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公开(公告)号：KR101858938B1
公开(公告)日：2018-06-29
申请号：KR1020110093847
申请日：2011-09-19
Applicant: 삼성전자주식회사
CPC classification number: F24F11/66 , F24F11/30 , F24F11/46 , F24F11/49 , F24F11/61 , F24F11/62 , F24F11/63 , F24F11/88
Abstract: 본발명은전원선과통신선을통해연결된실내기와실외기를가지는공기조화기에있어서, 실내기와실외기중 적어도하나의기기는, 통신을수행하는통신부; 통신부에통신선이연결되면온되고대기모드시 오프되며대기모드의해제시 온되는스위칭부; 스위칭부오프시 통신부에인가되는전압을분배하는전압분배부; 통신부에인가되는전압을일정전압으로조정하여통신부에전달하는전압조정부; 구동전력이입력되면스위칭부를온 제어하고, 대기모드진입시 스위칭부를오프제어하고, 대기모드중 전압분배부에서분배된전압에기초하여스위칭부를온 제어하는제어부를포함한다. 본발명은대기모드시 대기전력을절감하고타 기기로부터대기모드해제신호수신시 대기모드를해제할수 있다. 또한기기간의오결선시 통신부에공급되는전압을분배하고분배된전압을조정함으로써기기간오결선에의한고장을방지할수 있다. 이와같이전원오결선시 통신부를보호하면서대기모드에서해제신호를수신할수 있다.
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公开(公告)号：KR1020170043884A
公开(公告)日：2017-04-24
申请号：KR1020150143521
申请日：2015-10-14
Applicant: 삼성전자주식회사
IPC: H04M1/02 , A45C11/00 , H04B1/3888 , G06F3/0346
CPC classification number: H04B1/3888 , H04B1/38 , H04M1/185
Abstract: 다양한실시예에따르면, 상기전자장치의적어도일부영역에배치되는적어도하나의보호부재와, 전자장치의낙하를검출하기위한적어도하나의센서와, 상기전자장치의낙하에따라형상을변경시키기위하여상기보호부재를활성화시키는보호부재구동모듈및 상기센서에의해검출된낙하감지신호를인가받아상기보호부재의형상을변경시키도록상기보호부재구동모듈을제어하기위한적어도하나의프로세서를포함하는것을특징으로하는전자장치를제공할수 있다. 그밖에다양한실시예들이가능하다.
Abstract translation: 根据各种实施方案中，为了改变形状按照至少一个保护构件的下降，以及至少一个传感器和用于检测设置在所述电子装置的至少一部分的电子设备的下落的电子设备 接收由所述保护构件驱动模块和用于激活所述保护片的传感器检测到跌倒检测信号，其特征在于：它包括至少一个处理器，用于控制所述保护构件驱动模块来改变保护bujaeui形状 可以提供电子设备。 各种其他实施例是可能的。
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公开(公告)号：KR1020170019965A
公开(公告)日：2017-02-22
申请号：KR1020150114543
申请日：2015-08-13
Applicant: 삼성전자주식회사
IPC: G06F3/01 , A45C11/00 , G06F3/0346 , H04M1/02 , G06K19/077
CPC classification number: H04B1/3888 , H04W4/80
Abstract: 본발명의다양한실시예에따르면, 디스플레이를보호하는전자장치에있어서, 상기전자장치에커버가접속되면, 상기전자장치의운동상태를감지하는센서모듈및 상기감지된전자장치의운동상태에기초하여상기커버의구동부를제어하도록설정된프로세서를포함한다.
Abstract translation: 提供了一种电子设备，保护装置和用于利用保护装置保护电子设备的方法。 电子设备包括：传感器模块，被配置为当盖子连接到电子设备时检测电子设备的运动状态;以及处理器，被配置为基于检测到的电子设备的运动状态来控制盖子的致动器。
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公开(公告)号：KR1020160025687A
公开(公告)日：2016-03-09
申请号：KR1020140112409
申请日：2014-08-27
Applicant: 삼성전자주식회사
IPC: G06F3/01
CPC classification number: G04G21/00 , G04C3/002 , G06F1/163 , G06F1/1694 , G06F3/14 , G09G5/00 , G09G2340/0492 , G09G2354/00 , G06F3/017 , G06F3/013 , G06F3/014
Abstract: 본발명에따른웨어러블워치의디스플레이방법은: 피칭(pitching) 혹은롤링(rolling)으로구성된사전에결정된제스처를인식하는단계; 상기사전에결정된제스처를인식할때, 요(yaw) 기준값을설정하는단계; 및상기요 기준값으로부터요잉(yawing)에대응하는요 데이터의변화량에따라디스플레이방향을보정하는단계를포함한다.
Abstract translation: 根据本发明，可穿戴手表的显示方法包括以下步骤：识别包括俯仰或滚动的预定手势; 当识别出所述预定手势时，设定偏航基准值; 以及根据与偏航基准值的偏航相对应的偏航数据的变化来校正显示方向。 本发明的目的是为用户提供方便的可穿戴手表及其显示方法。
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公开(公告)号：KR1020150050147A
公开(公告)日：2015-05-08
申请号：KR1020130131606
申请日：2013-10-31
Applicant: 삼성전자주식회사
CPC classification number: H04B5/0031 , Y02D70/142 , Y02D70/146 , Y02D70/164 , Y02D70/166 , Y02D70/42
Abstract: NFC 장치의송신기는레귤레이터의출력노드에흐르는제1전류를검출하고검출결과에관련된전류검출신호를출력하는전류검출기와, 상기전류검출신호와기준전류를비교하고비교결과에따라상기출력노드의전압을제어하기위한제어신호를생성하는컨트롤블록을포함한다.
Abstract translation: 根据本发明的实施例涉及近场通信（NFC）设备，更具体地涉及NFC设备的发射机和NFC芯片，其通过控制输出电压来减少不必要的功率消耗。 NFC装置的发射器包括：电流感测装置，其感测在调节器的输出节点上流动的第一电流，并产生与感测结果相关的电流感测信号; 以及控制块，其比较电流感测信号和参考电流，并且根据比较结果生成控制信号以控制输出节点的电压。
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Patent Agency Ranking
公开(公告)号：KR1020140003921A
公开(公告)日：2014-01-10
申请号：KR1020120071643
申请日：2012-07-02
Applicant: 삼성전자주식회사
IPC: H01L21/302
CPC classification number: H01L21/67034 , H01L21/67028
Abstract: A single type drying device comprises a spin chuck, a drying chamber, and a drying fluid line. The spin chuck supports one substrate and rotates the substrate. The drying chamber receives the spin chuck. The drying chamber comprises an inlet in which a drying fluid is received for drying the substrate; an outlet through which the drying fluid is discharged; and a vortex exhaust which discharges a vortex of the drying fluid caused by rotating the spin chuck. The drying fluid line is connected to the inlet of the drying chamber. Therefore, the present invention prevents the disturbance of the inflow of the drying fluid caused by the vortex. Rinse solutions and/or minute particles included in the vortex are discharged through the vortex exhaust.
Abstract translation: 单一干燥装置包括旋转卡盘，干燥室和干燥流体管线。 旋转卡盘支撑一个基板并旋转基板。 干燥室接收旋转卡盘。 所述干燥室包括入口，在所述入口中接收干燥流体以干燥所述基底; 出口，干燥流体通过该出口排出; 以及通过旋转旋转卡盘而排出干燥流体涡流的涡流排出口。 干燥流体管线连接到干燥室的入口。 因此，本发明防止由涡流引起的干燥流体的流入的干扰。 包括在涡流中的冲洗溶液和/或微小颗粒通过涡流排出物排出。
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公开(公告)号：KR1020130030405A
公开(公告)日：2013-03-27
申请号：KR1020110093847
申请日：2011-09-19
Applicant: 삼성전자주식회사
CPC classification number: F24F11/006 , F24F11/30 , F24F11/46 , F24F11/49 , F24F11/61 , F24F11/62 , F24F11/63 , F24F11/66 , F24F11/88 , F24F11/56 , F24F11/65
Abstract: PURPOSE: An air conditioner is provided to predict whether a line connected to a first communication unit is a communication or not and whether the line is a power line or not based on detected voltage. CONSTITUTION: One of an indoor unit(100) and an outdoor unit(200) in an air conditioner comprises switching units(160,250), voltage distributing units(170,260), communication units(150,240), and control units(130,220). The switching unit receives or transfers a communication signal each other by being turned off in a standby mode or by being turned on in release of the standby mode. The communication unit generates a releasing signal when voltage over predetermined voltage is putted in the voltage distributing unit. The control unit turns off the switching unit by determining a start time of the standby mode and controls the switching unit when the releasing signal is received through the communication unit during the standby mode. [Reference numerals] (110) First converting unit; (120) Input unit; (130) First control unit; (140) First load driving unit; (150) First communication unit; (180) First switching driving unit; (210) Second converting unit; (220) Second control unit; (230) Second load driving unit; (240) Second communication unit; (270) Second switching driving unit; (AA) First load; (BB) Second load
Abstract translation: 目的：提供一种空调，用于基于检测到的电压来预测连接到第一通信单元的线路是否为通信，以及线路是否为电力线路。 构成：空调机中的室内机（100）和室外机（200）中的一个包括开关单元（160,250），电压分配单元（170,260），通信单元（150,240）和控制单元（130,220）。 切换单元通过在待机模式下关闭或通过在释放待机模式时被接通来接收或传送通信信号。 当电压超过预定电压被放置在电压分配单元中时，通信单元产生释放信号。 控制单元通过确定待机模式的开始时间来关闭切换单元，并且在待机模式期间通过通信单元接收到释放信号时控制切换单元。 （附图标记）（110）第一转换单元; （120）输入单元; （130）第一控制单元; （140）第一负载驱动单元; （150）第一通信单元; （180）第一开关驱动单元; （210）第二转换单元; （220）第二控制单元; （230）第二负载驱动单元; （240）第二通信单元; （270）第二开关驱动单元; （AA）首次装载; （BB）第二负载
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公开(公告)号：KR1020090017197A
公开(公告)日：2009-02-18
申请号：KR1020070081767
申请日：2007-08-14
Applicant: 삼성전자주식회사
IPC: H05K1/18
Abstract: A semiconductor module and method of assembling the same is provided to protect passive device from external impact by arranging passive device between the module PCB and protection substrate. A semiconductor module(100) includes a module PCB and a semiconductor device(200) on the module PCB and passive device(300), which is located on surface the module PCB in which passive devices are placed. The protection substrate(400) covers the passive devices to protect it from the outside.
Abstract translation: 提供了一种半导体模块及其组装方法，通过在模块PCB和保护基板之间布置无源器件来保护被动元件免受外部冲击。 半导体模块（100）包括模块PCB和模块PCB上的半导体器件（200）和被动器件（300），其位于放置无源器件的模块PCB的表面上。 保护衬底（400）覆盖无源器件以保护其不受外界影响。
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公开(公告)号：KR1020090005488A
公开(公告)日：2009-01-14
申请号：KR1020070068568
申请日：2007-07-09
Applicant: 삼성전자주식회사
CPC classification number: B23K1/008 , B23K2201/40
Abstract: A reflow apparatus and a reflow method are provided to reduce a phenomenon that a portion of a solder, a flux and others spatter in a process of proceeding the reflow process, and to reduce a phenomenon that voids are generated in a solder joint in the process of proceeding the reflow process. A reflow apparatus(100) comprises a first heating part(130) and a second heating part(150). The first heating part melts a solder on a substrate(90) such that an electronic component mounted on the substrate is soldered onto the substrate. The first heating part heats the solder on the substrate to a point just prior to a melting point of the solder in the atmospheric pressure state. The second heating part is connected to the first heating part. The second heating part heats the solder on the substrate heated by the first heating part to a solder melting range that is not less than the melting point in the vacuum state.
Abstract translation: 提供回流装置和回流方法以减少在进行回流处理的过程中焊料，焊剂等的一部分飞溅的现象，并且减少在该过程中在焊接接头中产生空隙的现象 进行回流处理。 回流装置（100）包括第一加热部（130）和第二加热部（150）。 第一加热部件将衬底（90）上的焊料熔化，使得安装在衬底上的电子部件焊接到衬底上。 第一加热部件将基板上的焊料加热到处于大气压状态的焊料的熔点之前的点。 第二加热部与第一加热部连接。 第二加热部将由第一加热部加热的基板上的焊料加热至不低于真空状态的熔点的焊料熔化范围。
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公开(公告)号：KR1020080037353A
公开(公告)日：2008-04-30
申请号：KR1020060104333
申请日：2006-10-26
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: A method for dispensing slurry of a CMP and an apparatus thereof are provided to maximize the use efficiency of slurry by widely diffusing the slurry in a polishing pad while making it to a fine particle. A method for dispensing slurry of a CMP supplies the slurry between friction surfaces of a wafer and a polishing pad(20), the wafer is pressed in one side of the polishing pad at a predetermined pressure by a polishing head(30). The slurry is widely supplied between friction surfaces of the polishing pad and the wafer by widely dispensing the slurry from an upper surface of the polishing pad to a center portion thereof, the wafer is pressed to the polishing pad. The slurry is dispensed from the polishing pad to one side of the polishing pad within the same diameter as that of the wafer in a radial direction.
Abstract translation: 提供一种用于分配CMP的浆料的方法及其装置，以通过在抛光垫中将浆料广泛地分散在细颗粒中来使浆料的使用效率最大化。 用于分配CMP的浆料的方法在晶片的摩擦表面和抛光垫（20）之间提供浆料，通过抛光头（30）以预定的压力将晶片压在抛光垫的一侧。 通过从抛光垫的上表面广泛分配浆料到其中心部分，将浆料广泛地供应在抛光垫的摩擦表面和晶片之间，将晶片压到抛光垫。 将浆料从抛光垫分配到抛光垫的一侧，其直径与晶片的径向相同。
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