Abstract:
An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.
Abstract:
A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips.
Abstract:
A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips. The fabrication process for the memory cards begins with fabrication of a multi-substrate that includes several unit substrates. At least one semiconductor chip is provided on each unit substrate and electrically connected. A continuous resin-molded layer is then formed to extend over the unit substrates. Separating the unit substrates of the multi-substrate divides the continuous resin-molded layer into individual resin-molded units and provides the memory cards.
Abstract:
A personal computer (PC) card insertion method and apparatus uses a subset of connector ground terminals and pins, located at either end of the connector, for detecting the onset of a card insertion. The host PC card slot connector has pull-up resistors for keeping the subset of ground terminals at a high logic level (V.sub.CC). Also, the subset of pins are made longer than the signal pins so that when an insertion of a PC card begins, the grounding of one or more of the subset of pins indicates that a PC card insertion has begun, allowing the host system to take the necessary precautions to ensure an orderly acceptance of the card without any undesirable system affects that might otherwise result. Also, a logic network for using the subset of connector terminals as additional grounding connections is provided upon completion of the insertion.
Abstract:
Apparatus is disclosed for use when a first connector is to be mated to a second connector that includes shorting contacts and is being supplied with a plurality of active signals such that the breaking of the electrical connection between the shorting contacts themselves is substantially delayed until the time of making of the electrical connection between the shorting contacts and at least one corresponding conductive terminal of the first connector. Such a delay permits electrical separation of the shorting contacts only at the instant when at least one of the shorting contacts will begin to contact its corresponding conductive terminal without substantially impairing any other characteristics of the connector. This delay is established by employing a first connector which reduces or eliminates altogether any insulating material that passes between the shorting contacts as the first connector is inserted into the second connector prior to the shorting contacts establishing electrical conductivity with at least one of their corresponding conductors.
Abstract:
A circuit board having a multiway connector disposed along one edge thereof. The multiway connector includes a plurality of contacts. Earth path contacts of the connector are offset in relation to the remaining contacts so as to be the first to make connection with the corresponding connector upon insertion of the board into the connector and conversely the last to break connection upon extraction of the board from the corresponding connector.
Abstract:
A method of assembling and configuring multiple mezzanine cards on a carrier card is disclosed. The method includes the establishing an I/O profile that represents the I/O configuration of a mezzanine card. The I/O of the mezzanine card is not enabled unless the I/O profile matches a known value stored on the carrier card. In this way, the electronic circuitry is protected if an incorrect mezzanine card is connected to the carrier card.
Abstract:
An electrical connection system, for example a drop-side patch panel, comprises a mounting rail (12) which receives first connectors (14) arranged with their contacts facing away from the rail (12). Cable introduced between the rail and the connectors is separated into individual conductors which are terminated at contacts (34, 36) via slots (30) in the rail walls. A second connector (16) carries standard data or voice sockets communications (19) which are connected to the first connector via edge contact carrying PCBs (38) which engage in slots (40) in the first connectors. The PCB edge connectors have a discontinuity on one surface, and one half of the contact is connected to the contact on the other side to enable direct connection between upper (34) and lower (36) rows of contacts of the first connectors in a first position of the second connectors, and contact between the upper rows of contacts and the standard sockets (19) in a second position.
Abstract:
In the combination of a microcomputer (10) and a peripheral device (15) therefor, wherein electrical connection between the microcomputer and the peripheral device is by way of an edge connector (12) in the microcomputer and an array of connectors (22) (for making connection with the contact pads (20) of the edge connector) on the peripheral device, two of the connectors (40) are bridged electrically so that two of the pads (50, 52) of the edge connector (12) are short circuited before electrical contact is made between any other connectors of the array and their corresponding edge connector pads, on insertion, (or prior to contact being broken between other connectors of the array and the edge connector pads, on removal). The microcomputer is provided with circuit means (60) responsive to short circuiting of the said two contact pads to initiate emergency shut down of the microcomputer. Where the application of voltages to the peripheral device has to follow a particular sequence, the connectors (22) in the array are of differing effective lengths automatically to effect a required sequenccing in the application or removal of voltages to the different circuits incorporated in the peripheral device (15) when the latter is interconnected with, or disconnected from, the microcomputer. The connectors (22) may have the same effective mechanical length, but include electrically ''active'' regions and ''dead'' regions, to define different electrical lengths.
Abstract:
The invention relates to a galvanic separating apparatus, comprising a printed circuit board (3), the printed circuit board (3) comprising a first soldering pad (7), a second soldering pad (8) and a recess (12), whereby the pads (7, 8) are arranged on a lower side (9) of the printed circuit board (3) thereby defining a clearance and/or creepage distance (10, 11) between the pads (7, 8), and the recess (12) is arranged between the pads (7, 8), a primary insulated winding layer (5) connected to the first soldering pad (7) and a second insulated winding layer (6) connected to the second soldering part (8), whereby the winding layers (5, 6) are arranged on an upper side (2) of the printed circuit board (3), and an insulating layer (13), whereby the insulating layer (13) extends from the upper side (2) through the recess (12) and protrudes on the lower side (9) beyond the printed circuit board (3) thereby increasing the clearance and/or creepage distance (10, 11).