公开(公告)号：AU5434696A

公开(公告)日：1996-10-16

申请号：AU5434696

申请日：1996-03-28

Applicant: TENCOR INSTRUMENTS

Inventor： JOHNSON RALPH ,  WELLS KEITH ,  GALBRAITH LEE K

IPC: G01N21/88 ,  G01N21/94 ,  G01N21/95

Abstract: Light scattered from illuminated spot on a patterned wafer is first passed through a di-electric filter and then by an optical fiber bundle to a detector. The di-electric filter controls the aperture of the light that is passed to a desired azimuth angle and the optical fiber further limits the aperture.

公开(公告)号：CH685519A5

公开(公告)日：1995-07-31

申请号：CH95093

申请日：1993-03-29

Applicant: TENCOR INSTRUMENTS

Inventor： MARXER NORBERT DR

IPC: G01N21/88 ,  G01N21/93 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G11B5/84

公开(公告)号：FR2673725A1

公开(公告)日：1992-09-11

申请号：FR9102547

申请日：1991-03-04

Applicant: TENCOR INSTRUMENTS

Inventor： STANLEY STOKOWSKI ,  DAVID WOLZE ,  NEUKERMANS ARMAND P

IPC: G01B11/06 ,  G01N23/227

Abstract: The invention relates to the assessment of the presence or absence of contaminating materials It relates to a method in which the locations (39) to be studied are successively illuminated at the surface of an electrically conducting material (33), this illumination stimulating the photoelectric emission of material below each location. An electron collector device (41) measures the photoelectric current, and another electron collector (49), placed at a distance, makes it possible to compensate for the capacitive effects existing between the surface of the conducting material (33) and the first collector device (41). Application to the analysis of the surfaces of semiconductor wafers during the manufacture of integrated circuits.

公开(公告)号：DE4106841A1

公开(公告)日：1992-09-10

申请号：DE4106841

申请日：1991-03-04

Applicant: TENCOR INSTRUMENTS

Inventor： STOKOWSKI STANLEY ,  WOLZE DAVID ,  NEUKERMANS ARMAND P

IPC: G01B11/06 ,  G01N23/227

Abstract: Methods for determining the presence or absence of, and the thickness or other spacial extent of, a contaminant layer at each of a plurality of two or more sites on the surface of an electrically conductive material such as a semiconductor, a metal or a metal silicide. The invention uses a change in photoemission current from an illuminated spot on the surface to determine the presence and extent of a contaminant layer at the illuminated site. Compensation is provided for the effects of capacitive current and photovoltaic current. The invention provides a pattern of illumination sites on the conductor surface that can, if desired, cover all points on the surface.

公开(公告)号：WO1996030747A1

公开(公告)日：1996-10-03

申请号：PCT/US1996004273

申请日：1996-03-28

Applicant: TENCOR INSTRUMENTS

Inventor： TENCOR INSTRUMENTS ,  JOHNSON, Ralph ,  WELLS, Keith ,  GALBRAITH, Lee, K.

IPC: G01N21/88

CPC classification number: G01N21/94 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956

Abstract: Light scattered from an illuminated spot (54) on a patterned wafer (56) is first passed through a dielectric filter (74) and then through an optical fiber bundle (76) to a detector (72). The filter (74) controls the aperture of the light that is passed to a desired azimuth angle and the optical fiber bundle (76) further limits the aperture.

Abstract translation: 从图案化晶片（56）上的照明光点（54）散射的光首先通过介质滤光器（74），然后通过光纤束（76）传送到检测器（72）。 滤光器（74）控制被传递到所需方位角的光的孔径，并且光纤束（76）进一步限制光圈。

公开(公告)号：WO1995003540A1

公开(公告)日：1995-02-02

申请号：PCT/US1993009526

申请日：1993-10-05

Applicant: TENCOR INSTRUMENTS

Inventor： TENCOR INSTRUMENTS ,  WELLS, Keith, B. ,  NGUYEN, Hung ,  JOHNSON, Ralph, T. ,  LESLIE, Brian, C.

IPC: G01N21/88

CPC classification number: G01N21/94 ,  G01N21/95607

Abstract: A method of locating particle and defect features on a periodically patterned surface (16) uses multiple threshold intensity levels to identify features in the data stream produced by scanning the surface with a light beam (12) and detecting the light scattered (22) from the surface. High thresholds are assigned to regions of the surface with high background scatter, while low thresholds are assigned to regions of the surface with low background scatter. The scattered light (22) is detected with a wide dynamic range detector producing high resolution 12-bit pixel data capable of resolving the smallest particles and defects of interest in low scatter regions, while avoiding saturation in high scatter regions. Periodic pattern features (56) are removed from the data by mapping features from a plurality of periodically repeating die on the surface to a single die map and looking for overlapping features.

Abstract translation: 在周期性图案化表面（16）上定位颗粒和缺陷特征的方法使用多个阈值强度水平来识别通过用光束（12）扫描表面而产生的数据流中的特征，并且从 表面。 高阈值被分配给具有高背景散射的表面的区域，而低阈值被分配给具有低背景散射的表面的区域。 通过宽动态范围检测器检测散射光（22），产生高分辨率的12位像素数据，能够解析低散射区域中最小的粒子和感兴趣的缺陷，同时避免高散射区域的饱和。 通过将表面上的多个周期性重复的模具的特征映射到单个管芯图并查找重叠特征，从数据中去除周期性图案特征（56）。

公开(公告)号：WO1994008204A1

公开(公告)日：1994-04-14

申请号：PCT/US1993009318

申请日：1993-09-30

Applicant: TENCOR INSTRUMENTS

Inventor： TENCOR INSTRUMENTS ,  WHEELER, William, R.

IPC: G01B07/28

CPC classification number: G01B7/34

Abstract: A stylus profilometer having a counterbalanced stylus with a motion transducer using a vane (41) moving between parallel, spaced-apart, conductive plates (35 and 37) which damp the motion of the vane by means of trapped air. The vane forms an electrode with the plates so that the combination is a pair of capacitors in a balanced bridge arrangement. Motion of the stylus causes an unbalance of the bridge indicative of the extent of stylus motion. A lever arm (59) associated with the stylus has a tip (57) influenced by a magnetic field which biases the stylus or controls force on a surface to be measured. The entire assembly has a very low moment of inertia to reduce the effects of vibration on the stylus and thereby increase resolution of the device and reduce damage to the substrate.

Abstract translation: 一种具有平衡触笔的触笔轮廓仪，其具有运动换能器，该运动传感器使用在平行的，间隔开的导电板（35和37）之间移动的叶片（41），其通过被捕获的空气来阻碍叶片的运动。 叶片形成具有板的电极，使得组合是平衡桥布置的一对电容器。 手写笔的运动导致桥梁的不平衡，指示触针运动的程度。 与触针相关联的杠杆臂（59）具有尖端（57），其受到磁场的影响，该磁场偏压触针或控制待测表面上的力。 整个组件具有非常低的惯性矩，以减少触针上的振动的影响，从而增加装置的分辨率并减少对基板的损坏。

公开(公告)号：WO1997046865A1

公开(公告)日：1997-12-11

申请号：PCT/US1997009650

申请日：1997-06-03

Applicant: TENCOR INSTRUMENTS

Inventor： TENCOR INSTRUMENTS ,  LESLIE, Brian, C. ,  NIKOONAHAD, Mehrdad ,  WELLS, Keith, B.

IPC: G01N21/00

CPC classification number: G01N21/95607 ,  G01N21/94 ,  G01N21/9501

Abstract: In an optical scanning system (200) for detecting particles and pattern defects on a sample surface (240), a light beam (238) is focused to an illuminated spot on the surface and the spot is scanned across a scan line. A detector (11b) is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot.

Abstract translation: 在用于检测样品表面（240）上的颗粒和图案缺陷的光学扫描系统（200）中，将光束（238）聚焦到表面上的照明点，并且扫描线上扫描光点。 检测器（11b）位于与表面相邻的位置，以收集来自检测器包括传感器的一维或二维阵列的点的散射光。 沿着扫描线的多个位置中的每一个处从照明点散射的光被聚焦到阵列中的对应的传感器上。 相对于照明光束对称放置的多个检测器检测来自光斑的横向和前向散射光。

公开(公告)号：WO1996018093A1

公开(公告)日：1996-06-13

申请号：PCT/US1995016172

申请日：1995-12-08

Applicant: TENCOR INSTRUMENTS ,  NIKOONAHAD, Mehrdad ,  STOKOWSKI, Stanley, E.

Inventor： TENCOR INSTRUMENTS

IPC: G01N21/00

CPC classification number: G01N21/95623 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8825 ,  G01R31/2831 ,  G01R31/308 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A high sensitivity and high throughput surface inspection system directs a focused beam of light (38) at a grazing angle towards the surface to be inspected (40). Relative motion is caused between the beam (38) and the surface (40) so that the beam (38) scans a scan path covering substantially the entire surface and light scattered along the path is collected for detecting anomalies. The scan path comprises a plurality of arrays of straight scan path segments. The focused beam of light (38) illuminates an area of the surface between 5-15 microns in width and this system is capable of inspecting in excess of about 40 wafers per hour for 150 millimeter diameter wafers (6-inch wafers), in excess of about 20 wafers per hour for 200 millimeter diameter wafers (8-inch wafers) and in excess of about 10 wafers per hour for 300 millimeter diameter wafers (12-inch wafers).

Abstract translation: 高灵敏度和高通量的表面检查系统将聚焦光束（38）以掠射角度朝向要检查的表面（40）引导。 在光束（38）和表面（40）之间产生相对运动，使得光束（38）扫描覆盖基本上整个表面的扫描路径，并且收集沿着路径散射的光以检测异常。 扫描路径包括多个直扫描路径段阵列。 聚焦光束（38）照亮了宽度为5-15微米之间的表面区域，该系统能够超过150毫米直径的晶片（6英寸晶圆）超过约40个晶片，过量 对于200毫米直径的晶片（8英寸晶圆），每小时约20个晶片，对于300毫米直径的晶片（12英寸晶圆），每小时超过约10个晶片。

公开(公告)号：WO1985000885A1

公开(公告)日：1985-02-28

申请号：PCT/US1984000145

申请日：1984-01-30

Applicant: TENCOR INSTRUMENTS

Inventor： TENCOR INSTRUMENTS ,  GALBRAITH, Lee, K. ,  PECEN, Jiri

IPC: G01N21/00

CPC classification number: G01N21/93 ,  G01N21/4785 ,  G01N21/94 ,  G01N21/9501

Abstract: A test device for calibrating an optical scanner wherein microscopic patterns (21) of light scattering elements (13, 15) simulate the scattering of light from particles or flaws of different sizes. Simulation of different particles sizes is achieved by means of clusters (25, 29, 33, 37) or arrays of these light scattering elements having different areawise densities. Patterns of such clusters or arrays are disposed on a surface with intervening spaces (17) where a random assortment of foreign particles may be expected. In this manner, the foreign particles may be directly compared to a test pattern. The test surface may be a semiconductor wafer (41) having a thin, inert coating with openings (45) therein forming the light scattering elements. The openings may be made by photolithographic techniques, i.e., masking and etching, so that various patterns on a surface may be all created simultaneously by the same process.

Abstract translation: 用于校准光学扫描仪的测试装置，其中光散射元件的微观图案模拟来自不同尺寸的颗粒或缺陷的光的散射。 通过具有不同面积密度的这些光散射元件的簇或阵列来实现不同粒径的模拟。 这种簇或阵列的图案设置在具有中间空间的表面上，其中可以预期随机分类的异物。 以这种方式，外来颗粒可以直接与测试图案进行比较。 测试表面可以是具有薄的惰性涂层的半导体晶片，其中开口形成光散射元件。 开口可以通过光刻技术制成，即掩模和蚀刻，使得表面上的各种图案可以全部通过相同的工艺同时制作。