Abstract:
There is provided a charged particle beam system capable of reducing contamination of at least one sample. The charged particle beam system (100) has a sample chamber (15) in which the sample (S) is irradiated with a charged particle beam. The system (100) has a receptacle chamber (21) which is connected into the sample chamber (15) via an isolation valve (25) and in which the sample (S) is accommodated. The system further includes a transport mechanism (22) for conveying the sample (S) from the receptacle chamber (21) into the sample chamber (15), an exhaust portion (24) for vacuum pumping the receptacle chamber (21), and a cleaning portion (30) for cleaning the sample (S) accommodated in the receptacle chamber (21).
Abstract:
A sample holder for an electron microscope has multiple sample stands, can allow at least one sample stand to move, and enables multiple samples for a transmission electron microscope to be prepared by a focused ion beam apparatus. A holder tip opening is provided in a tip of the sample holder. A back end of the sample holder has a knob, a rolling mechanism, a coarse adjustment mechanism, and a connector. By pressing the knob, fixation of the rolling mechanism is canceled, and the back end from the rolling mechanism and the tip of the sample holder will rotate. This rolling mechanism enables arrangement of the samples to be rotated in both the observing of a sample and the preparing of a sample for a transmission electron microscope with the focused ion beam apparatus. Moreover, the sample stand is movable by the coarse adjustment mechanism and the fine adjustment mechanism.
Abstract:
Mineral samples for use in analytical instruments are created by a system that greatly reduces the sample preparation time and facilitates automation. For example, in some implementations, rather than grinding to expose the interior of mineral particles in sample plug containing mineral particles in an epoxy compound, the sample plug is sliced with a saw, which more rapidly provides in many applications a sufficiently smooth surface on the exposed particle surfaces for observation. Rather than slowly mixing a slow curing epoxy to avoid introducing bubbles into the sample plug, some implementations use a fast settle fixative and a mechanical mixture that avoid bubbles.
Abstract:
An automated workpiece processing apparatus including a processing section including a processing module configured for processing a workpiece at a process location, a transport module including a first shuttle stage, a second shuttle stage independent of the first stage, and an end effector connected to at least one of the first and second stages, the end effector being configured to hold and transport the workpiece into and out of the processing module, and having a range of motion, defined by a combination of the first and second stage, extending from a workpiece holding station outside the processing module to the processing location inside the processing module so the end effector defines a processing stage of the processing module, and an automated loading and transport section including a load port module through which workpieces are loaded into the automated loading and transport section, and being communicably connected to the transport module.
Abstract:
This charged particle beam device irradiates a primary charged particle beam generated from a charged particle microscope onto a sample arranged on a light-emitting member that makes up at least a part of a sample base, and, in addition to obtaining charged particle microscope images by the light-emitting member detecting charged particles transmitted through or scattered inside the sample, obtains optical microscope images by means of an optical microscope while the sample is still arranged on the sample platform.
Abstract:
An automated workpiece processing apparatus including a processing section including a processing module configured for processing a workpiece at a process location, a transport module including a first shuttle stage, a second shuttle stage independent of the first stage, and an end effector connected to at least one of the first and second stages, the end effector being configured to hold and transport the workpiece into and out of the processing module, and having a range of motion, defined by a combination of the first and second stage, extending from a workpiece holding station outside the processing module to the processing location inside the processing module so the end effector defines a processing stage of the processing module, and an automated loading and transport section including a load port module through which workpieces are loaded into the automated loading and transport section, and being communicably connected to the transport module.
Abstract:
A workpiece carrier comprises a first plate having a first outer diameter, a first inner diameter, and a first recess extending a first distance from the first inner diameter toward the first outer diameter. The workpiece carrier further comprises a second plate having a second outer diameter, a second inner diameter, and a second recess extending a second distance from the second inner diameter toward the second outer diameter. A plurality of mating features associated with the first plate and second plate are configured to selectively fix a position of a first workpiece between the first plate and second plate within the first recess and second recess.
Abstract:
An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.
Abstract:
A film deposition method using a film deposition apparatus, includes: a film deposition process step in which at least a substrate is mounted on at least one of the circular concave portions and a film is deposited on the substrate; and a particle reducing process step performed before or after the film deposition process step, in which particles in the vacuum chamber are reduced without mounting substrates on the circular concave portions, the particle reducing process step including, a step of supplying a first gas to the vacuum chamber; a step of generating plasma from the first gas by supplying high frequency waves to a plasma generating device provided for the vacuum chamber; and a step of exposing the plurality of circular concave portions, on each of which a substrate is not mounted, to the plasma while rotating the susceptor.
Abstract:
A method for mounting a specimen on a specimen carrier for milling in an ex-situ lift-out (EXLO) milling process is described where “cross-section” specimens, plan view specimens, or bulk specimens may be lifted-out for analysis. The method comprising positioning the specimen on a recessed surface within a specimen carrier top surface so that a region to be milled is centered about a carrier opening formed through the specimen carrier. Peripheral edges of the specimen are then wedged against inwardly sloping side walls framing the recessed surface. Finally, the specimen is mounted to the specimen carrier so that a path of a milling beam intersects the region to be milled and carrier opening.