公开(公告)号：JPH04204907A

公开(公告)日：1992-07-27

申请号：JP33973590

申请日：1990-11-30

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  KITAURA KOICHI

IPC: G02B5/30

Abstract: PURPOSE:To improve polarizing characteristics and moisture-heat resistance by forming a base film of such a structure having specified orientation coefft. in an amorphous area of the polymer segment and, specified crosslinking index of the film with boron compd. CONSTITUTION:The polarizing film consists of a protective layer and a polarizer formed by allowing a dichroic dye to adsorb on a polyvinylalcohol base film and orienting the filma. In this film, the orientation coefft. in the amorphous area of the polymer segment which constitute the base film is specified to 0.65 0.85, preferably 0.70-0.80. Moreover, the crosslinking index CR of the film with a baron compd. is specified to 0.65-1.50, preferably 0.70-1.00. The CR is determined from the relation CR = A660/A600, wherein A660 and A600 are the absorbance of the film for 660cm and 600cm , respectively, in an IR absorption spectrum of the film. The polyvinyl base film is a polyvinyl alcohol film of 85-100mol% saponification value.

公开(公告)号：JPH04204402A

公开(公告)日：1992-07-24

申请号：JP33546190

申请日：1990-11-29

Applicant: TORAY INDUSTRIES

Inventor： KOJIMA HIDEYUKI ,  KIGOSHI SHOJI ,  KITAURA KOICHI

IPC: G02B5/30 ,  G02F1/13363

Abstract: PURPOSE:To obtain the phase difference plate which can be widened in a visual angle range when the phase difference plate is built into a liquid crystal display body of an STN(super twisted nematic) system by having the specific phase difference plate. CONSTITUTION:The phase difference plate is obtd. by laminating a phase difference plate compensation plate and a visual field angle compensation plate and has an achromatic effect when the phase difference plate is viewed from the front and diagonal of the liquid crystal display body. In addition, the phase difference plate has R0, R0', R40, R40' satisfying the conditions of equations I to TV when the retardations at the perpendicular incidence of both compensation plates are respectively designated as R0, R0' and retardations at the diagonal incidence inclined by 40 deg. in the main orientation axis direction of the phase difference plate compensation plate respectively as R40, R40'. In the equations, DELTAR and DELTAR' are inverse codes. The phase difference plate adequate for a liquid crystal display device having an excellent visual field angle characteristic is industrially obtd. in this way.

公开(公告)号：JPH04194902A

公开(公告)日：1992-07-14

申请号：JP32744990

申请日：1990-11-27

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  KOJIMA HIDEYUKI ,  KITAURA KOICHI

IPC: G02B5/30

Abstract: PURPOSE:To decrease dependence on view field angle and to widen a visible range by specifying the polymer material of a mixture which constitutes a film comprising two or more polymer components. CONSTITUTION:A film comprising a mixture of polymer materials is uniaxially oriented. Each polymer material used has positive or negative double refraction DELTAni when each single polymer material is uniaxially oriented. DELTAni is defined as formula I, wherein nalphai and nbetai are the refractive indices of the film of single polymer in the orientation direction and perpendicular to the orientation, respectively. Thereby, dependence on view field angle is decreased and visibility can be improved.

公开(公告)号：JP2001040317A

公开(公告)日：2001-02-13

申请号：JP22090399

申请日：1999-08-04

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  SHINOHARA HIDEKI ,  KIGOSHI SHOJI

IPC: H05K1/03 ,  C09J7/02 ,  C09J109/02 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To provide novel covering films having excellent soldering heat resistance, adhesion and storage stability, and adhesive sheets and flexible printed circuit boards on an industrial scale. SOLUTION: In a covering film constituted by a laminate of an insulating plastic film layer which contains, as the essential components, (A) 100 pts.wt. epoxy resin, (B) 20-200 pts.wt. carboxyl group-containing acrylonitrile/butadiene rubber, (C) 0.01-50 pts.wt. curing agent, and (D) 10-100 pts.wt. inorganic particles containing aminosilane in their surfaces and is coated with a heat curable adhesive layer and a release film layer, the amount of the aminosilane of component (D) is 1.2-10 wt.% based on the inorganic particles.

公开(公告)号：JPH11354592A

公开(公告)日：1999-12-24

申请号：JP7950899

申请日：1999-03-24

Applicant: TORAY INDUSTRIES

Inventor： MIZUTANI YOKO ,  KIGOSHI SHOJI ,  KONISHI YUKITSUNA

IPC: H01L21/60 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00

Abstract: PROBLEM TO BE SOLVED: To improve the adhesiveness, insulation property, and workability of an adhesive-backed tape, by mixing at least a thermoplastic resin and a phenol resin as essential ingredients in the adhesive layer of the tape, and specifying the softening point of the phenol resin. SOLUTION: The adhesive layer formed on an adhesive-backed tape contains at least a thermoplastic resin (A) and a phenol resin (B) as essential ingredients. While any thermoplastic resin can be used as the thermoplastic resin (A) as far as the resin gives flexibility to the adhesive layer, an embodiment of the resin includes polyethylene, polyamide, etc. It is preferable to specify the softening point of the phenol resin (B) to =85 deg.C, the well-known novolak and resol resins can be used without restriction. It is also preferable to adjust the mixing ratio of the phenol resin (B) in the adhesive to 35-60%.

公开(公告)号：JPH11260865A

公开(公告)日：1999-09-24

申请号：JP5987798

申请日：1998-03-11

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  OGURA MIKIHIRO ,  KIGOSHI SHOJI

IPC: H01L21/60 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a tape with adhesive for a semiconductor device having superior high adhesiveness and high insulation, and a substrate for connecting a semiconductor using the tape, and a semiconductor device. SOLUTION: This tape with an adhesive for tape automated bonding(TAB) is composed of a laminated product having an adhesive layer and a protective film layer on an organic insulating film having flexibility, and this adhesive layer contains polyamide resin and a phenol derivative constituted of two nuclides, which is shown by at least one kind of formula as indispensable components. In this case, X indicates a group or a bording containing at least one of sulfur and oxygen atoms, and Y1 and Y2 indicate a hydrocarbon radical whose carbon number is 1-5, and those X and Y can be made either the same or different. Also, (m) indicates an integer which is 0

公开(公告)号：JPH11260864A

公开(公告)日：1999-09-24

申请号：JP5817598

申请日：1998-03-10

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: H01L21/60 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a tape with an adhesive for a semiconductor device, having superior high adhesiveness and high insulation, and a substrate for connecting a semiconductor using this tape, and a semiconductor device. SOLUTION: This tape with an adhesive for TAB is composed of a laminated product, having an adhesive layer and a protecting film layer on an organic insulating film with flexibility, and this adhesive layer contains polyamide resin and phenol derivative shown by at least one kind of formula as an indispensable component. Here, X and Y indicate at least one kind of group selected from among OH, COOH, NH2 , CN, and SO3 H groups, and those X and Y may be made either the same or different. Also (m) indicates an integer which is 0

公开(公告)号：JPH11260839A

公开(公告)日：1999-09-24

申请号：JP6523298

申请日：1998-03-16

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  MIZUTANI YOKO ,  SHINOHARA HIDEKI

IPC: H01L23/40 ,  C09J5/06 ,  C09J163/00 ,  C09J201/00 ,  H01L21/52 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To increase the reliability and processibility of a substrate for connecting semiconductor integrated circuits in high density mounting and of a semiconductor device, and thereby increase the profitability by industrially providing an adhesive composition for a semiconductor device which has superior processibility, adhesive force, high in insulating reliability and durability and an adhesive sheet for a semiconductor device manufactured using the adhesive composition. SOLUTION: In a substrate for connecting semiconductor integrated circuits, having a wiring board layer constituted of an insulator layer and a conductor pattern, a layer formed with no conductor pattern and an adhesive layer, each of at least one or more layers, an adhesive composition which forms the adhesive layer includes at least one kind of each thermoplastic resin and thermosetting resin and has such as property that 2N cm , 2N cm , 0.2

公开(公告)号：JPH10275834A

公开(公告)日：1998-10-13

申请号：JP8155097

申请日：1997-03-31

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  HATANO HIROSHI ,  KONISHI YUKITSUNA

IPC: C09J7/02 ,  C09J177/06 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To obtain an adhesive-backed tape which is superior in both adhesive properties and warpage preventing properties by a method, wherein a cured adhesive agent layer has a prescribed range of softening temperature and enables a reduction in its insulation resistance to meet certain requirements under definite conditions. SOLUTION: An adhesive agent layer used for a semiconductor device adhesive-backed type is supplied as usually kept uncured, laminated on a copper foil, and is cured and cross-linked by the application of one or more kinds of energy selected from among heat, pressure, electrical field, magnetic field, ultraviolet rays, radiation, ultrasonic waves and others. The softening temperature of the cured adhesive agent layer 2 ranges from 60 to 110 deg.C, and its insulation resistance reduction time is 50 hours or above, which it is left exposed to such an environment of temperature 130 deg.C and relative humidity(RH) 85% with a direct current voltage of 100 V applied to it.

公开(公告)号：JPH10178070A

公开(公告)日：1998-06-30

申请号：JP22170997

申请日：1997-08-18

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J7/00 ,  C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance and thermal cycle property by forming an adhesive composition for forming an adhesive layer with an epoxy resin, a thermoplastic resin, and a thermosetting type adhesive containing aluminum hydroxide. SOLUTION: An adhesive layer 23 is composed of an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive composition containing aluminum hydroxide. Any epoxy resin containing at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymerization constituent is preferable as a thermoplastic resin. Aluminum hydroxide is not especially limited in terms of a grain size and resin. Aluminum hydroxide is not especially limited in terms of a grain size and a shape but one of 1μm or less grain size is preferably used, and the amount of blend is preferably 2-40wt.% in the adhesive composition. A coating obtained by dissolving the adhesive composition in a solvent is applied onto a polyester film with a mold release property and is dried to obtain the adhesive layer 23. Then, a protection film 24 with a weak release force is laminated to obtain an adhesive sheet for semiconductor device.