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公开(公告)号：KR101139759B1
公开(公告)日：2012-04-26
申请号：KR1020090088950
申请日：2009-09-21
Applicant: 도레이첨단소재 주식회사
IPC: C08L63/02 , C08K5/3417 , C08L9/00 , H01L21/60
CPC classification number: H01L24/81 , H01L2224/73204 , H01L2224/83192 , H01L2924/14 , H01L2924/00
Abstract: 본 발명은 반도체 칩의 배선을 보호 및 강화하기 위한 비유동성 언더필 수지 조성물(no-flow underfill)에 관한 것이다. 본 발명에서는 에폭시수지와 이미드 결합 구조를 갖는 산경화제를 포함하는 비유동성 언더필용 수지 조성물(no-flow underfill)을 제공한다. 본 발명의 비유동성 언더필용 수지 조성물은 솔더링 공정 온도에서 신속하게 경화가 가능하며, 경화 후 내크랙성(crack resistance) 및 내열 안정성이 우수하다.
반도체, 비유동성 언더필, 이미드 결합 구조, 산경화제, 에폭시 수지-
公开(公告)号：KR101132346B1
公开(公告)日：2012-04-05
申请号：KR1020100008320
申请日：2010-01-29
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J4/02 , C09J7/02 , H01L21/30
Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.
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公开(公告)号：KR101117757B1
公开(公告)日：2012-03-15
申请号：KR1020090016091
申请日：2009-02-26
Applicant: 도레이첨단소재 주식회사
CPC classification number: H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/83192
Abstract: 본 발명은 반도체 칩의 배선을 보호 및 강화하기 위한 비유동성 언더필 필름(no-flow underfill film)에 관한 것이다. 본 발명에서는 열해중합성 수지를 포함하여, 플립칩 패키지 조립체의 제조시 수지조성물의 해중합을 유도할 수 있는 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름을 제공한다.
본 발명에서는 열에 의한 해중합이 가능한 수지를 언더필용 수지조성물에 배합함으로써 비유동성 언더필 수지조성물을 라미네이트(laminate)가 가능한 필름형태로 제작 가능하게 한다. 그 결과, 플립칩과 패키지 기판을 접착하기 전 혹은 솔더링 공정 전에, 상기 비유동성 언더필 필름에 간단한 광조사 혹은 열처리를 실시함으로써 경화반응 중에 솔더 조인트를 통한 전기적 연결이 가능한 낮은 점도와 높은 액 유동성을 확보할 수 있다.
언더필 필름, 비유동성, 해중합(depolymerization), 폴리카보네이트, 라미네이트.-
公开(公告)号：KR101100381B1
公开(公告)日：2011-12-30
申请号：KR1020090069392
申请日：2009-07-29
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J163/00 , C09J7/02
Abstract: 본 발명은 할로겐프리 커버레이 필름용 접착제 조성물 및 이를 도포한 커버레이 필름에 관한 것으로서, 보다 상세하게는 일반적으로 커버레이 접착제의 바인더로 적용되고 있는 니트릴부타디엔 고무(NBR)를 적용하지 않고, 하이드록시기와 카르복실기를 포함하고 있는 아크릴 공중합체를 적용하여 노출되는 습기에도 접착력 및 내열성이 저하되지 않는 할로겐프리 커버레이 필름용 접착제 조성물 및 이를 도포한 커버레이 필름에 관한 것이며, 이를 위해 본 발명에 따른 할로겐프리 커버레이 필름용 접착제 조성물은, (1) 하이드록시기와 카르복실기가 포함하고, 중량평균분자량이 300,000 ~ 800,000 이며, 25℃에서의 점도가 800 ~ 10,000 cP인 아크릴 수지와, (2) 페놀 수지와, (3) 다관능성 에폭시 수지와, (4) 경화제와, (5) 경화 촉진제와, (6) 비할로겐계 난연제와, (7) 무기 입자 및 (8) 가교제를 포함하는 것을 특징으로 한다.
아크릴 수지, 커버레이, 할로겐 프리-
公开(公告)号：KR1020110088698A
公开(公告)日：2011-08-04
申请号：KR1020100008320
申请日：2010-01-29
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J4/02 , C09J7/02 , H01L21/30
CPC classification number: C09J133/08 , C09J4/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J7/385 , C09J7/40 , C09J2203/326 , H01L21/30
Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.
Abstract translation: 目的：提供粘合剂组合物，以防止与树脂密封剂无相互作用的粘合剂层的变形，并且通过树脂密封温度和压力避免冷却和吹塑。 构成：用于扇出晶片级封装的粘合剂组合物包含100.0重量份的丙烯酸共聚物，0.1〜20重量份的热固性材料，0.2-10重量份的能量束固化的丙烯酸低聚物和0.05-15 重量份的光引发剂。 丙烯酸共聚物的分子量为400,000〜4,000,000g / mol。 光引发剂是选自苯基乙醛酸酯化物和酰基氧化膦类光引发剂中的一种或多种。
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Patent Agency Ranking
公开(公告)号：KR1020110087819A
公开(公告)日：2011-08-03
申请号：KR1020100007433
申请日：2010-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J11/00
CPC classification number: C09J133/10 , C09J9/00 , C09J11/04 , C09J11/06
Abstract: PURPOSE: A colored adhesive composition is provided to improve stability, transfer resistance and filling resistance while exhibiting various colors when applied as an adhesive film. CONSTITUTION: A colored adhesive composition comprises, based on 100 parts by weight of (meth)acrylic copolymers, 0.1-10 parts by weight of polyfunctional hardeners, 0.01-5 parts by weight of organic or inorganic pigments, and 1-10 parts by weight of ultraviolet-absorbing agents. The (meth)acrylic copolymer includes 50-80 weight% of soft alkyl acrylate, 15-45 weight% of a hard vinyl monomer, 2.5-10 weight% of a vinyl monomer having a carboxyl group, and 2.5-10 weight% of a vinyl monomer having a hydroxyl group.
Abstract translation: 目的：提供一种着色的粘合剂组合物，以在作为粘合剂膜施加时呈现出各种颜色，以提高稳定性，耐转移性和耐充填性。 构成：彩色粘合剂组合物基于100重量份的（甲基）丙烯酸共聚物，0.1-10重量份的多官能硬化剂，0.01-5重量份的有机或无机颜料和1-10重量份 的紫外线吸收剂。 （甲基）丙烯酸共聚物包括50-80重量％的软烷基丙烯酸酯，15-45重量％的硬质乙烯基单体，2.5-10重量％的具有羧基的乙烯基单体和2.5-10重量％的 具有羟基的乙烯基单体。
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公开(公告)号：KR1020110080423A
公开(公告)日：2011-07-13
申请号：KR1020100000630
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J7/02 , C09J133/08
CPC classification number: C09J133/04 , C09J7/35 , C09J7/385 , C09J133/08 , C09J2201/128 , C09J2201/60
Abstract: PURPOSE: An acrylic inorganic material resin composition is provided to prevent problems on small fragments when applied to an adhesive composition and to improve productivity and yield. CONSTITUTION: An acrylic inorganic material resin composition comprises an acryl resin of average molecular weight of 1,000,000 or more and satisfies chemical formula 1: 70
Abstract translation: 目的：提供一种丙烯酸类无机材料树脂组合物，以防止在粘合剂组合物上施加小碎片时的问题并提高生产率和产率。 构成：丙烯酸类无机材料树脂组合物包含平均分子量为1,000,000以上的丙烯酸树脂，并且满足化学式1：70 <= N <90。在化学式1中，N = [（[60℃下的储能模量 ）/（30℃下的储能模量）]×100。 丙烯酸树脂具有通过化学式2测量的凝胶分数的60％或更多：凝胶分数为m / M * 100。 在化学式2中，M是粘合剂的总质量，m是凝胶粘合剂的质量。
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公开(公告)号：KR1020110080421A
公开(公告)日：2011-07-13
申请号：KR1020100000628
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J201/00 , C09J7/02 , H01L21/56
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/38 , C09J201/00 , C09J2203/30 , C09J2205/10 , H01L21/563
Abstract: PURPOSE: A halogen-free adhesive composition for a coverlay film is provided to satisfy fire retardancy, dhesive property, heat resistance, bleed-out resistance, and pattern filling properties. CONSTITUTION: A halogen-free adhesive composition for a coverlay film comprises (a) 100 parts by weight of a non-halogen based epoxy resin, (b) 50-250 parts by weight of a thermoplastic resin, (c) 0.01-10 parts by weight of an alkoxy silane coupling agent having one or more amino groups, (d) 1-50 parts by weight of a hardener, (e) 0.005-0.5 parts by weight of a curing accelerator, (f) 10-70 parts by weight of a halogen-free phosphorous-based flame retardant, and (g) 10-70 parts by weight of filler consisting of inorganic particles.
Abstract translation: 目的：提供一种用于覆盖膜的无卤粘合剂组合物，以满足阻燃性，粘合性，耐热性，耐渗出性和图案填充性能。 构成：用于覆盖膜的无卤粘合剂组合物包含（a）100重量份的非卤素基环氧树脂，（b）50-250重量份的热塑性树脂，（c）0.01-10份 重量的具有一个或多个氨基的烷氧基硅烷偶联剂，（d）1-50重量份的硬化剂，（e）0.005-0.5重量份的固化促进剂，（f）10-70重量份 无卤磷系阻燃剂的重量，（g）10-70重量份由无机颗粒组成的填料。
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公开(公告)号：KR1020110080420A
公开(公告)日：2011-07-13
申请号：KR1020100000627
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J109/02 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/38 , C09J11/00 , C09J109/02 , C09J2203/30 , C09J2205/10
Abstract: PURPOSE: An adhesive composition is provided to maintain properties such as adhesive property, heat resistance, fire retardancy, and bleed-out resistance and to improve adhesive property using organic particles as a filler. CONSTITUTION: A halogen-free adhesive composition for a coverlay film comprises (a) 100 parts by weight of a non-halogen based epoxy resin, (b) 50-250 parts by weight of a carboxyl group-containing acrylonitrile-butadiene rubber, (c) 1-25 parts by weight of at least one or more hardeners selected from amine-, acid anhydride-, or phenol-based resins, (d) 0.05-0.5 parts by weight of one curing accelerator selected from imidazole-, phosphine-, or fluorinated boron metal compounds, (e) 5-60 parts by weight of a single or mixed non-halogen organic flame retardant selected from phosphorous, melamine, or phosphagen, and (f) 10-100.0 parts by weight of filler consisting of organic particles.
Abstract translation: 目的：提供粘合剂组合物以保持粘合性，耐热性，阻燃性和耐渗出性等特性，并且使用有机颗粒作为填料提高粘合性。 构成：用于覆盖膜的无卤粘合剂组合物包含（a）100重量份的非卤素系环氧树脂，（b）50〜250重量份的含羧基的丙烯腈 - 丁二烯橡胶（ c）1-25重量份的至少一种或多种选自胺，酸酐或酚醛树脂的硬化剂，（d）0.05-0.5重量份选自咪唑，膦 - 或氟化硼金属化合物，（e）5-60重量份选自磷，三聚氰胺或磷酸酯的单一或混合的非卤素有机阻燃剂，和（f）10-100.0重量份由 有机颗粒。
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公开(公告)号：KR1020110076388A
公开(公告)日：2011-07-06
申请号：KR1020090133087
申请日：2009-12-29
Applicant: 도레이첨단소재 주식회사
IPC: H01L23/28
CPC classification number: H01L21/561 , H01L21/568 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/18165 , H01L23/28 , H01L21/565 , H01L21/78 , H01L2224/85 , H01L2924/00014
Abstract: PURPOSE: A molding process film for a semiconductor package is provided to maximize the efficiency of a punching process by forming concavo-convexes parts on the molded surface of the semiconductor package to prevent the cracking phenomenon of chip edges in the punching process. CONSTITUTION: One side of a base film(1) is corona-processed. An adhesive layer(2) is arranged on the corona-processed side of the base film using a composition including 100 parts by weight of acrylic polymer, 5 to 100 parts by weight of organic particles, 10 to 200 parts by weight of ultraviolet ray-based hardening acrylate oligomer, 0.6 to 5 parts by weight of a photo initiator, 0.5 to 5 parts by weight of a hardener. The thickness of the adhesive layer is between 2 and 30um.
Abstract translation: 目的：提供一种用于半导体封装的成型工艺膜，以通过在半导体封装的模制表面上形成凹凸部分来最大化冲压加工的效率，以防止冲压加工中的切屑边缘的开裂现象。 构成：基膜（1）的一面被电晕处理。 使用包含100重量份丙烯酸类聚合物，5至100重量份有机颗粒，10至200重量份紫外线照射组合物的组合物在基膜的电晕处理侧上设置粘合剂层（2） 硬化丙烯酸酯低聚物，0.6〜5重量份的光引发剂，0.5〜5重量份的硬化剂。 粘合剂层的厚度在2至30um之间。
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