公开(公告)号：DE102013103365A1

公开(公告)日：2013-10-10

申请号：DE102013103365

申请日：2013-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  BUCHSBAUM MARTIN ,  PUESCHNER FRANK ,  RAMPETZREITER STEPHAN

IPC: G06K19/077

Abstract: Datenträger zur kontaktlosen Datenübertragung, der ein Substrat und einen Chip, der mindestens eine Verbindungskontaktstelle aufweist, umfasst, wobei der Chip durch seine von der Verbindungskontaktstelle entfernte Seite auf dem Substrat angeordnet ist und eine erste kupferbeschichtete Prepreg-Schicht auf dem Chip und mindestens teilweise auf dem Substrat angeordnet ist und eine Kontaktöffnung zu der Verbindungskontaktstelle aufweist. Eine Durchkontaktierung befindet sich in der Kontaktöffnung zur Herstellung einer elektrisch leitfähigen Verbindung zwischen der Verbindungskontaktstelle des Chips und der Kupferschicht der ersten kupferbeschichteten Prepreg-Schicht, wobei in der Kupferschicht der ersten kupferbeschichteten Prepreg-Schicht eine erste Antennenstruktur gebildet ist.

公开(公告)号：DE102011115164A1

公开(公告)日：2013-03-28

申请号：DE102011115164

申请日：2011-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BOTHE KRISTOF ,  HOEGERL JUERGEN ,  KARL ANDREAS ,  MUELLER-HIPPER ANDREAS ,  PUESCHNER FRANK ,  SCHERL PETER ,  STAMPKA PETER ,  WAGNER UWE

IPC: G06K19/077

Abstract: Die vorliegende Erfindung beschreibt ein Chipkarten-Moduls mit einer Basisschicht, einer zweiten Schicht, einem Chip, wobei der Chip zwischen der Basisschicht und der zweiten Schicht angeordnet ist und wobei der Chip ferner in einer Klebemasse angeordnet ist und wobei der Chip elektrische Kontakte aufweist und wobei die elektrischen Kontakte des Chip's mit elektrischen Kontakten der zweiten Schicht kontaktiert sind und wobei mittels der ausgehärteten Klebemasse eine dauerhafte elektrische Verbindung zwischen den elektrischen Kontakten des Chip's und den elektrischen Kontakten des Chipkarten-Moduls hergestellt ist.

公开(公告)号：DE102004059232B4

公开(公告)日：2011-05-05

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/34 ,  H01L23/50

公开(公告)号：DE102006007381A1

公开(公告)日：2007-08-23

申请号：DE102006007381

申请日：2006-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  KILLER THOMAS

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/50

Abstract: The component comprises a semiconductor component (1), an ultra-wide-band semiconductor chip (8) and a multilevel circuit substrate (9) with a lower metal layer (M1) and an upper metal layer (M4). The semiconductor component is surface-mounted on a circuit plate. The component has an antenna (12), which stands in connection with the ultra-wide-band semiconductor chip over the circuit of the circuit substrate, and is arranged above semiconductor chip and circuit substrate. The semiconductor component of the ultra-wide-band circuit has a screen. An independent claim is also included for the method for production of ultra-wide-semiconductor band.

公开(公告)号：DE102005014674A1

公开(公告)日：2006-10-19

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE102004011202A1

公开(公告)日：2005-07-14

申请号：DE102004011202

申请日：2004-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20

Abstract: The device has a fan (7) with an air pressure outlet side (13) connected to connector that directs cooling air from the fan to semiconductor components e.g. dynamic RAM, which are to be cooled. The connector is flexible and is connected to the fan. Curved tubes (11) are firmly connected to the semiconductor components. The connector exhibits multiple discharge openings in which a memory module (4) is present. An independent claim is also included for a computer system having an input device, a processor, a memory and an output device.

公开(公告)号：DE10211993B4

公开(公告)日：2004-02-05

申请号：DE10211993

申请日：2002-03-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  PFAFFELHUBER THOMAS

IPC: H05K13/00 ,  H05K13/02 ,  B65B15/04 ,  B65B9/04 ,  B65D75/26 ,  B65D73/02

Abstract: The invention relates to an apparatus and a method for packaging and for transporting electronic devices. The devices include coverings made of a material that shrinks under the action of temperature that are pressed into receptacles of a belt-type carrier body. Electronic devices are inserted into the open front sides of said coverings. A belt top side and underside are in each case closed off with a covering sheet, after which the belt-type carrier body is heated.

公开(公告)号：DE10211729A1

公开(公告)日：2003-10-16

申请号：DE10211729

申请日：2002-03-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN

IPC: H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31

Abstract: The electronic semiconducting component has a semiconducting chip (4) with edge protection (6) consisting of a material that shrinks under the effects of temperature. The edge protection engages the semiconducting chip from its passive rear (42) and when shrunk on is anchored on the active front (41) of the chip by a peripheral edge (63) and is permanently attached to the chip. AN Independent claim is also included for the following: a method of manufacturing and inventive device.

公开(公告)号：DE10211993A1

公开(公告)日：2003-10-09

申请号：DE10211993

申请日：2002-03-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  PFAFFELHUBER THOMAS

IPC: H05K13/00 ,  H05K13/02 ,  B65B15/04 ,  B65B9/04 ,  B65D75/26 ,  B65D73/02

Abstract: The invention relates to an apparatus and a method for packaging and for transporting electronic devices. The devices include coverings made of a material that shrinks under the action of temperature that are pressed into receptacles of a belt-type carrier body. Electronic devices are inserted into the open front sides of said coverings. A belt top side and underside are in each case closed off with a covering sheet, after which the belt-type carrier body is heated.

公开(公告)号：DE10056281A1

公开(公告)日：2002-05-23

申请号：DE10056281

申请日：2000-11-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  STRUTZ VOLKER

IPC: H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L29/06 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor chip (2) having an active upper side (3) with integrated circuits (4) and a passive rear side (5) without integrated circuits. The chip also has macroscopic openings (6) containing a number of connecting lines (7) extending from the upper side to the rear side. An Independent claim is also included for a process for the production of an electronic component. Preferred Features: The connecting lines have bonding wires and are arranged in an block (9) for electrically insulating the connecting lines. The block has an upper side (10) and a rear side (11) with connecting lines extending from the upper side of the block to the rear side of the block.