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公开(公告)号：DE602005016501D1
公开(公告)日：2009-10-22
申请号：DE602005016501
申请日：2005-07-25
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor： BOUCHE GUILLAUME , ANCEY PASCAL , VIALA BERNARD , COUDERC SANDRINE
Abstract: The method involves nitriding ferromagnetic nanograins rich in iron immersed in an amorphous substrate (SB), and selectively oxidizing the substrate. The nitriding is effectuated by reactive cathodic or ionic sputtering under magnetic field in the presence of nitrogen. The oxidation is effectuated by reactive sputtering in the presence of oxygen. The oxidation and nitriding are carried out simultaneously. Independent claims are also included for the following: (A) a thin soft magnetic film having high magnetization and insulation; and (B) an integrated circuit comprising a component utilizing a membrane incorporating a film.
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公开(公告)号：FR2879344B1
公开(公告)日：2007-03-16
申请号：FR0413199
申请日：2004-12-10
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME , GIRAUDIN JEAN CHRISTOPHE
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公开(公告)号：FR2890490A1
公开(公告)日：2007-03-09
申请号：FR0509050
申请日：2005-09-05
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor： BOUCHE GUILLAUME , PARAT GUY
Abstract: La présente invention concerne un circuit intégré comprenant au moins un niveau d'interconnexion 1 et un résonateur acoustique muni d'un élément actif 12 et d'un support 11 comprenant au moins un ensemble bicouche comprenant une couche de matériau à forte impédance acoustique 8 et une couche de matériau à faible impédance acoustique 10, ledit support 11 comprend en outre un élément en saillie 7 disposé sur un niveau de métallisation 4 du niveau d'interconnexion 1 permettant de réaliser un contact électrique entre un niveau d'interconnexion 1 et l'élément actif 12 du résonateur acoustique.
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34.发明专利
公开(公告)号：FR2878506A1
公开(公告)日：2006-06-02
申请号：FR0412572
申请日：2004-11-26
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor： BOUCHE GUILLAUME , ANDRE BERNARD , SILLON NICOLAS
Abstract: L'invention concerne notamment un procédé de conditionnement de micro-composants (1) réalisés en nombre sur une même plaquette (2) de substrat, grâce auquel chaque micro-composant est enfermé dans une cavité (3).Ce procédé comprend des opérations consistant à : réaliser une plaque de recouvrement (4); déposer une couche de métal (5) sur une face (41) de la plaque de recouvrement ou sur une face (22) de la plaquette (2); recouvrir la plaquette (2) par la plaque de recouvrement (4); appliquer sur cette dernière et sur la plaquette (2) une pression de contact au moins égale à un bar; et chauffer la couche de métal (5) pendant le pressage jusqu'à l'obtention d'un scellement, chaque cavité (3) étant ainsi dotée d'une zone de scellement (7), et étant fermée par une partie de la plaque de recouvrement (4) et / ou de sa couche de métal (5).
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公开(公告)号：FR2862629B1
公开(公告)日：2006-02-17
申请号：FR0350910
申请日：2003-11-25
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME
Abstract: The micro-pump has a flexible membrane (6) that deforms when it contacts a conducting layer (3) and when a control circuit (V) applies a voltage. The volume of air pocket located between the membrane and the layer decreases when the membrane is deformed in order to displace air towards an air duct (4). The membrane is separated from the layer when the circuit stops applying the voltage. Independent claims are also included for the following: (a) an integrated circuit having a micro-pump (b) a method for forming a micro-pump in the integrated circuit (c) a method for actuating a micro-pump.
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Patent Agency Ranking
公开(公告)号：FR2863789A1
公开(公告)日：2005-06-17
申请号：FR0314567
申请日：2003-12-12
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME , CARUYER GREGORY , ANCEY PASCAL
Abstract: An acoustic resonator device (1) comprises an active element (6) and a support. The support includes a membrane (5) and the active element provided with at least one piezoelectric layer (10) is surmounted by a multi-layer assembly (12) provided with at least three layers (13, 14, 15) of which at least one has a strong acoustic impedance and at least one a low acoustic impedance.
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公开(公告)号：FR2862629A1
公开(公告)日：2005-05-27
申请号：FR0350910
申请日：2003-11-25
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME
Abstract: The micro-pump has a flexible membrane (6) that deforms when it contacts a conducting layer (3) and when a control circuit (V) applies a voltage. The volume of air pocket located between the membrane and the layer decreases when the membrane is deformed in order to displace air towards an air duct (4). The membrane is separated from the layer when the circuit stops applying the voltage. Independent claims are also included for the following: (a) an integrated circuit having a micro-pump (b) a method for forming a micro-pump in the integrated circuit (c) a method for actuating a micro-pump.
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公开(公告)号：FR2852165A1
公开(公告)日：2004-09-10
申请号：FR0302817
申请日：2003-03-06
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor： ROBERT PHILIPPE , CARUYER GREGORY , ANCEY PASCAL , BOUCHE GUILLAUME
IPC: H03H3/04 , H03H9/17 , H03H9/15 , H01L41/083 , H01L41/22
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公开(公告)号：FR2848339A1
公开(公告)日：2004-06-11
申请号：FR0215370
申请日：2002-12-05
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME , ANCEY PASCAL , FROMENT BENOIT
Abstract: The adhesion of a first element (1), of which at least a part of the surface is coated with silicon, on a second element (2), of which at least a part of the surface is coated with nickel, incorporates an adhesion stage effected by NiSi welding at greater than 250degreesC, the rugosity between the two parts of the surface of the two elements being less than 1 micron. An Independent claim is also included for an integrated circuit incorporating two elements joined by NiSi welding.
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公开(公告)号：FR2848036A1
公开(公告)日：2004-06-04
申请号：FR0214967
申请日：2002-11-28
Applicant: ST MICROELECTRONICS SA
Inventor： BOUCHE GUILLAUME , CARUYER GREGORY , ANCEY PASCAL
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