LIGHT-EMITTING DIODE DEVICE
    31.
    发明申请
    LIGHT-EMITTING DIODE DEVICE 审中-公开
    发光二极管装置

    公开(公告)号:US20150084086A1

    公开(公告)日:2015-03-26

    申请号:US14553513

    申请日:2014-11-25

    Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

    Abstract translation: 公开了封装的发光二极管装置。 封装的发光二极管装置包括:包括表面的电路载体; 包括透明基板的发光装置,所述透明基板包括第一表面和第二表面,并且所述电路载体的所述第一表面和所述表面包括大于零的夹角; 位于透明基板的第一表面上的发光二极管芯片; 以及覆盖所述发光二极管芯片并形成在所述第一表面上的第一透明胶; 以及形成在与所述第一透明胶相对应的所述第二表面上的第二透明胶; 其中所述第一透明胶在所述第一表面上具有圆形突起,并且所述发光二极管芯片基本上位于所述圆形突起的中心。

    Semiconductor light-emitting device and method for manufacturing the same
    32.
    发明授权
    Semiconductor light-emitting device and method for manufacturing the same 有权
    半导体发光装置及其制造方法

    公开(公告)号:US08852974B2

    公开(公告)日:2014-10-07

    申请号:US13707168

    申请日:2012-12-06

    CPC classification number: H01L33/22 H01L33/007 H01L2924/0002 H01L2924/00

    Abstract: A method for manufacturing semiconductor light-emitting devices comprising the steps of: providing a multi-layer semiconductor film comprising a surface; roughening the surface of the multi-layer semiconductor film to form a scattering surface; re-growing a semiconductor layer on the scattering surface; and roughening the semiconductor layer to form a sub-scattering portion on the scattering surface; wherein the sub-scattering portion is structurally smaller than the scattering surface.

    Abstract translation: 一种制造半导体发光器件的方法,包括以下步骤:提供包括表面的多层半导体膜; 使多层半导体膜的表面粗糙化,形成散射面; 在散射表面上重新生长半导体层; 并使所述半导体层变粗糙以在所述散射面上形成副散射部; 其中所述副散射部分在结构上小于所述散射表面。

    OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF
    33.
    发明申请
    OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF 有权
    光电器件及其制造方法

    公开(公告)号:US20140014994A1

    公开(公告)日:2014-01-16

    申请号:US13932661

    申请日:2013-07-01

    Abstract: An optoelectronic device comprising a substrate; a first window layer on the substrate, having a first sheet resistance, a first thickness, and a first impurity concentration; a second window layer having a second sheet resistance, a second thickness, and a second impurity concentration; and a semiconductor system between the first window layer and the second window layer; wherein the second window layer comprises a semiconductor material different from the semiconductor system, and the second sheet resistance is greater than the first sheet resistance.

    Abstract translation: 一种包括衬底的光电器件; 在所述基板上的第一窗口层,具有第一薄层电阻,第一厚度和第一杂质浓度; 具有第二薄层电阻,第二厚度和第二杂质浓度的第二窗口层; 以及在所述第一窗口层和所述第二窗口层之间的半导体系统; 其中所述第二窗口层包括不同于所述半导体系统的半导体材料,并且所述第二薄层电阻大于所述第一薄层电阻。

    Light-emitting device
    34.
    发明授权

    公开(公告)号:US10756960B2

    公开(公告)日:2020-08-25

    申请号:US16258250

    申请日:2019-01-25

    Abstract: A light-emitting device comprises a first light-emitting semiconductor stack comprising a first active layer; a second light-emitting semiconductor stack below the first light-emitting semiconductor stack, wherein the second light-emitting semiconductor stack comprises a second active layer; a reflector between the first light-emitting semiconductor stack and the second light-emitting semiconductor stack; a protecting layer between the reflector and the second light-emitting semiconductor stack; and wherein the first light-emitting semiconductor stack further comprises a first semiconductor layer and a second semiconductor layer sandwiching the first active layer, the second light-emitting semiconductor stack further comprises a third semiconductor layer and a fourth semiconductor layer sandwiching the second active layer, wherein the second semiconductor layer has a first band gap, the third semiconductor layer has a second band gap, and the protecting layer has a third band gap between the first band gap and the second band gap.

    Light-emitting device and manufacturing method thereof

    公开(公告)号:US10319877B2

    公开(公告)日:2019-06-11

    申请号:US15944459

    申请日:2018-04-03

    Abstract: The present disclosure provides a light-emitting device including a substrate, a first block of semiconductor stack on the substrate, a second block of semiconductor stack on the substrate and a third block of semiconductor stack on the substrate. The first block of semiconductor stack includes a first emitting wavelength and a first surface away from the substrate. The second block of semiconductor stack on the substrate includes a second emitting wavelength and a second surface away from the substrate. The third block of semiconductor stack includes s a third emitting wavelength and a third surface away from the substrate. The second surface and the first surface are non-coplanar and the third surface and the first surface are coplanar. The first emitting wavelength, the second emitting wavelength and the third emitting wavelength are different.

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