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    COMPOSITION AND METHOD FOR IMPROVING ADHESION OF COATINGS TO COPPER SURFACES
    33.
    发明专利
    COMPOSITION AND METHOD FOR IMPROVING ADHESION OF COATINGS TO COPPER SURFACES 未知

    公开(公告)号：CA2029087A1

    公开(公告)日：1991-08-17

    申请号：CA2029087

    申请日：1990-10-31

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  WILLIAMS BARRY H ,  CARMODY THOMAS J

    IPC: C23G1/10 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18 ,  C11D1/12 ,  H05K3/26 ,  C11D1/835

    Abstract: COMPOSITION AND METHOD FOR IMPROVING ADHESION OF COATINGS TO COPPER SURFACES A composition for cleaning and improving the adhesion characteristics of a copper surface (which is in turn adhered to an underlying substrate) so as to enable a coating, e.g., of photoresist, to be adhered easily and completely to the copper surface, the cleaning and adhesion promoting composition consisting essentially of an aqueous solution of an alkane sulfonic acid, a surfactant and an oxidizing agent of a type, and present in an amount, sufficient to provide controlled conversion of the copper surface to a substantially clean, microroughened surface, without removing the copper surface from the underlying substrate, so that the adhesion characteristics of the copper surface are substantially increased for receiving and securely adhering a subsequently applied coating.

    RESIST INACTIVATION METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS
    34.
    发明专利
    RESIST INACTIVATION METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：CA1278877C

    公开(公告)日：1991-01-08

    申请号：CA541745

    申请日：1987-07-09

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

    IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

    Abstract: Printed circuit boards containing thru-holes requiring metallization are manufactured by first applying to the board material an alkaline strippable resist in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting the catalyst at non-resist areas, and then metallizing the non-resist areas. The ability to preliminarily apply the resist pattern before catalyst application, metallization, etc., yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, etc. steps without need for interruption for resist application.

    Continuous metal deposition from electroless plating bath
    36.
    发明专利
    Continuous metal deposition from electroless plating bath 未知

    公开(公告)号：IT1155903B

    公开(公告)日：1987-01-28

    申请号：IT6801182

    申请日：1982-08-11

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E

    IPC: C23C20060101 ,  C23C

    Abstract: A metallic plating is continuously deposited on a workpiece by (a) preparing the workpiece surface; (b) immersing in a soln. which is non-autocatalytic and normally inherently produces a deposit of self-limiting thickness; (c) electrolessly depositing metal or the workpiece (i.e. by reduction of metal ions in the soln. using a reducing agent); (d) applying a current to the workpiece so that an electrodeposited metal layer forms on electroless one; and (e) depositing the plating at a thickness which increases with time of immersion with a constant rate of deposition. The method is esp. suitable for plating non-conductors with Cu. A more uniform deposit thickness is obtd. and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts is possible.

    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT
    39.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT 未知

    公开(公告)号：CA1130952A

    公开(公告)日：1982-09-07

    申请号：CA325487

    申请日：1979-04-12

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a suitably catalysed and generally non-conductive workpiece surface using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with solution. The reducing agent is a soluble source of hypophosphite ions and the complexing agent is selected to be effective at pH level between 5 and 13 for complexing cupric ions and the solution pH is coordinated within the pH range for the complexer selected to give a deposited conductive copper film.

    COMPOSITION AND METHOD FOR CONTINUOUS ELECTROLESS COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCING AGENT IN THE PRESENCE OF COBALT OR NICKEL IONS
    40.
    发明专利
    COMPOSITION AND METHOD FOR CONTINUOUS ELECTROLESS COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCING AGENT IN THE PRESENCE OF COBALT OR NICKEL IONS 未知

    公开(公告)号：CA1117704A

    公开(公告)日：1982-02-09

    申请号：CA338071

    申请日：1979-10-19

    Applicant: MACDERMID INC

    Inventor： BASKER RACHEL NEE GOLDSTEIN ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

    IPC: C23C18/40 ,  C23C18/48 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of continuously electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, a non-formaldehyde copper reducing agent, such as hypophosphite, effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution, and a soluble source of non-copper metallic ions, such as nickel or cobalt ions, which act as an autocatalysis promoter to enable continuous plating using the solutions. The solutions are maintained in an alkaline condition and preferably in a pH range of 11-14 through the addition of pH adjusters. The properties of plating baths using the solutions, such as bath stability as well as plating process parameters such as plating rate, and the quality of deposit may be advantageously controlled through the appropriate selection of the noncopper metallic ion added and the complexing agent used. Optional additives, such as polymers, wetting agents, and various soluble unsaturated organic compounds, may also be utilized to influence these variables.

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