Title translation:VERWENDUNG EINER OPFERMASKIERUNGSSCHICHT UNDRÜCKSEITIGERBELICHTUNG贝德埃尔斯通公司VONLÖCHERNZUR AUFNAHME VON LICHTEMITTIERENDEM材料,ZUGEHÖRIGELICHTEMITTIERENDE STRUKTUR
Abstract:
Openings are created in a structure by a process in which a plate is furnished with a sacrificial patterned masking layer divided into multiple laterally separated mask portions. A primary layer of actinic material is provided over the masking layer and in space between the mask portions. Material of the primary layer not shadowed by a mask formed with the mask portions is backside exposed to actinic radiation. Material of the primary layer not exposed to the radiation is removed. Segments of the masking layer not covered by exposed material of the primary layer are then removed. Consequently, openings extend through the primary layer where the segments of the masking layer have been removed. The process is typically employed in forming an optical device such as a flat-panel cathode-ray tube display in which the openings in the primary layer receive light-emissive material.
Abstract:
An electron-emitting device employs a multi-layer resistor (46). A lower layer (48) of the resistor overlies an emitter electrode (42). An electron-emissive element (54) overlies an upper layer (50) of the resistor. The two resistive layers are of different chemical composition. The upper resistive layer is typically formed with cermet. The lower resistive layer is typically formed with a silicon-carbon compound. In fabricating the device, the upper resistive layer normally serves as an etch stop for protecting the lower resistive layer and the emitter electrode during the etch of an overlying dielectric layer (52) to form an opening (56) in which the electron-emissive element is later provided.
Abstract:
A flat panel display (300) having a faceplate structure (320), a backplate structure (330), a focusing structure (333a), and a plurality of spacers (340). The backplate structure includes an electron emitting structure (332) which faces the faceplate structure. The focusing structure has a first surface which is located on the electron emitting structure, and a second surface which extends away from the electron emitting structure. The electrical end of the combination of the focusing structure and the electron emitting structure is located at an imaginary plane located intermediate the first and second surfaces of the focusing structure. The spacers are located between the focusing structure and the light emitting structure. Each spacer is located within a corresponding groove in the focusing structure such that the electrical end of each spacer is located coincident with the electrical end of the combination of the focusing structure and the electron emitting structure.
Abstract:
A method and system for detecting electrical short circuit defects in a plate structure of a flat panel display, for example, a field emission display (FED). In one embodiment, the process first applies a stimulation to the electrical conductors of the plate structure. Next, the process creates an infra-red thermal mapping of a cathode region the FED. For example, an infra-red array may be used to snap a picture of the cathode of the FED.Then , the process analyzes the infra-red thermal mapping to determine a region of the FED which contains the electrical short circuit defect. Another embodiment localizes the defect to one sub-pixel by performing an infra-red mapping of the region which the previous IR mapping process determined to contain the electrical short circuit defect. Then, the process analyzes this infra-red mapping to determine a sub-pixel of the FED which contains the electrical short circuit defect.
Abstract:
A technique for creating a patterned coating entails forming a first region (26) over a primary component (22). A second region (28) is formed over part of the first region. The first region is etched so as to undercut the second region, thereby forming a gap (30) below part of the second region. Coating material is then provided over the structure. Due to the presence of the gap, the coating material accumulates over the structure in a pair of segments spaced apart along the gap. One coating segment (32A) overlies the primary component. The other coating segment (32B) overlies the second region.
Abstract:
A structure and method for forming and anodized raw electrode (200) for a field emission display device. The raw electrode having first non-anodized regions (202, 204) and second anodized regions (206).
Abstract:
A thin film coupled to a substrate includes a first layer (102) which is doped with nitrogen and a second layer (104) which is not doped with nitrogen. Both layers are made of the same material, which is either a transition or a refractory metal. The invention improves stress levels in these layers.
Abstract:
A circuit and method for controlling the color balance of a flat panel display without losing gray scale resolution of the display screen. Within a FED screen (200), a matrix of rows and columns is provided and emitters are situated within each row-column intersection. Rows are activated sequentially by row drivers (220a-220c) and corresponding individual gray scale information (voltages) is driven over the columns by column drivers (240-240c). When the proper voltage is applied across the cathode and anode of the emitters, they release electrons toward a phosphor spot, e.g., red, green, blue, causing an illumination point. Within each column driver (240a-240c), a digital to analog converter (340a-340c) contains two data-in voltage-out transformation functions, a first function corresponding to a first voltage intensity and a second function corresponding to a lesser voltage intensity for a same digital color value.
Abstract:
A cathode structure (200, 203, 204) suitable for a flat panel display is provided with coated emitters (229, 239, 230). The emitters are formed with material, typically nickel, capable of growing to a high aspect ration. These emitters are then coated with carbon containing material (240, 241) for improving the chemical robustness and reducing the work function. One coating process is a DC plasma deposition process in which acetylene is pumped through a DC plasma reactor (301, 305, 313, and 315) to create a DC plasma for coating the cathode structure. An alternative coating process is to electrically deposit raw carbon-based material onto the surface of the emitters, and subsequently reduce the raw carbon-based material to the carbon containing material. Work function of coated emitters is typically reduced by about 0.8 to 1.0 eV.