公开(公告)号：DE69432016T2

公开(公告)日：2004-01-08

申请号：DE69432016

申请日：1994-09-13

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  TOSCANI ROBERTO ,  MARCHIO' FABIO ,  STORTI SANDRO

IPC: H01L21/66 ,  G01R31/28 ,  H01L21/822 ,  H01L23/58 ,  H01L27/02 ,  H01L27/04 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

Abstract: Manufacturing method for electronic circuits (2) integrated monolithically on a semiconductor support (1) on which said electronic circuits (2) are regularly spaced apart by dividing scribing lines (11) and a network of electrical connection lines (12) used for diagnostic purposes in the wafer of semiconductor material on which are provided the integrated electronic circuits (2). In this manner it is possible to simultaneously perform electrical testing of all the circuits present on the same wafer.

公开(公告)号：DE69725123D1

公开(公告)日：2003-10-30

申请号：DE69725123

申请日：1997-07-04

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  VIGNA BENEDETTO ,  FERRARI PAOLO

IPC: G11B5/31 ,  G11B5/39 ,  G11B5/00

Abstract: An electromagnetic head (130) for a storage device comprises a magnetic core (205) forming a magnetic circuit, the magnetic core (205) being interrupted by a first air-gap (230) for magnetic coupling with a memory cell of the device, and by at least one second air-gap (235) which separates a first pole (240) and a second pole (245) of the magnetic core (205), and magnetoresistive means (250) disposed in the region of the second air-gap (235) for reading the memory cell; the magnetoresistive means (250) are connected to the magnetic core (205) in the region of the first pole (240) and of the second pole (245) so as to be connected in the magnetic circuit.

公开(公告)号：ITMI20122240A1

公开(公告)日：2014-06-28

申请号：ITMI20122240

申请日：2012-12-27

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  PAGANI ALBERTO ,  ZIGLIOLI FEDERICO GIOVANNI

公开(公告)号：DE602004031938D1

公开(公告)日：2011-05-05

申请号：DE602004031938

申请日：2004-08-13

Applicant: ST MICROELECTRONICS SRL

Inventor： MERASSI ANGELO ,  MURARI BRUNO ,  ZERBINI SARAH

IPC: G01P15/125 ,  B81B3/00 ,  G01P15/00

公开(公告)号：ITTO20080603A1

公开(公告)日：2010-02-01

申请号：ITTO20080603

申请日：2008-07-31

Applicant: ST MICROELECTRONICS SRL

Inventor： MASTROMATTEO UBALDO ,  MURARI BRUNO ,  RICOTTI GIULIO

公开(公告)号：ITTO20070328A1

公开(公告)日：2008-11-12

申请号：ITTO20070328

申请日：2007-05-11

Applicant: ST MICROELECTRONICS SRL

Inventor： MASTROMATTEO UBALDO ,  MURARI BRUNO ,  RICOTTI GIULIO

公开(公告)号：DE69931370T2

公开(公告)日：2007-02-01

申请号：DE69931370

申请日：1999-10-01

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  VIGNA BENEDETTO ,  MASTROMATTEO UBALDO

IPC: B81C1/00 ,  G11B5/53 ,  B81B3/00 ,  B81B5/00 ,  G11B7/12 ,  G11B21/10 ,  H02N1/00

公开(公告)号：DE69736630D1

公开(公告)日：2006-10-19

申请号：DE69736630

申请日：1997-06-19

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  VIGNA BENEDETTO ,  FERRARI PAOLO

IPC: G01B7/00 ,  G01P15/08 ,  G01C19/00 ,  G01P1/02 ,  G01P9/04 ,  H01L29/84

公开(公告)号：DE69931370D1

公开(公告)日：2006-06-22

申请号：DE69931370

申请日：1999-10-01

Applicant: ST MICROELECTRONICS SRL

Inventor： MURARI BRUNO ,  VIGNA BENEDETTO ,  MASTROMATTEO UBALDO

IPC: B81C1/00 ,  G11B5/53 ,  B81B3/00 ,  B81B5/00 ,  G11B7/12 ,  G11B21/10 ,  H02N1/00

公开(公告)号：DE69826242D1

公开(公告)日：2004-10-21

申请号：DE69826242

申请日：1998-05-05

Applicant: ST MICROELECTRONICS SRL

Inventor： MASTROMATTEO UBALDO ,  MURARI BRUNO ,  VIGNA BENEDETTO ,  ZERBINI SARAH

IPC: G11B5/596 ,  G11B5/55 ,  G11B5/58 ,  G11B21/10 ,  H02N1/00 ,  G11B5/00

Abstract: The method comprises the steps of: forming an integrated device (54) including a microactuator (10) in a semiconductor material wafer (29); forming an immobilisation structure (45,47) of organic material on the wafer; simultaneously forming a securing flange (51) integral with the microactuator (10) and electrical connections for connecting the integrated device to a read/write head; bonding a transducer (6,55) supporting the read/write head to the securing flange (51); connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the actuator unit to a suspension; and removing the immobilisation structure (45,47).