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6 records (took 0.016 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE69011233T2

    公开(公告)日：1995-03-09

    申请号：DE69011233

    申请日：1990-05-22

    Applicant: IBM

    Inventor： BICKFORD HARRY RANDALL ,  BOLAND WILLIAM LEO ,  MORRIS DANIEL PETER ,  REILEY TIMOTHY CLARK

    IPC: G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H01L23/544

    Abstract: A TAB package comprises an elongated tape (10) which has a plurality of sets of beam leads emplaced thereon and a plurality of electronic devices (28) connected to the beam leads. At least a first beam (32) lead of each set is connected to a common potential terminal (16) on each device, and at least a second beam lead (30) of each set is connected to a power terminal (18). A common potential bus is oriented along the elongated dimension of the tape and connects to the first beam leads, while a power bus is also oriented along the elongated dimension of the tape and is connected to the second beam leads. The application of power to the power bus and the simultaneous grounding of the common potential bus enables all electronic devices on the tape to be simultaneously energized and to be then subjected to an elevated temperature environment for static burn-in testing. To improve current conduction in the power and common potential buses, a tape comprising a non-conductive carrier (42) and a pair of interposer/conductor tapes (41) may be emplaced over the length of the tape bearing the chips. An additional spacer tape (50) is then emplaced over the interposer tape and forces the interposer conductors into contact with the power and common potential buses.

    5.
    发明专利
    未知

    公开(公告)号：DE69011233D1

    公开(公告)日：1994-09-08

    申请号：DE69011233

    申请日：1990-05-22

    Applicant: IBM

    Inventor： BICKFORD HARRY RANDALL ,  BOLAND WILLIAM LEO ,  MORRIS DANIEL PETER ,  REILEY TIMOTHY CLARK

    IPC: G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H01L23/544

    Abstract: A TAB package comprises an elongated tape (10) which has a plurality of sets of beam leads emplaced thereon and a plurality of electronic devices (28) connected to the beam leads. At least a first beam (32) lead of each set is connected to a common potential terminal (16) on each device, and at least a second beam lead (30) of each set is connected to a power terminal (18). A common potential bus is oriented along the elongated dimension of the tape and connects to the first beam leads, while a power bus is also oriented along the elongated dimension of the tape and is connected to the second beam leads. The application of power to the power bus and the simultaneous grounding of the common potential bus enables all electronic devices on the tape to be simultaneously energized and to be then subjected to an elevated temperature environment for static burn-in testing. To improve current conduction in the power and common potential buses, a tape comprising a non-conductive carrier (42) and a pair of interposer/conductor tapes (41) may be emplaced over the length of the tape bearing the chips. An additional spacer tape (50) is then emplaced over the interposer tape and forces the interposer conductors into contact with the power and common potential buses.

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