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    31.
    发明专利
    未知

    公开(公告)号：DE69624934T2

    公开(公告)日：2003-07-31

    申请号：DE69624934

    申请日：1996-09-06

    Applicant: IBM

    Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO

    IPC: G01N33/543 ,  B01J19/00 ,  B05D1/18 ,  B05D1/28 ,  C07K17/14 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14

    Abstract: PCT No. PCT/IB96/00908 Sec. 371 Date Apr. 29, 1998 Sec. 102(e) Date Apr. 29, 1998 PCT Filed Sep. 6, 1996 PCT Pub. No. WO98/09735 PCT Pub. Date Mar. 12, 1998A method is proposed with which chemically defined bodies can be deposited on a substrate. Therefor, the bodies are fixed with a predetermined orientation on a stamping means which is then approached to the substrate whereby the bodies are deposited. While releasing the stamping means the bodies remain on the substrate keeping their orientation.

    Device and method for converting heat into mechanical energy
    32.
    发明专利
    Device and method for converting heat into mechanical energy 未知

    公开(公告)号：GB2521430A

    公开(公告)日：2015-06-24

    申请号：GB201322604

    申请日：2013-12-19

    Applicant: IBM

    Inventor： BURG BRIAN ,  MICHEL BRUNO ,  ONG CHIN LEE ,  RUCH PATRICK ,  PAREDES STEPHAN

    IPC: F01K21/00 ,  F01K25/04

    Abstract: A device 1, 100, 101, 102, 103 for converting heat into mechanical energy comprises a channel flow boiler 8, 22 adapted to heat a working fluid 13 to generate a liquid-gas mixture 33; an expansion device 9, 23 adapted to expand the liquid-gas mixture; and a movable element 10 arranged such that the expanding liquid-gas mixture to convert its internal and/or kinetic energy into mechanical work. Further, a method for converting heat into mechanical energy is disclosed, wherein the method comprises: heating S1 a working fluid for generating a liquid-gas mixture; expanding S2 the liquid-gas mixture; providing heat S3 to the liquid-gas mixture, and converting S4 the internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element, wherein the method is operated as a thermodynamic cycle such that the expansion of the liquid-gas mixture is partially approximately isothermal.

    Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network
    33.
    发明专利
    Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network 未知

    公开(公告)号：GB2514552A

    公开(公告)日：2014-12-03

    申请号：GB201309472

    申请日：2013-05-28

    Applicant: IBM

    Inventor： GUSAT MIRCEA ,  MICHEL BRUNO ,  SOIMU MARIA ,  MORF THOMAS E

    IPC: G02B6/43 ,  H05K7/20

    Abstract: An electronic circuit device 1 has a cooling fluid conduit network 100 having conduit(s) 101- 103 for conveying an electromagnetic signal e.g. an optical signal, for example via fibre optic cables, which is arranged in thermal communication with a first set of components 11-15 and in signal communication with a second set of components 11-12 and conveys both a cooling fluid 50 in the conduit(s) 101-103 and an electromagnetic signal 70 along and via the conduit(s) 101-103. A clock signal injection unit 10 injects an electromagnetic clock signal 70 at an input location of the cooling conduit network 100 and a clock signal collection unit 30 collects at an output location of the cooling conduit network 100 an electromagnetic clock signal conveyed along and via a conduit 101-103 of the cooling conduit network 100 for components 11, 12 of the second set.

    Solid sorption refrigeration
    35.
    发明专利
    Solid sorption refrigeration 未知

    公开(公告)号：GB2499938A

    公开(公告)日：2013-09-04

    申请号：GB201309541

    申请日：2011-11-30

    Applicant: IBM

    Inventor： MICHEL BRUNO ,  RUCH PATRICK

    IPC: F25B17/08 ,  F25B35/04 ,  F28F13/18

    Abstract: Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

    Electrochemically powered integrated circuit package
    36.
    发明专利
    Electrochemically powered integrated circuit package 未知

    公开(公告)号：GB2497246A

    公开(公告)日：2013-06-05

    申请号：GB201305369

    申请日：2011-08-04

    Applicant: IBM

    Inventor： BRUNSCHWILER THOMAS J ,  MICHEL BRUNO ,  RUCH PATRICK

    IPC: H01L23/58 ,  H01M8/10 ,  H01M8/18

    Abstract: The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.

    37.
    发明专利
    未知

    公开(公告)号：DE60326724D1

    公开(公告)日：2009-04-30

    申请号：DE60326724

    申请日：2003-05-28

    Applicant: IBM

    Inventor： MICHEL BRUNO ,  ROTHUIZEN HUGO E ,  VETTIGER PETER ,  BONA GIAN-LUCA ,  BIEBUYCK HANS

    IPC: G02B5/18 ,  G03F7/00 ,  G03F9/00

    Abstract: The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.

    38.
    发明专利
    未知

    公开(公告)号：DE69524247D1

    公开(公告)日：2002-01-10

    申请号：DE69524247

    申请日：1995-08-04

    Applicant: IBM

    Inventor： BIEBUYCK ANDRE ,  MICHEL BRUNO

    IPC: B41K1/02 ,  B41C1/02 ,  B41K1/00 ,  C23F1/00 ,  G03F7/00 ,  G03F9/00 ,  H01L21/20 ,  H01L21/306 ,  H01L21/768

    Abstract: A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising a deformable layer (14) for accommodating unevenness of the surface of a substrate, and a patterned layer on the deformable layer in which a lithographic pattern is engraved. The stamp structure is further enhanced by comprising a third layer (16), which acts as rigid support for the stamp, thus preventing an undesired deformation of the stamp under load.

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