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    Integrated semiconductor device including a heater for bringing about phase changes in microfluid systems
    32.
    发明公开
    Integrated semiconductor device including a heater for bringing about phase changes in microfluid systems 审中-公开
    与加热元件集成半导体器件，以使微流体系统中的相变

    公开(公告)号：EP1176017A1

    公开(公告)日：2002-01-30

    申请号：EP00830536.9

    申请日：2000-07-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno ,  Vigna, Benedetto

    IPC: B41J2/14 ,  H03K17/94 ,  F04B43/04

    CPC classification number: B41J2/14129 ,  F04B17/00 ,  F04B43/043

    Abstract: An integrated device (40) forming a microfluid system includes a substrate (41) of semiconductor material and a lid element (56) forming a channel (55) filled with a liquid. A heating element (51) is carried by the substrate and faces the channel so as to heat the liquid and generate a gas bubble, when activated. The substrate (41) houses a cavity (42) arranged on the opposite side of the heating element (51; 66) with respect to the channel (55) in order to reduce thermal dispersion of the heating element (51) towards the substrate (41). The heating element includes a resistive region (45) coated, on the side facing the channel (55), by a protective region (49, 50) and, on the side facing the cavity (42), by an insulating layer (44).

    Abstract translation: 形成流体系统的集成装置（40）包括半导体材料以及形成填充有液体的通道（55）的盖部件（56）的一个微型的底物（41）。 的加热元件（51）由基板承载并面向通道，以便加热所述液体和产生气泡，当被激活时。 基板（41）容纳布置在所述加热元件（51; 66）的相对侧上的腔体（42），相对于以所述通道（55），以减少所述加热元件（51）朝向所述基板的热扩散（ 41）。 所述加热元件包括涂覆（45）的电阻区域，在上绝缘层面向通道（55）由保护区（49，50），并且在由面向空腔（42）的侧上的侧（44） ，

    Process for forming front-back through contacts in micro-integrated electronic devices
    33.
    发明公开
    Process for forming front-back through contacts in micro-integrated electronic devices 失效
    Herstellungsverfahrenfüreinen Vorder-Hinterseiten-Durchkontakt in mikro-integrierten Schaltungen

    公开(公告)号：EP0926723A1

    公开(公告)日：1999-06-30

    申请号：EP97830626.4

    申请日：1997-11-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno

    IPC: H01L21/74 ,  H01L23/48

    CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548

    Abstract: The process comprises the steps of: forming a through hole (12) from the back of a semiconductor material body (1); forming a hole insulating layer (15) of electrically isolating material laterally covering the walls of the through hole; forming a through contact region (16) of conductive material laterally covering the hole insulating layer inside the hole and having at least one portion (21) extending on top of the lower surface (10) of the body (1); forming a protective layer (22) covering the through contact region; and forming a connection structure (25) extending on top of the upper surface (5) of the body (1) between and in electrical contact with the through contact region (16) and the electronic component (3).

    Abstract translation: 该方法包括以下步骤：从半导体材料体（1）的背面形成通孔（12）; 形成将绝缘材料横向覆盖所述通孔壁的电绝缘层（15）; 形成导电材料的穿透接触区域（16），横向覆盖孔内的孔绝缘层，并且具有在主体（1）的下表面（10）顶部延伸的至少一个部分（21）; 形成覆盖所述贯通接触区域的保护层（22） 以及形成在主体（1）的上表面（5）的顶部上延伸穿过接触区域（16）和与电子部件（3）电接触的连接结构（25）。

    INTEGRATED PRESSURE SENSOR WITH DOUBLE MEASURING SCALE, PRESSURE MEASURING DEVICE INCLUDING THE INTEGRATED PRESSURE SENSOR, BRAKING SYSTEM, AND METHOD OF MEASURING A PRESSURE USING THE INTEGRATED PRESSURE SENSOR
    34.
    发明公开
    INTEGRATED PRESSURE SENSOR WITH DOUBLE MEASURING SCALE, PRESSURE MEASURING DEVICE INCLUDING THE INTEGRATED PRESSURE SENSOR, BRAKING SYSTEM, AND METHOD OF MEASURING A PRESSURE USING THE INTEGRATED PRESSURE SENSOR 审中-公开
    带双量表集成压力传感器，有集成压力传感器，制动系统和方法用于测量与集成压力传感器的压力压力测量装置

    公开(公告)号：EP3098584A1

    公开(公告)日：2016-11-30

    申请号：EP15200285.3

    申请日：2015-12-15

    Applicant: STMicroelectronics S.r.l.

    Inventor： Pagani, Alberto ,  Murari, Bruno ,  Ferrera, Marco ,  Giusti, Domenico ,  Caltabiano, Daniele

    IPC: G01L15/00 ,  G01L9/00

    CPC classification number: G01L9/0052 ,  G01L9/0045 ,  G01L9/0054 ,  G01L15/00

    Abstract: A pressure sensor (15) with double measuring scale, comprising: a flexible body (16, 34) designed to undergo deflection as a function of a said pressure (P); piezoresistive transducers (28, 29; 94) for detecting the deflection; a first focusing region (30) designed to concentrate, during a first operating condition, a first value (P INT1 ) of said pressure (P) in a first portion (19) of the flexible body (16, 34) so as to generate a deflection of the first portion (19) of the flexible body (16, 34); and a second focusing region (33) designed to concentrate, during a second operating condition, a second value (P INT2 ) of said pressure (P) in a second portion (17) of the flexible body (16, 34) so as to generate a deflection of the second portion (17) of the flexible body (16, 34). The piezoresistive transducers correlate the deflection of the first portion (19) of the flexible body (16, 34) to the first pressure value (P INT1 ) and the deflection of the second portion (17) of the flexible body (16, 34) to the second pressure value (P INT2 ).

    Abstract translation: 的压力传感器（15）与双测量刻度，包括：柔性体（16，34）设计成经历偏转为所述压力（P）的函数; 压阻换能器（28，29; 94），用于检测所述偏转; 设计为浓缩物，在第一操作条件期间的第一聚焦区（30），在所述柔性主体（16，34）的第一部分（19）的第一值，所述压力的（P INT1）（P），以便产生 柔性主体（16，34）的第一部分（19）的偏转; 并设计成集中，第二操作条件期间的第二聚焦区（33），第二个值的所述压力的（P INT2）（P）在所述柔性主体的第二部分（17）（16，34），以便 生成柔性主体（16，34）的第二部分（17）的偏转。 压阻传感器的柔性主体（16，34）的第一压力值（P INT1）和柔性主体的第二部分（17）的偏转的第一部分（19）的偏转相关（16，34） 到第二压力值（P INT2）。

    Micro-electro-mechanical device, in particular micro-actuator for hard-disk drive, and manufacturing process thereof
    38.
    发明公开
    Micro-electro-mechanical device, in particular micro-actuator for hard-disk drive, and manufacturing process thereof 有权
    微机电元件，特别是微致动器为硬盘单元，以及处理其制备

    公开(公告)号：EP1375416A1

    公开(公告)日：2004-01-02

    申请号：EP02425407.0

    申请日：2002-06-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno ,  Ferrari, Paolo ,  Sassolini, Simone

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  H02N1/006

    Abstract: A micro-electro-mechanical device (20) formed by a body (4) of semiconductor material having a thickness and defining a mobile part (23, 24, 31) and a fixed part (3, 25, 30). The mobile part is formed by a mobile platform (23), supporting arms (31) extending from the mobile platform to the fixed part (3, 25, 30), and by mobile electrodes (24) fixed to the mobile platform. The fixed part has fixed electrodes (25) facing the mobile electrodes (24), a first biasing region (3) fixed to the fixed electrodes, a second biasing region (30) fixed to the supporting arms (31), and an insulation region (6) of insulating material extending through the entire thickness of the body (4). The insulation region (6) insulates electrically at least one between the first and the second biasing regions (3, 30) from the rest of the fixed part.

    Abstract translation: 通过具有一定厚度和一个移动限定部分（23，24，31）和固定部件（3，25，30）的半导体材料的本体（4）形成的微机电装置（20）。 移动部分由可移动平台（23）而形成，支持从移动平台延伸到所述固定部件（3，25，30）臂（31），并且通过可移动电极（24）固定到所述移动平台。 固定部分具有固定的电极（25）的面向所述移动电极（24），第一偏置区域（3）固定到所述固定电极，固定在所述支撑臂（31）的第二偏置区域（30），并在绝缘区域 （6）绝缘材料穿过所述主体（4）的整个厚度延伸的。 绝缘区域（6）电绝缘所述第一，并从固定部分的其余部分的第二偏置区域（3，30）之间的至少一个。

    Structure for electrically connecting microelectromechanical devices,in particular microactuators for hard disk drives
    40.
    发明公开
    Structure for electrically connecting microelectromechanical devices,in particular microactuators for hard disk drives 审中-公开
    Struktur um Mikroelektromechanische Anordnungen elektrisch zu Verbinden，insbesondere MicroantriebefürFestplattenantriebe

    公开(公告)号：EP1128540A1

    公开(公告)日：2001-08-29

    申请号：EP00830128.5

    申请日：2000-02-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： Murari, Bruno ,  Vigna, Benedetto ,  Sassolini, Simone

    IPC: H02N1/00

    CPC classification number: H02N1/008

    Abstract: The electrical connection structure (15) comprises connection elements (25) which electrically connect a movable part (3) to a fixed part (4) of a microelectromechanical device, for example a microactuator (23). The movable part (3) and fixed part (4) are separated by trenches (6) and are mechanically connected by spring elements (12) which determine the torsional rigidity of the microelectromechanical device, together with the connection elements (25). Each connection element (25) is formed by more sub-arms (26) connected in parallel and having a common movable anchorage region (26a), anchored to the movable part (3), and a common fixed anchorage region (26b), anchored to the fixed part (5), thereby the mechanical resistance of the connection elements (25) is negligible. The sub-arms (26) have a width (W) equal to a submultiple of the width necessary in case of a single connection element for the latter to have a preset electrical resistance, determined in the design; namely, the width of the sub-arms (26) is equal to the width of the single connection element divided by the number of sub-arms.

    Abstract translation: 电连接结构（15）包括将可移动部分（3）电连接到微机电装置例如微致动器（23）的固定部分（4）的连接元件（25）。 可移动部分（3）和固定部分（4）由沟槽（6）分开，并通过弹簧元件（12）机械连接，弹簧元件（12）与连接元件（25）一起确定微机电装置的扭转刚度。 每个连接元件（25）由更多的平行连接的子臂（26）形成，并且具有锚固到可动部分（3）的公共可移动锚固区域（26a）和锚固的公共固定锚固区域（26b） 到固定部分（5），因此连接元件（25）的机械阻力可以忽略不计。 子臂（26）的宽度（W）等于在单个连接元件的情况下所需的宽度的倍数，后者具有在设计中确定的预设电阻; 即子臂（26）的宽度等于单个连接元件的宽度除以子臂的数量。

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