Abstract:
The invention relates to a non volatile memory electronic device (20) integrated on semiconductor and of the Flash EEPROM type with NAND architecture comprising at least one memory matrix (21) divided into physical sectors, intended as smallest erasable units, and organised in rows or word lines (WL) and columns or bit lines (BL) of memory cells. At least one row (ROW_i) or word line of a given physical sector is electrically connected to at least one row or word line of an adjacent physical sector to form a single logic sector being completely erasable, with the source terminals of the corresponding cells of the pair of connected rows referring to a same selection line (SSL) of source line.
Abstract:
The invention relates to a method for programming a non-volatile memory device of the multi-level type, comprising a plurality of transistor cells grouped into memory words and conventionally provided with gate and drain terminals. The method applies different drain voltage values at different threshold values. Such values are directly proportional to the threshold levels to be attained by the individual memory word bits, and effective to provide for a simultaneous attainment of the levels, in a seeking-to manner, of the levels at the end of a limited number of pulses. Advantageously, a constant gate voltage value is concurrently applied to the gate terminals of said cells, such that the cell programming time is unrelated to the threshold level sought.
Abstract:
The invention relates to a method for programming a non-volatile memory device of the multi-level type, comprising a plurality of transistor cells grouped into memory words and conventionally provided with gate and drain terminals. The method applies different drain voltage values at different threshold values. Such values are directly proportional to the threshold levels to be attained by the individual memory word bits, and effective to provide for a simultaneous attainment of the levels, in a seeking-to manner, of the levels at the end of a limited number of pulses. Advantageously, a constant gate voltage value is concurrently applied to the gate terminals of said cells, such that the cell programming time is unrelated to the threshold level sought.
Abstract:
The invention is referred to a non-volatile memory matrix architecture with virtual ground monolithically integrated on semiconductor and of the type comprising a plurality of memory cells (2), organized into matrix blocks or sectors, which are placed on rows (WL) and columns (BL) and associated to respective row and column decoding circuits, characterized in that said cell blocks or sectors are separated from each other by at least one insulation stripe, which is palallel to the columns (BL). Advantageously, it is provided a pass-transistor decoding circuitry (10), with a number of levels corresponding to the number of rows to select.
Abstract:
A nonvolatile memory (1) having a NOR architecture has a memory array (2) including a plurality of memory cells (3) arranged in rows and columns in NOR configuration, the memory cells (3) arranged on a same column being connected to one of a plurality of bit lines (11); and a column decoder (6). The column decoder comprises a plurality of selection stages (17), each of which is connected to respective bit lines (11) and receives first bit line addressing signals (YM 0 , ..., YM 7 ). The selection stages (17) comprise word programming selectors (28) controlled by the first bit line addressing signals (YM 0 , ..., YM 7 ) and supplying a programming voltage (70) to only one of the bit lines (11) of each selection stage (17). Each selection stage (17) moreover comprises a string programming selection circuit (29, 30) controlled by second bit line addressing signals (S 0 , ..., S 7 ) thereby simultaneously supplying the programming voltage (70) to a plurality of the bit lines (11) of each selection stage (17).
Abstract:
A voltage boosting device for speeding power-up of multilevel nonvolatile memories, including a voltage regulator (11) and a charge pump (13) and having an output terminal (10); the voltage regulator (11) having a regulation terminal connected to the output terminal (10), and an output (16) supplying a control voltage (V L ); the read charge pump (13) having an output connected to the output terminal (10) and supplying a read voltage (V R ). The device further includes an enable circuit (12) connected to the output (16) and having a pump enable output (17) connected to a charge pump enable terminal (13) and supplying a pump enable signal (PE). The pump enable signal (PE) is set at a first logic level so as to activate the charge pump (13) when the read voltage (V R ) is lower than a nominal value. In addition, the device generates a power-up sync signal (ATDS) which activates a read operation when the read voltage (V R ) reaches its nominal value and a chip enable signal (CE) is set at an active value.
Abstract:
A reading method for non-volatile memory cells is illustrated which comprises a first step in which a memory cell (P2) of the matrix is selected by the row decoder (5) and by the column multiplexer (4), a second step of preload and equalization during which the voltage on the drain electrode of the selected memory cell (P2) reaches a defined value and is characterized by a third step during which the selected cell (P2) is read with a sensing ratio depending on the reading voltage of said cell. Moreover a device for the reading of said cells is described, which comprises a modulation branch (MOD) with at least one selection transistor (MV10) and a load generator (23) associated to said modulation transistor (MV10) in such a way to modulate analogicly the transconductance of one of the two load transistors (M1, M2) in function of the reading voltage of the memory cell (P2).