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    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
    37.
    发明申请
    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING 审中-公开
    WAFER LEVEL MEMS封装包括双密封圈

    公开(公告)号：WO2016209339A1

    公开(公告)日：2016-12-29

    申请号：PCT/US2016/028338

    申请日：2016-04-20

    Applicant: RAYTHEON COMPANY

    Inventor： DIEP, Buu Q. ,  KENNEDY, Adam M. ,  KOCIAN, Thomas Allan ,  LAMB, Mark

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

    Abstract translation: 微机电系统（MEMS）封装包括在第一对外边缘之间延伸以限定长度的基板和限定宽度的第二对外边缘。 密封环组件设置在基板上，并且包括至少一个密封环，其形成与至少一个MEMS装置相邻的第一边界点和邻近至少一个外边缘的第二边界点。 封装还包括在密封环组件上的窗口盖，以限定包含至少一个MEMS器件的密封间隙。 密封圈组件在第二边界点将窗口盖固定到基底，使得窗口盖进入密封间隙的偏转减小。

    HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
    38.
    发明申请
    HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER 审中-公开
    具有应力减少层的人造密封包装

    公开(公告)号：WO2016024946A1

    公开(公告)日：2016-02-18

    申请号：PCT/US2014/050589

    申请日：2014-08-11

    Applicant: RAYTHEON COMPANY

    Inventor： KENNEDY, Adam, M. ,  DIEP, Buu, Q. ,  BLACK, Stephen, H. ,  WONG, Tse, E. ,  KOCIAN, Thomas, Allan ,  TRACY, Gregory, D.

    IPC: B81C1/00 ,  H01L23/10 ,  H01L23/00

    CPC classification number: H01L23/10 ,  B81B7/0051 ,  B81B2201/0207 ,  B81C2203/0109 ,  B81C2203/035 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A sealed package having a device 102 disposed on a wafer structure and a lid structure 108 bonded to the device wafer. The device wafer includes: a substrate 104; a metal ring 107DW disposed on a surface portion of substrate around the device and a bonding material 118 disposed on the metal ring. A first layer of the metal ring includes a stress relief buffer layer 109DW having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.

    Abstract translation: 密封包装，其具有设置在晶片结构上的装置102和结合到装置晶片的盖结构108。 器件晶片包括：衬底104; 设置在设备周围的基板的表面部分上的金属环107DW和设置在金属环上的接合材料118。 金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层109DW以及大于接合材料的宽度的宽度。 金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。 应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数，小于接合材料的膨胀系数。

    DISTRIBUTED SENSOR SYSTEM
    39.
    发明申请
    DISTRIBUTED SENSOR SYSTEM 审中-公开
    分布式传感器系统

    公开(公告)号：WO2014151905A1

    公开(公告)日：2014-09-25

    申请号：PCT/US2014/026646

    申请日：2014-03-13

    Applicant: GOGOI, Bishnu

    Inventor： GOGOI, Bishnu

    IPC: H01L21/00 ,  H01L21/02 ,  H01L29/82

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able to collect data about the environment in a distributed manner. An example of a distributed sensor system comprises a first sensor node and a second sensor node. Each sensor node has a plurality of sensors or a MIMS device. Each sensor node can also include electronic circuitry or a power source. A joint region is coupled between a first flexible interconnect region and a second flexible interconnect region. The first sensor node is coupled to the first flexible interconnect region. Similarly, the second sensor node is coupled to the second flexible interconnect region.

    Abstract translation: 公开了一种在操作环境中提供空间和时间数据的分布式传感器系统。 分布式传感器节点可以耦合在一起以形成分布式传感器系统。 例如，分布式传感器系统包括物理耦合并且能够以分布式方式收集关于环境的数据的传感器节点（SN）的集合。 分布式传感器系统的示例包括第一传感器节点和第二传感器节点。 每个传感器节点具有多个传感器或MIMS装置。 每个传感器节点还可以包括电子电路或电源。 联接区域耦合在第一柔性互连区域和第二柔性互连区域之间。 第一传感器节点耦合到第一柔性互连区域。 类似地，第二传感器节点耦合到第二柔性互连区域。

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