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    CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
    22.
    发明公开
    CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230262893A1

    公开(公告)日：2023-08-17

    申请号：US17894128

    申请日：2022-08-23

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Jun-Rui Huang ,  Ming-Hao Wu ,  Yi-Pin Lin ,  Tung-Chang Lin

    IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

    CPC classification number: H05K1/116 ,  H05K3/4644 ,  H05K3/0094 ,  H05K1/024 ,  H05K3/4038 ,  H05K2201/0187

    Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.

    CIRCUIT BOARD STRUCTURE
    23.
    发明公开
    CIRCUIT BOARD STRUCTURE 审中-公开

    公开(公告)号：US20230262890A1

    公开(公告)日：2023-08-17

    申请号：US17938977

    申请日：2022-09-07

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Ming-Hao Wu ,  Yi-Pin Lin ,  Tung-Chang Lin ,  Jun-Rui Huang

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/115 ,  H05K1/0222 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09809

    Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

    Circuit board structure
    24.
    发明授权
    Circuit board structure 有权

    公开(公告)号：US10939538B1

    公开(公告)日：2021-03-02

    申请号：US16907298

    申请日：2020-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Shao-Chien Lee

    IPC: H05K1/02

    Abstract: A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

    Manufacturing method of circuit structure
    25.
    发明授权
    Manufacturing method of circuit structure 有权

    公开(公告)号：US10314179B2

    公开(公告)日：2019-06-04

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    MANUFACTURING METHOD OF CIRCUIT STRUCTURE
    26.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT STRUCTURE 审中-公开

    公开(公告)号：US20180302992A1

    公开(公告)日：2018-10-18

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    CPC classification number: H05K3/4697 ,  H05K3/4644

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    Circuit structure and manufacturing method thereof
    27.
    发明授权
    Circuit structure and manufacturing method thereof 有权

    公开(公告)号：US10051748B2

    公开(公告)日：2018-08-14

    申请号：US14997583

    申请日：2016-01-18

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K1/09 ,  H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

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