公开(公告)号：JPH10233560A

公开(公告)日：1998-09-02

申请号：JP3527097

申请日：1997-02-19

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  WATABE MASAKO

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To realize a wettability test piece which is simple, which can be judged surely and which can test the wettability of a copper foil on a printed- wiring board by a method wherein the wettability test piece which is formed by a slit is formed on a base material. SOLUTION: Various treatment such as a rust-preventive treatment, a preliminary flux treatment, a metal plating treatment and the like are executed, the oxidation of a copper foil is prevented, and a surface treatment to promote a soldering is executed. Then, rod-shaped parts which are situated on a copper- clad laminated board and in which a copper plating treatment and a surface treatment are executed to the whole face are cut from a base-material body, and rod-shaped members are used as test pieces 8. The test pieces 8 are formed on a sacrificial board 1a which is partitioned by perforations 1b as an inessential part inside a printed-wiring board 1, and the solder wettability of the printed- wiring board 1 as a mass-product is investigated before a mounting and production process is started. Thereby, the comparison of various surface treatments of the printed-wiring board 1 becomes easy, and the quality assurance of the printed-wiring board can be enhanced.

公开(公告)号：JPH1027956A

公开(公告)日：1998-01-27

申请号：JP18045196

申请日：1996-07-10

Applicant: HITACHI CHEMICAL CO LTD ,  SONY CORP

Inventor： SHIMANE MICHIHIRO ,  UEHARA TOSHISHIGE ,  TOSAKA MINORU ,  MATSUDA YOSHINARI

IPC: H05K3/34 ,  H05K3/30

Abstract: PROBLEM TO BE SOLVED: To provide a mounting method of a part on double-sided printed circuit boards which can be applied to surface-mounting of small surface mount devices using a screen printing method. SOLUTION: On one face of double-sided printed circuit boards having electrodes for connecting surface mount devices on both sides and electrodes in which through holes are formed to insert lead terminals of lead parts, and in the required position other then the electrodes, adhesive layers are previously formed by screen printing. Next, in a process of reflow soldering, surface mount devices are soldered to electrodes of the other side of double-sided printed circuit boards. Next, from the other surface, lead parts are inserted into the electrodes in which through holes are formed. Next, surface mount devices are temporarily fixed to the surface with the above adhesive layers in a way that a part of adhesive layers are pushed out of surface mount devices, and after curing the pushed-out part of the adhesive layers by ultraviolet irradiation, soldering the above preset surface mount devices and lead terminal of the above lead parts to electrodes are carried out in a process of flow soldering.

公开(公告)号：JPH09162536A

公开(公告)日：1997-06-20

申请号：JP34518095

申请日：1995-12-06

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K3/34 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To efficiently, inexpensively, and surely mount inserting mounting parts on a printed circuit board by fixing required amounts of solder for soldering the terminals of parts to the printed circuit board to prescribed positions of the terminals by utilizing frictional forces while the terminals are housed inside. SOLUTION: Through holes having diameters which are slightly smaller than those of terminals 10 are formed at the center of solder 6 and the holes are filled up with flux. The terminals are inserted into the through holes with pressure from the front ends, moved toward the lower end of the main body of electronic parts 8, and fixed to points at prescribed distances from the lower end. Since the terminals 10 are passed through the through holes having diameters which are slightly smaller than those of the terminals 10, the solder 6 is surely fixed to the terminals by frictional forces. Therefore, required amounts of solder can be attached to the terminals 10, because the solder attached to the terminals 10 do not come off when the parts 8 are moved and the size of the solder can be selected freely. In addition, parts can be attached simultaneously by reflowing the solder.

公开(公告)号：JPH08125303A

公开(公告)日：1996-05-17

申请号：JP26296094

申请日：1994-10-26

Applicant: MATSUSHITA ELECTRIC WORKS LTD ,  SONY CORP

Inventor： EZAKI YOSHIAKI ,  MATSUDA YOSHINARI ,  KAYABA MASAO

IPC: H05K3/28 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

Abstract: PURPOSE: To make a material cost and a processing cost inexpensive, to prevent continuity failure and disconnection by preventing through-hole plating from cracking and to prevent reliability of solder junction from lowering by preventing generation of a blow-hole. CONSTITUTION: A paper base phenolic resin lamination board is used as a substrate 1. Through-hole plating 3 is applied to a through-hole 2, a through-hole land 4 is provided in an opening part of an upper surface and a lower surface thereof and solder resist 5 is applied from the through-hole land 4 to the through-hole plating 3 of an opening inner circumferential edge. The through- hole plating 3 is applied to a through-hole 6 and the through-hole land 4 is provided in only an opening part of a lower surface. A terminal part 7 of a mounting part is inserted to the through-hole 6 and it is charged with solder 8, and then packaging is performed. A through-hole 9 by punching processing is provided in the substrate 1, the through-hole land 4 is provided in an opening part of a lower surface of the through-hole 9. While the terminal part 7 of a mounting part is inserted to the through-hole 9, solder 8 is put in an inner circumference of the through-hole land 4, and a mounting part is packaged.

公开(公告)号：JP2007080969A

公开(公告)日：2007-03-29

申请号：JP2005264156

申请日：2005-09-12

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MATSUDA YOSHINARI

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board with structure capable of favorably soldering, even in the case of mounting small parts of sizes 1,005 or less, and capable of forming a pattern by a printing method. SOLUTION: In order to solder surface mounting parts which have electrodes at both ends, the printed wiring board comprises a pair of soldering lands 1 formed face to face, wiring 2 connected to the soldering lands, a solder resist 4 for covering the wiring 2, and openings 3 for exposing the soldering lands 1. Only sides opposite to the soldering lands 1 are connected with the wiring 2. The openings 3 are formed outside the soldering lands 1 and inside the wiring 2. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：即使在安装尺寸为1,005以下的小部件的情况下，也能够通过印刷法形成图案，提供具有能够有利地焊接的结构的印刷布线板。 解决方案：为了焊接两端具有电极的表面安装部件，印刷电路板包括一对面对面形成的焊接区域1，连接到焊接区域的布线2，用于覆盖 接线2和用于暴露焊接区1的开口3.仅与焊接区1相对的一侧与布线2连接。开口3形成在焊接区1的外侧和布线2的内部。 C）2007，JPO＆INPIT

公开(公告)号：JP2006114700A

公开(公告)日：2006-04-27

申请号：JP2004300580

申请日：2004-10-14

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MATSUDA YOSHINARI ,  SANWO IKUO JIMMY ,  KAYABA MASAO

IPC: H05K3/42 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To inhibit the dispersion of the characteristic impedance of a wiring pattern. SOLUTION: A via hole 6 is formed to a substrate in which metallic foils 12 and 13 are stuck on an outer layer. and the surface of the substrate containing the inside of the via hole 6 is plated with a metal. A plating resist 15 is carried out to a region excepting an opening 7 with the formed via hole 6 of the surface of the substrate plated with the metal, and the opening 7 of the surface of the substrate and the inside of the via hole 6 are plated with the metal in a thick thickness. The plating resist 15 is removed from the surface of the substrate, an etching resist 17 is stuck on the surface of the substrate, and the wiring pattern is formed by etching the metallic foils 12 and 13 stuck in a region excepting the opening section 7 and the via hole 6. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：抑制布线图案的特性阻抗的分散。 解决方案：将通孔6形成在金属箔12和13粘附在外层上的基板上。 并且含有通孔6内部的基板的表面镀金属。 电镀抗蚀剂15通过形成有金属表面的基板的表面的通路孔6进行到除开口7之外的区域，并且基板的表面的开口7和通孔6的内部是 电镀厚度较厚的金属。 从基板的表面除去电镀抗蚀剂15，将抗蚀剂17粘贴在基板的表面上，通过蚀刻卡在除开口部7以外的区域的金属箔12,13，形成布线图案， 通孔6.版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2002299806A

公开(公告)日：2002-10-11

申请号：JP2001100980

申请日：2001-03-30

Applicant: SONY CORP

Inventor： ORUI KEN ,  MATSUDA YOSHINARI ,  GOTO HITOSHI

IPC: H05K3/28 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a mounting board which is formed by the use of lead-free solder and mounted on an electronic apparatus, coping with a global environmental protection and improved in performance and reliability. SOLUTION: A viahole 11 and a via land 13 provided on a printed wiring board 9 are covered with a non-soldering layer 21 of thermosetting high- molecular material to which anything cannot be soldered, and an electronic components 17 and 18 are mounted on the printed wiring board 9 by dip soldering by the use of lead-free solder 20 for the formation of a mounting board 19. The mounting board 19 is used for an electronic apparatus.

公开(公告)号：JP2002016333A

公开(公告)日：2002-01-18

申请号：JP2000192770

申请日：2000-06-27

Applicant: SONY CORP ,  TATSUTA DENSEN KK

Inventor： MATSUDA YOSHINARI ,  WAKITA SHINICHI ,  UMEDA HIROAKI

IPC: H05K1/09 ,  H01B1/22 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board for thinning an etching circuit by improving the etching accuracy of a circuit board having a via hole. SOLUTION: Conductive paste 15 is filled into a via hole 13 on a substrate 11 where through hole plating 14 is made or is not made as a basic composition. In this case, in the conductive paste 15, a conductor filler having the average particle diameter of 1 to 25 μm in (solid content) volume ratio after curing is set to at least 25 vol.% and less than 65 vol.%, and binder is set to at least 35 vol.% and less than 75 vol.%. Chemical nickel plating 17 is performed from the filled part of the conductive paste 15 to the surface of copper foil 12, and electric nickel plating 18 and chemical or electric gold plating 19 are successively performed onto the chemical nickel plating 17. The shape of the conductor filler should be set to an indefinite shape, a spherical shape, or a branch shape, and a required amount of dispersant, a conductivity additive agent, and a curing agent are added.

公开(公告)号：JP2001007469A

公开(公告)日：2001-01-12

申请号：JP17749799

申请日：1999-06-23

Applicant: SONY CORP ,  SHIRATO PRINT HAISEN SEISAKUSH

Inventor： MATSUDA YOSHINARI ,  OGUCHI TOMOHIDE

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To prevent burst or void phenomenon of a copper paste by providing a through hole near a via hole for charging the paste. SOLUTION: Copper foils 14 are patterned on an upper surface 12A and a lower surface 12B of a double-sided copper-clad laminate base material 12 of the printed circuit board 10, and then a via hole 20 is formed by using a drill. A liquid-like copper paste 22 is filled in the hole 20, then dried, and the via hole 20 having the paste 22 is completed through a heat curing step. Then, to prevent a burst and a void due to the paste, one or a plurality of through holes 40 are formed near the foil 14 (via hole land) around the hole 20. Outgas of the paste is externally degassed from the holes 40 so that no outgas stores in the paste.

公开(公告)号：JPH10112580A

公开(公告)日：1998-04-28

申请号：JP26644696

申请日：1996-10-08

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  KUBO MINORU ,  TOMIZUKA KENICHI ,  MORITA KOJI

IPC: H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form each barrier made of solder resists between the respective adjacent electrode lands of a printed circuit board of an electronic part by superimposing in the form of two layers a photosensitive dry-film-form solder resist on an ordinary liquid resist provided on its main body of the board, in order to prevent solder-bridge faults generated between SMD electrodes, such as the ones of a flat package IC with terminal pitch not larger than about 0.65mm and generated between parts, in the soldering processes of the electronic part. SOLUTION: Forming each thin film made of a photosensitive liquid solder resist 4a of one of either an alkali developing type or a water soluble type on the single surface of a board main body 2 of a printed circuit board 1 by printing, exposing and developing, a photosensitive dry-film-form solder resist 4b of either one of an alkali developing type or water soluble type is stuck further thereon to form each of the thick films made of the resist 4b by exposing and developing. Thereby, each two-layer structure barrier 4 made of the solder resists 4a, 4b is formed progressively in the position surrounding each copper foil electrode 3 on the board main body 2.