公开(公告)号：WO2005032224A1

公开(公告)日：2005-04-07

申请号：PCT/EP2004/010524

申请日：2004-09-20

Applicant: ENDRESS+HAUSER GMBH+CO. KG ,  BIRGEL, Dietmar ,  BURGER, Paul ,  HAUPTVOGEL, Karl-Peter

Inventor： BIRGEL, Dietmar ,  BURGER, Paul ,  HAUPTVOGEL, Karl-Peter

IPC: H05K3/30

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: Um bedrahtete Bauteile großer Masse oder mit ungleicher Masseverteilung sicher auf einer Leiterplatte (60) zu befestigen, ohne daß die Bauteile, wie heute üblich , auf die Leiterplatte geklebt oder mit Snap-In-Halterungen auf der Leiterplatte gehalten werden, schlägt die Erfindung vor, in eine Anschlußbohrung (11) zur Aufnahme eines Anschlußdrahtes oder -pins (111) eines elektronischen Bauteils (110) eine Haltevorrichtung (65) zum Festhalten des Anschlußdrahtes oder -pins (111) zu integrieren. Die Haltevorrichtung (65) stellt eine Verengung in der Anschlußbohrung (11) auf einen Durchmesser dar, der kleiner ist als der des Anschlußdrahtes oder -pins (111). Beispielsweise kann die Haltevorrichtung (65) durch eine Anschlußbohrung (11) realisiert werden, die als einseitige aber nicht vollständig durch die Leiterplatte (60) hindurch gebohrte Bohrung (16) ausgeführt ist. In diesem Fall bleibt ein Rand als Verengung (65) stehen, der den Anschlußpins (111) des betrachteten Bauteils (110) festklemmt und das Bauteil auf der Leiterplatte festhält.

Abstract translation: 到大的质量或与质量分布不均匀有线部件牢固地附连到电路板（60），而不的组件，按照惯例今天，粘在电路板或与管理单元在电路板安装件被保持，本发明提出， 在连接孔（11），用于接收电子部件（110）的安装导线或连接引脚（111）的保持装置（65），用于保持所述引线或连接引脚（111）集成。 所述保持装置（65）提供在所述连接孔（11）的直径的收缩比固定线或连接引脚（111）的直径。 例如，所述保持装置（65）可通过一连接孔（11），其为单侧来实现，而是通过所述电路板（60），钻通孔没有完全（16）被执行。 在这种情况下，边缘为缩小（65）停止，夹钳相关组件（110）的连接销（111）和牢固地保持在电路板上的组件。

公开(公告)号：EP0835046A4

公开(公告)日：1999-07-14

申请号：EP97914624

申请日：1997-04-07

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： KUMAGAI KOICHI ,  WADA YOSHINORI ,  EDAHIRO TERUKI

IPC: H05K1/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  H05K1/02 ,  H05K3/04

CPC classification number: H05K3/202 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10575 ,  H05K2203/0264 ,  H05K2203/063 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T428/24917

Abstract: A masking film (3) having desired apertures (2) is applied to a metal wiring board (1). With this construction, a conventional insulation substrate which is to be a thick base and a conventional resist layer can be eliminated. Further, when the terminal parts (T) of the metal wiring board (1) are bent, connection terminals which are substituted for connector terminals for the connection to another board are formed integrally to eliminate the connector terminals. Thus, a low cost component mounting board is provided.

公开(公告)号：EP0670760A1

公开(公告)日：1995-09-13

申请号：EP93918432.0

申请日：1993-07-21

Applicant: BERG TECHNOLOGY, INC.

Inventor： LWEE, Nai, Hock ,  KIN, Loke Wing ,  SUAT, Ng Bee

IPC: H01R12 ,  B23K3 ,  B23K31 ,  H01R43 ,  H05K3 ,  H01R4

CPC classification number: H01R12/52 ,  B23K3/08 ,  B23K2201/40 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1147 ,  H05K2203/304

Abstract: The present invention provides a vertical card connector (12) capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The vertical card connector includes an insulating housing (14) with a plurality of contact terminals (26) and a heat-resisting insulating resin film (28) covering the bottom surface (14b) of the housing. Each contact terminal has a solder tail (26b) extending through film. A slight gap (30a) is created between the heat-resisting film (28) and the bottom surface of the housing. The solder tail of the contact is inserted into a corresponding plated through hole (1a) and soldered there. The film (28) prevents a melted solder from flowing past the solder tail toward a contact beam of the contact at a time of soldering. A gas evolved from the solder escapes through the gap between the circuit board and the bottom of the housing.

Abstract translation: 本发明提供了一种垂直卡连接器（12），其能够防止破坏适当接触并去除腐蚀性酸性气体的熔化焊料的不期望的流动。 垂直卡连接器包括具有多个接触端子（26）的绝缘壳体（14）和覆盖壳体的底表面（14b）的耐热绝缘树脂膜（28）。 每个接触端子具有延伸穿过膜的焊接尾部（26b）。 在耐热膜（28）和壳体的底面之间形成一个微小的间隙（30a）。 触点的焊接尾部插入相应的电镀通孔（1a）并焊接在那里。 膜（28）在焊接时防止熔化的焊料流过焊接尾部朝向触点的接触梁。 从焊料释放的气体通过电路板和外壳底部之间的间隙逸出。

公开(公告)号：EP0384927B1

公开(公告)日：1993-06-16

申请号：EP89103570.1

申请日：1989-03-01

Applicant: THE FURUKAWA ELECTRIC CO., LTD.

Inventor： Kobayashi, Kenzo ,  Shiroishi, Hirokazu

IPC: H05K3/00 ,  H05K1/18 ,  H05K1/00

CPC classification number: H05K3/0058 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/3447 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2201/10863 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1327 ,  H05K2203/1572 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：US09349930B2

公开(公告)日：2016-05-24

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/00 ,  H01L33/64 ,  F21V23/00 ,  H05K1/02 ,  F21K99/00 ,  F21V29/15 ,  F21Y101/02 ,  F21V29/74

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US20130307016A1

公开(公告)日：2013-11-21

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/64 ,  F21K99/00

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US07708473B2

公开(公告)日：2010-05-04

申请号：US12289034

申请日：2008-10-17

Applicant: Keiji Tanaka ,  Kenichiro Uchida

Inventor： Keiji Tanaka ,  Kenichiro Uchida

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/147 ,  H05K1/162 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/10121 ,  H05K2201/10575

Abstract: A technique is disclosed for an optical transceiver, where the frame ground is electrically isolated from the signal ground in a low frequency region and is conducted in a high frequency region, without applying a capacitor as a substantial circuit component. The transceiver includes a TOSA whose housing is grounded with the FG and connected with the driver with a FPC board. On the FPC board is formed with a parallel plate capacitor, one conductive pattern on the one surface is connected with the housing of the TOSA, while the other pattern in the opposite surface is connected with the SG. This parallel plate capacitor isolates the FG from the SG in low frequencies, while conducts the FG with the SG in high frequencies.

Abstract translation: 公开了一种用于光收发器的技术，其中框架地与低频区域中的信号地电隔离并且在高频区域中传导，而不施加电容器作为实质电路部件。 收发器包括TOSA，其外壳与FG接地，并与FPC板与驱动器连接。 在FPC基板上形成有平行平板电容器，一个表面上的一个导体图案与TOSA的外壳相连，而相反表面的另一个图案与SG连接。 这种平行电容器将FG与SG在低频下隔离，同时以高频率将SG与SG进行导通。

公开(公告)号：US5164818A

公开(公告)日：1992-11-17

申请号：US765072

申请日：1991-09-24

Applicant: Arnold Blum ,  Frank Gerth ,  Manfred Perske ,  Manfred Schmidt

Inventor： Arnold Blum ,  Frank Gerth ,  Manfred Perske ,  Manfred Schmidt

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/50 ,  H01R4/02 ,  H01R4/24 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L23/48 ,  H05K3/306 ,  H05K3/32 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/0285 ,  H05K2203/1189 ,  H05K2203/176 ,  H05K3/281 ,  H05K3/3463

Abstract: A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.

公开(公告)号：US4211890A

公开(公告)日：1980-07-08

申请号：US906742

申请日：1978-05-17

Applicant: Ryoichi Sado ,  Koichi Nei

Inventor： Ryoichi Sado ,  Koichi Nei

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H05K1/08

CPC classification number: H05K3/306 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K3/0064 ,  H05K3/325

Abstract: An electronic circuit board has protrusions of rubber-like material on the surface opposite to the surface on which the printed circuit is provided with terminal contact points located at positions in correspondence with the individual terminal contact points or with the individual groups of the terminal contact points, each of the groups being composed of the terminal contact points aligned in a row.

Abstract translation: 电子电路板在与印刷电路的表面相对的表面上具有橡胶状材料的突起，该表面设置有位于与各个端子接触点相对应的位置处的端子接触点或与端子接触点的各个组 每个组由连续排列的端子接触点构成。

公开(公告)号：US4152751A

公开(公告)日：1979-05-01

申请号：US861652

申请日：1977-12-19

Applicant: Ronald E. Sindlinger ,  Emery G. Audesse ,  Donald H. Pfefferle

Inventor： Ronald E. Sindlinger ,  Emery G. Audesse ,  Donald H. Pfefferle

IPC: F21K5/04 ,  F21K5/12 ,  G03B15/04 ,  H05B43/02 ,  H05K3/28 ,  G03B15/02

CPC classification number: H05K3/281 ,  G03B15/0442 ,  H05K2201/091 ,  H05K2201/10575 ,  H05K2203/063 ,  H05K2203/167

Abstract: A compact photoflash unit comprising a plurality of flashlamps having lead-in wires connected to a circuit board containing thereon radiation-sensitive switching circuitry for sequentially flashing the lamps. Electrically conductive reflector panels are positioned between the lamps and the circuit board, and a sheet of electrically insulating material is interposed between the reflectors and the circuit board to prevent shorting of the circuitry on the circuit board by the conductive reflector. The insulating sheet, which may be of transparent plastic, is provided with T-shaped tabs which interlock with slots in the circuit board to secure the aligned position of the insulating sheet thereon. In assembling the photoflash unit, the insulating sheet is placed on the circuit board prior to mounting the lamps, and the T-shaped tabs of the sheet are inserted in the circuit board slots to secure the aligned location of holes in the insulating sheet with lamp-mounting eyelets in the circuit board.

Abstract translation: 一种紧凑的闪光灯单元，包括多个闪光灯，其具有连接到其上包含用于顺序闪烁灯的辐射敏感切换电路的电路板的引入线。 导电反射器面板位于灯和电路板之间，并且电绝缘材料片插入在反射器和电路板之间，以防止导电反射器在电路板上的电路短路。 可以是透明塑料的绝缘片设置有与电路板中的槽互锁的T形突片，以将绝缘片的对准位置固定在其上。 在组装闪光灯单元时，在安装灯之前将绝缘片放置在电路板上，并且将片材的T形突片插入电路板槽中，以将具有灯的绝缘片中的孔的对准位置固定 - 在电路板上安装孔眼。