日：2002-09-24

申请号：BR0014755

申请日：2000-08-30

Applicant: SAINT GOBAIN CERAMICS E PLASTI

Inventor： GARG AJAY K ,  TANIKELLA BRAHMANANDAM V ,  DELANEY WILLIAM R

IPC: B24B57/02 ,  B24B37/24 ,  B24D3/00 ,  B24D3/28 ,  B24D3/34 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304

Abstract: Abrasive materials comprising silica-coated transitional alumina particles with an average particle size of less than 50 nanometers and a BET surface area of at least 50 m2/gm are useful in CMP processes either in the form of slurries or as fixed abrasives.

公开(公告)号：MXPA01013093A

公开(公告)日：2002-06-04

申请号：MXPA01013093

申请日：2000-06-06

Applicant: SAINT GOBAIN CERAMICS

Inventor： TANIKELLA BRAHMANANDAM V

IPC: B24B37/00 ,  C01F17/00 ,  C09K3/14 ,  H01L21/304 ,  H01L21/306

Abstract: Una suspension para pulido, util en aplicaciones opticas o de CMP, que comprende un cerio con una BET de area de superficie de al menos 10 m2/gm; la suspension se puede hacer sometiendo una suspension de cerio comercial que comprende aglomerados a un tratamiento mecanico-quimico a un pH de 9 a 11 utilizando medio que son alfa alumina de baja pureza o zirconio; las suspension preferidas mantienen una carga de superficie positiva a todos los valores de pH; las suspensiones de CMP comprenden preferiblemente ademas un agente tensioactivo anionico para ayudar en la remocion de residuos de superficie.

公开(公告)号：AU7090200A

公开(公告)日：2001-05-10

申请号：AU7090200

申请日：2000-08-30

Applicant: SAINT GOBAIN CERAMICS AND PLASTICS INC

Inventor： GARG AJAY K ,  TANIKELLA BRAHMANANDAM V ,  DELANEY WILLIAM R

IPC: B24B37/00 ,  C01F7/44 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/321

Abstract: CMP processes and products employ aluminas comprising alpha alumina particles having a particle width of less than 50 nanometers and a surface area of at least 50 m2/gm.