公开(公告)号：HUT76997A

公开(公告)日：1998-01-28

申请号：HU9700404

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

公开(公告)号：HUT76992A

公开(公告)日：1998-01-28

申请号：HU9701699

申请日：1995-09-20

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ANTHONY ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  MURHPY PHILIP ,  WALKER GEORGE FREDERICK

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA957085B

公开(公告)日：1996-03-11

申请号：ZA957085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA9507085B

公开(公告)日：1996-03-11

申请号：ZA9507085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

CPC classification number: H01L24/85 ,  G06K7/086 ,  G06K19/067 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01Q1/2225 ,  H01Q7/00 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：DE3882689T2

公开(公告)日：1994-02-17

申请号：DE3882689

申请日：1988-12-09

Applicant: IBM

Inventor： HALBOUT JEAN-MARC ,  KETCHEN MARK BENJAMIN ,  MOSKOWITZ PAUL ANDREW ,  SCHEUERMANN MICHAEL ROY

IPC: G01R31/26 ,  G01R1/067 ,  G01R31/302

公开(公告)号：DE3787772D1

公开(公告)日：1993-11-18

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48