公开(公告)号：US07291037B2

公开(公告)日：2007-11-06

申请号：US11476849

申请日：2006-06-29

Applicant: Ching-Cheng Tsai

Inventor： Ching-Cheng Tsai

IPC: H01R12/24

CPC classification number: H05K1/118 ,  H01R12/592 ,  H05K1/117 ,  H05K2201/09154 ,  H05K2203/0346 ,  Y10S439/951

Abstract: A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads do not reach a front edge of the flexible substrate and are separated from the front edge of the flexible substrate by a distance.

Abstract translation: 提供一种柔性电路板，包括具有上表面和下表面的柔性基板和覆盖在柔性基板的上表面上的多个导电焊盘。 导电焊盘的前端没有到达柔性基板的前边缘并且与柔性基板的前边缘分开一段距离。

公开(公告)号：US20070012788A1

公开(公告)日：2007-01-18

申请号：US11181741

申请日：2005-07-15

Applicant: Chien-Yuan Chen

Inventor： Chien-Yuan Chen

IPC: G06K19/06

CPC classification number: H05K3/0052 ,  H05K3/0032 ,  H05K3/284 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1316

Abstract: A manufacturing process for encapsulation and cutting memory cards, embodying a full-wafer circuit board substrate, whereon is distributed a plurality of sets of a number of chip modules assembled from passive component members, flash memory modules and control chips. A mold is then used to carry out full-wafer compression molding to seal the chip modules and passive component members onto the circuit board substrate, thereby forming a plurality of sets of memory cards having complete electric functionality. Grooves are formed between neighboring memory cards when carrying out the compression molding process, which enable direct chamfering of edges and corners of each of the memory cards after cutting, thereby eliminating the need for further finishing.

Abstract translation: 一种用于封装和切割存储卡的制造方法，体现了全晶片电路板基板，其中分布有多组由无源元件，闪存模块和控制芯片组装的芯片模块。 然后使用模具进行全晶片压缩成型以将芯片模块和无源组件构件密封到电路板基板上，从而形成具有完整电功能的多组存储卡。 在执行压缩成型工艺时，在相邻的存储卡之间形成槽，这能够在切割之后直接倒角每个存储卡的边缘和拐角，从而不需要进一步精加工。

公开(公告)号：US07153143B2

公开(公告)日：2006-12-26

申请号：US11292082

申请日：2005-12-02

Applicant: Thomas Muench

Inventor： Thomas Muench

IPC: H01R12/00

CPC classification number: H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

公开(公告)号：US20060244150A1

公开(公告)日：2006-11-02

申请号：US11381357

申请日：2006-05-02

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/48

CPC classification number: G11C5/04 ,  B82Y10/00 ,  G01R31/2822 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0243 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

公开(公告)号：US07112098B2

公开(公告)日：2006-09-26

申请号：US10759304

申请日：2004-01-20

Applicant: Tsutomu Matsuo ,  Masakazu Nagata

Inventor： Tsutomu Matsuo ,  Masakazu Nagata

IPC: H01R24/00

CPC classification number: H05K1/117 ,  H01R12/722 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/2027

Abstract: A transmission board (10) comprises a frame body (30) and a surface board (20) supported by the frame body (30) and having a transmission circuit. The frame body (30) has plugging edges (33, 34) that project from the edges of the surface board (20) for guiding the terminals of mating connectors to connection pads on the surface board (20). The plugging edges have guiding slopes 33A and 33B, and 34A and 34B. At least the plugging edges of the frame body (30) are made of a metal or resin molding.

Abstract translation: 传输板（10）包括框体（30）和由框体（30）支撑并具有传输电路的表面板（20）。 框体（30）具有从表面板（20）的边缘突出的插入边缘（33,34），用于将配合连接器的端子引导到表面板（20）上的连接焊盘。 堵塞边缘具有引导斜面33A和33B以及34A和34B。框体（30）的至少堵塞边缘由金属或树脂模塑制成。

公开(公告)号：US06879040B2

公开(公告)日：2005-04-12

申请号：US10649005

申请日：2003-08-26

Applicant: Kee Yean Ng ,  Gurbir Singh

Inventor： Kee Yean Ng ,  Gurbir Singh

IPC: H01C1/14 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L33/486 ,  H01C1/14 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Abstract translation: 可表面安装的电子设备包括具有用于安装设备的第一表面的主体。 第一表面在其中具有凹部。 电触头设置在第一表面。 电触点包括形成所述凹部的至少一个内表面的至少一部分的第一部分。

公开(公告)号：US06818168B2

公开(公告)日：2004-11-16

申请号：US10092186

申请日：2002-03-06

Applicant: Refugio C. Morales

Inventor： Refugio C. Morales

IPC: B29C5902

CPC classification number: B29C67/0044 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0195 ,  H05K2203/0228

Abstract: The present invention relates to a tool, and method of its use, that puts a pair of bevels onto an edge of a printed circuit board (PCB) so that the PCB can be inserted into an expansion slot of a computer. The tool has a bevel wheel, preferably with a bi-laterally symmetrical angle channel shape, that is connected to a carriage. The bevel wheel rolls along the carriage while the bevel wheel is pressed onto the edge of the PCB so as to form the pair of bevels on the edge of the PCB. No material is removed from the PCB while forming the pair of bevels. The bevel wheel is forced upon the edge using a piston that monitors and regulates the pressure applied to the edge of the PCB in order to achieve a preferred height and angular orientation of the pair of bevels.

Abstract translation: 本发明涉及一种工具及其使用方法，其将一对斜面放置在印刷电路板（PCB）的边缘上，使得PCB可以插入到计算机的扩展槽中。 该工具具有斜盘轮，优选地具有连接到托架的双向对称的角形通道形状。 斜齿轮沿滑架滚动，而斜齿轮被压在PCB的边缘上，以便在PCB的边缘上形成一对斜面。 在形成一对斜面时，没有从PCB上移除材料。 使用活塞来迫使斜齿轮在边缘上，所述活塞监测和调节施加到PCB的边缘的压力，以便实现该对斜面的优选高度和角度定向。

公开(公告)号：US06764937B1

公开(公告)日：2004-07-20

申请号：US10385487

申请日：2003-03-12

Applicant: Hubert Allen Vander Plas ,  Frank Berauer

Inventor： Hubert Allen Vander Plas ,  Frank Berauer

IPC: H01L244

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L29/0657 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H05K3/3452 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/099 ,  H05K2203/0568 ,  H05K2203/1394 ,  H01L2224/0401

Abstract: A method for depositing a solder layer or solder bump on a sloped surface. The method includes etching a sloped surface on a planar semiconductor substrate, depositing a solder-wettable layer on the sloped surface, masking the wettabler layer with a coating layer to control the position of the solder deposition, and using an organic film to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Also, a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.

Abstract translation: 一种用于在倾斜表面上沉积焊料层或焊料凸块的方法。 该方法包括蚀刻平面半导体衬底上的倾斜表面，在倾斜表面上沉积焊料可润湿层，用涂层掩蔽湿润层以控制焊料沉积的位置，并使用有机膜防止焊料 不会沉积在可湿性层或涂层之上的区域。 此外，其中仅在倾斜表面上形成焊料层或焊料凸块的半导体器件结构。

公开(公告)号：US20030222335A1

公开(公告)日：2003-12-04

申请号：US10448921

申请日：2003-05-29

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa ,  Tsunenori Yoshida ,  Yoshihisa Yamashita ,  Hiroyuki Ishitomi

IPC: H01L023/02

CPC classification number: H01G2/065 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.

Abstract translation: 本发明的电路部件封装包括：安装构件，包括基板和设置在基板上的布线图案;电路部件，包括部件主体和设置在部件主体的端部的外部电极，电路部件布置在 安装构件和将外部电极与布线图案电连接的导电材料。 在电路部件中，部件主体的形状使得设置有外部电极的部件主体的第一部分比部件主体的第二部分薄，第二部分是外部电极不在其上的部分 并且进一步地，外部电极相对于包含组件主体的预定表面的参考平面布置在组件主体位于其一侧的区域中。 电路部件设置在安装部件上，使得部件主体与安装部件接触。 当电路部件安装在安装部件上时，部件主体的预定表面是组件主体的与安装部件相对的表面。

公开(公告)号：US06501663B1

公开(公告)日：2002-12-31

申请号：US09514484

申请日：2000-02-28

Applicant: Alfred I-Tsung Pan

Inventor： Alfred I-Tsung Pan

IPC: H01L2352

CPC classification number: H01L21/288 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4053 ,  H05K2201/0305 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2203/013 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/00014

Abstract: A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system includes a plurality of contiguously interconnected electrically conductive droplets such as solder ball droplets produced by a print-on-demand solder jet system. An interconnect is formed by repeatedly ejecting the conductive droplets along a predetermined path between components to be connected. Each ejected droplet is disposed adjacent to another ejected droplet to form a contiguously linked chain of droplets that bridge a physical gap between the components. A non-conductive coating can be deposited on the interconnect to protect the interconnect from damage and to encase the interconnect. The electrical resistance of the interconnect can be reduced by reflowing the droplets that form the interconnect, whereby the coating that encses the interconnect is operative to maintain the shape of the interconnect after reflow.

Abstract translation: 公开了一种三维互连系统。 互连系统电连接设置在不同物理平面上的电气设备。 互连系统包括多个连续互连的导电液滴，例如由按需喷墨喷墨系统产生的焊球液滴。 通过沿要连接的部件之间的预定路径反复喷射导电液滴形成互连。 每个喷射的液滴被设置成与另一个喷射的液滴相邻以形成连接的液滴链，其桥接组件之间的物理间隙。 可以在互连上沉积非导电涂层，以保护互连免受损坏并包围互连。 可以通过回流形成互连的液滴来降低互连的电阻，由此包裹互连的涂层可操作以在回流之后保持互连的形状。