公开(公告)号：US5310967A

公开(公告)日：1994-05-10

申请号：US68036

申请日：1993-05-28

Applicant: Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

Inventor： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

IPC: H01L23/12 ,  G02F1/13 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/225 ,  H01L21/76886 ,  G02F1/1309 ,  H05K2201/0394 ,  H05K2201/1028 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/20 ,  H05K3/28 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49742

Abstract: A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

公开(公告)号：US5310353A

公开(公告)日：1994-05-10

申请号：US67482

申请日：1993-05-25

Applicant: Steven R. Parrish ,  David E. Champlin

Inventor： Steven R. Parrish ,  David E. Champlin

IPC: B60R16/02 ,  B60R16/023 ,  H01R9/28 ,  H02B1/20 ,  H05K3/10 ,  H05K3/32 ,  H05K7/02 ,  H01R9/00

CPC classification number: B60R16/0238 ,  H01R9/28 ,  H02B1/20 ,  H05K3/103 ,  H05K7/026 ,  H05K2201/098 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K3/107 ,  H05K3/325 ,  Y10T29/49162

Abstract: A flexibly configurable power distribution center in which an electrical signal or power is routed by implementing an electrical interconnection at any point along a path of a conductor. Insulative portions or boards within an electrical power distribution center are fabricated having a plurality of recesses for receiving electrical conductors therein. The electrical conductors are in the form of flexibly configurable strips of metal such as steel, copper, brass or the like, which are disposed within the recesses in the insulating portions. The strips of metal are dimensioned and disposed within the recesses forming an exposed conductive ridge which is mechanically and electrically engageable by interface terminals along substantially the entire length of the conductor. The interface terminals have at least one female mating portion for mechanically mating with the conductive ridge to establish electrical continuity therewith. A plurality of recesses can be configured within the insulating portions, and the metal strip can be disposed within selected recesses or portions of recesses as desired to provide various alternative conductive trace configurations with the same insulative portion. The strip metal is cut to desired lengths for automated or manual installation within the selected recesses.

Abstract translation: 一种灵活配置的配电中心，其中通过沿着导体的路径的任何点实施电互连来传送电信号或电力。 制造配电中心内的绝缘部分或板，其具有用于在其中接纳电导体的多个凹部。 电导体是柔性可配置的金属条，例如钢，铜，黄铜等，它们设置在绝缘部分的凹槽内。 金属条尺寸设置在形成暴露的导电脊的凹槽内，该裸露的导电脊沿导体的大致整个长度由接口端子机械地和电可接合。 接口端子具有至少一个阴配合部分，用于与导电脊部机械地配合以与其形成电连续性。 可以在绝缘部分内配置多个凹槽，并且金属带可以根据需要设置在所选择的凹部或凹部的部分内，以提供具有相同绝缘部分的各种替代的导电迹线配置。 将带状金属切割成所需长度，以在所选择的凹部内进行自动或手动安装。

公开(公告)号：US5289632A

公开(公告)日：1994-03-01

申请号：US981458

申请日：1992-11-25

Applicant: Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

Inventor： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

IPC: H01L23/12 ,  G02F1/13 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/225 ,  H01L21/76886 ,  G02F1/1309 ,  H05K2201/0394 ,  H05K2201/1028 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/20 ,  H05K3/28 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49742

Abstract: A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

Abstract translation: 通过将导线与衬底的选定区域并置定位来将导线施加到衬底; 将导线接合到基板上; 以及将导线从其中悬挂有导线的载体分离。 载体具有由侧壁限定的载体开口，并且导电材料被载体开口的侧壁悬挂以嵌入载体开口中，并形成导电线。

公开(公告)号：US5266745A

公开(公告)日：1993-11-30

申请号：US760692

申请日：1991-09-16

Applicant: Dieter Seipler

Inventor： Dieter Seipler

IPC: H01L27/01 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/246 ,  H05K3/4092 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09754 ,  H05K2201/1028

Abstract: A thick film hybrid arrangement has a plurality of ceramic foils provided with conductor paths and superimposed over one another, a support for supporting the ceramic foils, and a plurality of thin metal lugs located between the ceramic foils for contacting the conducting paths. The metal lugs extend outwardly beyond at least the ceramics foils so as to form outer contacts.

Abstract translation: 厚膜混合布置具有多个陶瓷箔，其设置有导体路径并彼此叠置，用于支撑陶瓷箔的支撑件和位于陶瓷箔之间用于接触导电路径的多个薄金属突起。 金属凸耳向外延伸至少至少陶瓷箔，以形成外触点。

公开(公告)号：US4843190A

公开(公告)日：1989-06-27

申请号：US61514

申请日：1987-06-15

Applicant: Laurentius M. Verhoeven

Inventor： Laurentius M. Verhoeven

IPC: H01R43/02 ,  B23K1/00 ,  H05K1/11 ,  H05K3/24 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K1/117 ,  H05K2201/1028 ,  H05K3/305 ,  Y10T29/49213

Abstract: Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces.A method for mounting contact surface elements on the ends of strip conductors along the edge of a substrate. A solder mixed with adhesive is applied to the soldering surface at ends of the strip conductors. Contact surfaces each having a refined, f.i. gold plated, top surface and an activated, f.i. tin plated, bottom surface, are placed respectively on each soldering surface. Heat is applied to melt the solder particles and provide a good electrical connection between each surface contact and strip conductor. The substrate mounted with the contact elements has a plurality of components mounted on one surface thereof and interconnected by the strip conductors. The substrate is adapted to be plugged into an edge connector along its edge with the mounted contact surface elements.

公开(公告)号：US4774634A

公开(公告)日：1988-09-27

申请号：US820239

申请日：1986-01-21

Applicant: Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

Inventor： Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/321 ,  H05K1/095 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/09472 ,  H05K2201/09772 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2203/1453 ,  H05K3/28 ,  H05K3/4664 ,  H05K3/4685 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A printed circuit assembly includes surface mounted circuit components held in place on a printed circuit board by a rigid connection. The outwardly extending leads of the circuit component are bonded to conductive areas of the board by an electrically conducting flexible adhesive. The combination of a rigid mechanical connection between the body portion of the circuit component and the board and a flexible, electrically conductive connection between each lead end and the board provides an arrangement capable of withstanding shock loading, as well as vibrational and bending forces to which the assembly might be subjected. The assembly lends itself to relatively inexpensive circuit boards produced by printing techniques, typically including applied metal buses that serve as low resistance shunts to the power connections of the circuit components.

Abstract translation: 印刷电路组件包括通过刚性连接保持在印刷电路板上的适当位置的表面安装电路部件。 电路部件的向外延伸的引线通过导电柔性粘合剂粘合到板的导电区域。 电路部件的本体部分与电路板之间的刚性机械连接与每个引线端与电路板之间的柔性导电连接的组合提供了能够承受冲击载荷以及振动和弯曲力的装置， 装配可能会受到影响。 该组件本身适用于通过印刷技术生产的相对便宜的电路板，通常包括用作电路部件的电源连接的低电阻分流器的应用金属总线。

公开(公告)号：US4713730A

公开(公告)日：1987-12-15

申请号：US785302

申请日：1985-10-07

Applicant: Ben R. Hallford ,  Robert W. McKenzie

Inventor： Ben R. Hallford ,  Robert W. McKenzie

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K7/02

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0397 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/3421 ,  H05K3/4084

Abstract: A drop-in module in an RF frequency amplifier circuit is illustrated having space feedback between the gate and drain terminals, and having a unique mounting technique for electrically connecting the source terminals to the ground plane on the opposite side of the substrate portion of the drop-in module. The electrical connection is accomplished by using a U-shaped piece of strap metal, which is inserted in two slots with the legs or tabs of the U-shaped strap metal being bent over to be soldered to the source leads, while the bit portion of the U-shaped member is soldered to the ground plane on the opposite side of the substrate. This allows easy attachment and removal of the FET to the exposed electric circuitry, while still maintaining a definable and appropriate low impedance electrical path from the source leads to the ground plane.

Abstract translation: RF频率放大器电路中的插入模块被示出为在栅极和漏极端子之间具有空间反馈，并且具有独特的安装技术，用于将源极端子与液滴的衬底部分的相对侧上的接地平面电连接 -in模块。 电连接是通过使用U形带状金属片来实现的，该带状金属片被插入两个槽中，其中U形带状金属的腿或突片被弯曲以焊接到源极，而位的 U形构件在衬底的相对侧被焊接到接地平面。 这允许容易地将FET附接和去除到暴露的电路，同时仍保持从源极引线到接地平面的可定义和适当的低阻抗电路径。

公开(公告)号：US4402450A

公开(公告)日：1983-09-06

申请号：US295043

申请日：1981-08-21

Applicant: Bruce C. Abraham ,  Charles R. Fegley

Inventor： Bruce C. Abraham ,  Charles R. Fegley

IPC: B23K3/06 ,  H05K3/34 ,  B23K1/12

CPC classification number: B23K3/06 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0305 ,  H05K2201/1025 ,  H05K2201/1028 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2203/033 ,  H05K2203/0405 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K3/3442 ,  Y02P70/613

Abstract: Contact pads (18) of a device (12) are adapted for bonding components such as contacts of a circuit assembly thereto. At least two of the pads (18) are interconnected with a member (34) containing bonding material. Portions of the member (34) lying adjacent the pads (18) are then removed to form isolated bodies (42) containing bonding material on the pads (18). The member (37) may be of a composite structure containing bonding material associated with a hard element (61). The bodies (42) formed therefrom contain a hard element portion (62) having dimensions which remain substantially unchanged to define a desired minimum distance between respective pads (18) and contacts when they are bonded together.

Abstract translation: 设备（12）的接触焊盘（18）适于将诸如电路组件的触点的组件粘合到其上。 至少两个焊盘（18）与包含接合材料的构件（34）互连。 然后移除位于焊盘（18）附近的部件（34）的部分，以形成在焊盘（18）上包含结合材料的隔离体（42）。 构件（37）可以是包含与硬质元件（61）相关联的接合材料的复合结构。 由此形成的主体（42）包含具有保持基本上不变的尺寸的硬元件部分（62），以便当它们结合在一起时在相应的焊盘（18）和触点之间限定期望的最小距离。

公开(公告)号：US4392181A

公开(公告)日：1983-07-05

申请号：US259748

申请日：1981-05-01

Applicant: Gary D. Jabben

Inventor： Gary D. Jabben

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01R12/52 ,  H05K2201/1028 ,  H05K2201/10946

Abstract: A row of connectors 14 is assembled on a printed circuit board 11 by inserting a leg section 41 of each terminal 14 into a mounting aperture 32 and bending a flat contact portion 42 of each terminal 14 to fit into a pocket 47 formed in the surface of the board. Printed circuit conductors 13 are next screened onto the board 11 with a portion of the conductors positioned over some of the contact portions 42 of terminals 14 to provide edge connections for the printed circuits 12. Metal strips conductors 13 are then fastened to the board 11 and end portions thereof are welded to the contact portions 42 of other terminals 14 to provide edge connections for the metal strips conductors 13.

Abstract translation: 一排连接器14通过将每个端子14的腿部41插入到安装孔32中并弯曲每个端子14的平坦接触部分42而装配在印刷电路板11上，以装配到形成在 董事会。 印刷电路导体13接下来被屏蔽到板11上，其中一部分导体位于端子14的一些接触部分42上，以提供印刷电路12的边缘连接。金属带导体13然后被固定到板11上， 其端部焊接到其他端子14的接触部分42，以提供用于金属带导体13的边缘连接。

公开(公告)号：US3964666A

公开(公告)日：1976-06-22

申请号：US564007

申请日：1975-03-31

Applicant: Donald Dinella ,  Richard M. Kovaric

Inventor： Donald Dinella ,  Richard M. Kovaric

IPC: B23K35/00 ,  H01H1/02 ,  H01R12/50 ,  H05K1/11 ,  H05K3/12 ,  H05K3/34 ,  H05K3/40 ,  H05K3/24 ,  H05K1/06

CPC classification number: H05K3/4015 ,  B23K35/007 ,  H01R23/70 ,  H05K3/341 ,  H05K1/117 ,  H05K2201/0338 ,  H05K2201/1028 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155

Abstract: In a thermocompressive soldering process, a conductive overlay of a material such as gold is applied to a contact finger of a circuit board.In carrying out this process, the overlay is initially carried on an adhesively coated strip such as a polyimide tape. To transfer the overlay to the contact finger, it is aligned with the contact finger and temporarily attached to the circuit board. A heat conductive resilient sheet is then interposed between the circuit board and a thermode. The thermode is adjusted to engage the contact finger with a predetermined force. The force is resiliently distributed by the interposed sheet. Heat is then applied from the thermode through the resilient sheet to liquefy a solder coating on the overlay and to bond the overlay to the contact finger upon resolidification of the solder. The applied force is sustained during the application of head and during a subsequent cooling period during which the solder resolidifies. The resilient sheet minimizes seepage of solder to the top surface of the overlay and thereby prevents contamination of such surface by the solder.

Abstract translation: 在热压焊工艺中，将诸如金的材料的导电覆盖层施加到电路板的接触指。