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    Integrated semiconductor chemical microreactor for real-time monitoring of biological reactions
    23.
    发明公开
    Integrated semiconductor chemical microreactor for real-time monitoring of biological reactions 审中-公开
    对于生物反应的实时监测的半导体材料的集成化学反应器

    公开(公告)号：EP1541991A1

    公开(公告)日：2005-06-15

    申请号：EP03425800.4

    申请日：2003-12-12

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Villa, Flavio Francesco ,  Barlocchi, Gabriele

    IPC: G01N21/25 ,  G01N21/64 ,  B01L3/00 ,  B81B3/00 ,  B01J19/00

    CPC classification number: G01N21/6428 ,  B01J19/0093 ,  B01J2219/0097 ,  B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2200/12 ,  B01L2300/0654 ,  B01L2300/0816 ,  G01N21/6454

    Abstract: An integrated semiconductor chemical microreactor (21) for real-time polymerase chain reaction (PCR) monitoring, has a monolithic body (2) of semiconductor material; a number of buried channels (3) formed in the monolithic body (2); an inlet trench (14) and an outlet trench (15) for each buried channel (3); and a monitoring trench (16) for each buried channel (3), extending between the inlet and outlet trenches (14, 15) thereof from the top surface (4) of the monolithic body (2) to the respective buried channel (3). Real-time PCR monitoring is carried out by channeling light beams into the buried channels (3), whereby the light beams impinge on the fluid therein, and by collecting and processing light beams coming out from the monitoring trenches (16) and emitted by the fluid within the buried channels (3).

    Abstract translation: 实时聚合酶链式反应（PCR）监测的集成半导体化学微反应器（21），具有半导体材料的整体式主体（2）; 在整体式主体形成多个掩埋信道（3）（2）; 在入口沟槽（14）和在出口处的沟槽（15），用于各掩埋沟道（3）; 并为每个掩埋沟道的监视沟槽（16）（3）的入口和出口槽（14,15）从所述顶表面之间延伸（4）单块体（2）到respectivement掩埋沟道（3） ， 实时PCR监测是通过窜光束到掩埋信道（3），由此，光束照射在其中的流体，并通过收集和处理光束从监视沟槽出来（16）中进行，并发射的由 掩埋通道内的流体（3）。

    Integrated semiconductor device including a heater for bringing about phase changes in microfluid systems
    26.
    发明公开
    Integrated semiconductor device including a heater for bringing about phase changes in microfluid systems 审中-公开
    与加热元件集成半导体器件，以使微流体系统中的相变

    公开(公告)号：EP1176017A1

    公开(公告)日：2002-01-30

    申请号：EP00830536.9

    申请日：2000-07-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno ,  Vigna, Benedetto

    IPC: B41J2/14 ,  H03K17/94 ,  F04B43/04

    CPC classification number: B41J2/14129 ,  F04B17/00 ,  F04B43/043

    Abstract: An integrated device (40) forming a microfluid system includes a substrate (41) of semiconductor material and a lid element (56) forming a channel (55) filled with a liquid. A heating element (51) is carried by the substrate and faces the channel so as to heat the liquid and generate a gas bubble, when activated. The substrate (41) houses a cavity (42) arranged on the opposite side of the heating element (51; 66) with respect to the channel (55) in order to reduce thermal dispersion of the heating element (51) towards the substrate (41). The heating element includes a resistive region (45) coated, on the side facing the channel (55), by a protective region (49, 50) and, on the side facing the cavity (42), by an insulating layer (44).

    Abstract translation: 形成流体系统的集成装置（40）包括半导体材料以及形成填充有液体的通道（55）的盖部件（56）的一个微型的底物（41）。 的加热元件（51）由基板承载并面向通道，以便加热所述液体和产生气泡，当被激活时。 基板（41）容纳布置在所述加热元件（51; 66）的相对侧上的腔体（42），相对于以所述通道（55），以减少所述加热元件（51）朝向所述基板的热扩散（ 41）。 所述加热元件包括涂覆（45）的电阻区域，在上绝缘层面向通道（55）由保护区（49，50），并且在由面向空腔（42）的侧上的侧（44） ，

    Process for manufacturing mechanical, electromechanical and opto-electromechanical microstructures having suspended regions subject to mechanical stresses during assembly
    27.
    发明公开
    Process for manufacturing mechanical, electromechanical and opto-electromechanical microstructures having suspended regions subject to mechanical stresses during assembly 有权
    一种用于生产机械，机电以及光电机械微结构的过程被暴露带有悬浮区，其在组装过程中的机械应力

    公开(公告)号：EP1031736A1

    公开(公告)日：2000-08-30

    申请号：EP99830107.1

    申请日：1999-02-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Vigna, Benedetto ,  Mastromatteo, Ubaldo

    IPC: F16B1/00

    CPC classification number: B81C1/00896

    Abstract: To reduce the risk of breakage of the moving parts of an integrated microstructure during manufacture steps causing mechanical stresses to the moving parts, a temporary immobilization and support structure (20; 30; 40) is formed thereby a moving region (12, 13) of the microstructure is temporarily integral with the fixed region (10, 11). The temporary structure (20; 30; 40) is removed at the end of the assembly operations by non-mechanical removal methods. According to one solution, the temporary structure is formed by a fusible element (20) removed by melting or evaporation, by applying a sufficient quantity of energy thereto. Alternatively, a structural region (30) of polymer material is formed in the trench (15) separating the moving part from the fixed part, or an adhesive material layer (40) sensitive to ultraviolet radiation is applied.

    Abstract translation: 为了减少一个集成微结构的移动部件的破损的在制造步骤的风险，从而导致机械应力施加到移动部件，临时固定和支撑结构（20; 30; 40）由此形成的移动区域（12，13） 微结构是与所述固定区域（10，11）暂时成为一体。 临时结构（20; 30; 40）在所述组装操作的由非机械去除方法的端部除去。 。根据一个方案，所述临时结构由通过熔化或蒸发除去，通过向其施加能量的足够量的可熔元件（20）形成。 可替代地，聚合物材料的结构区（30）形成在从固定部分中分离出运动部分的沟槽（15），或以粘合材料层（40）被施加到紫外辐射敏感。

    Process for forming front-back through contacts in micro-integrated electronic devices
    28.
    发明公开
    Process for forming front-back through contacts in micro-integrated electronic devices 失效
    Herstellungsverfahrenfüreinen Vorder-Hinterseiten-Durchkontakt in mikro-integrierten Schaltungen

    公开(公告)号：EP0926723A1

    公开(公告)日：1999-06-30

    申请号：EP97830626.4

    申请日：1997-11-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno

    IPC: H01L21/74 ,  H01L23/48

    CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548

    Abstract: The process comprises the steps of: forming a through hole (12) from the back of a semiconductor material body (1); forming a hole insulating layer (15) of electrically isolating material laterally covering the walls of the through hole; forming a through contact region (16) of conductive material laterally covering the hole insulating layer inside the hole and having at least one portion (21) extending on top of the lower surface (10) of the body (1); forming a protective layer (22) covering the through contact region; and forming a connection structure (25) extending on top of the upper surface (5) of the body (1) between and in electrical contact with the through contact region (16) and the electronic component (3).

    Abstract translation: 该方法包括以下步骤：从半导体材料体（1）的背面形成通孔（12）; 形成将绝缘材料横向覆盖所述通孔壁的电绝缘层（15）; 形成导电材料的穿透接触区域（16），横向覆盖孔内的孔绝缘层，并且具有在主体（1）的下表面（10）顶部延伸的至少一个部分（21）; 形成覆盖所述贯通接触区域的保护层（22） 以及形成在主体（1）的上表面（5）的顶部上延伸穿过接触区域（16）和与电子部件（3）电接触的连接结构（25）。

    Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses
    29.
    发明公开
    Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses 审中-公开
    流体盒用于检测样品中的化学物质，特别是用于进行生化分析

    公开(公告)号：EP2399672A2

    公开(公告)日：2011-12-28

    申请号：EP11171813.6

    申请日：2011-06-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Ziglioli, Federico Giovanni ,  Maierna, Amedeo ,  Mastromatteo, Ubaldo ,  Barlocchi, Gabriele ,  Villa, Flavio Francesco

    IPC: B01L3/00 ,  G01N35/00 ,  C12Q1/00

    CPC classification number: B01L3/502715 ,  B01L2200/027 ,  B01L2300/044 ,  B01L2300/0636 ,  B01L2300/0645 ,  B01L2300/0672 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2300/1827 ,  B01L2400/0439 ,  Y10T436/11

    Abstract: A fluidic cartridge (35; 135) for detecting chemicals, formed by a casing (40; 140), hermetically housing an integrated device (20) having a plurality of detecting regions (22) to bind with target chemicals; part of a supporting element (41; 141), bearing the integrated device; a reaction chamber (65; 165), facing the detecting regions (22); a sample feeding hole (50, 51; 150) and a washing feeding hole (52; 152), self-sealingly closed; fluidic paths (63, 64, 70, 71; 163, 164, 170, 171), which connect the sample feeding and washing feeding holes (50-52; 150, 152) to the reaction chamber (65; 165); and a waste reservoir (80; 180), which may be fluidically connected to the reaction chamber by valve elements (82, 76; 182, 176) that may be controlled from outside. The integrated device is moreover connected to an interface unit (42) carried by the supporting element (41; 141), electrically connected to the integrated device and including at least one signal processing stage and external contact regions (75; 175).

    Abstract translation: 甲流体盒（35; 135），用于检测化学品，由壳体（40; 140）形成为具有探测区域（22）多个与靶化学物质结合，气密壳体集成装置（20）; ，轴承集成装置;一个支撑元件（141 41）的一部分; 面向所述检测区域（22）;一个反应室（165 65）; 一个样品进料孔（50，51; 150）和一洗涤进料孔（52; 152），自密封地关闭; 流体通路（63，64，70，71; 163，164，170，171），连接所述进样和洗涤进料孔（50-52; 150,152）到所述反应室（65; 165）; 和废物容器（80; 180），其可被流体地连接到由阀元件在反应室（82，76; 182，176），并可以从外部进行控制。 集成器件是在多个连接到在由支撑元件所承载接口单元（42）（41; 141），电连接到所述集成器件和包括至少一个信号处理级和外部接触区域（75; 175）。

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