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31.发明申请公开(公告)号：US20160023888A1
公开(公告)日：2016-01-28
申请号：US14532658
申请日：2014-11-04
Applicant: Silicon Laboratories Inc.
Inventor： Emmanuel P. Quevy , Jeremy R. Hui , Carrie Wing-Zin Low , Mehrnaz Motiee
CPC classification number: B81C1/00246 , B81B3/0021 , B81B7/007 , B81B7/0077 , B81B7/008 , B81B2201/0214 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C1/00269 , B81C1/00285 , B81C1/00333 , B81C1/0038 , B81C2201/0105 , B81C2201/056 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , B81C2203/019 , B81C2203/0735 , G01N27/223 , G01N27/227
Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.
Abstract translation: 可以在一个示例中实现的方法和结构，以共同整合用于薄膜封装和形成微电子器件和微机电系统（MEMS）例如传感器和致动器的过程。 例如，可以使用相同的基本工艺流程来制造具有不同特性的结构，通过选择与基本工艺流程一起使用的不同工艺选项或模块以便创建所需的结构。 可以通过各种公开的处理流程序列有利地实现各种处理流程序列以及各种设备设计结构。
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公开(公告)号：KR1020170094428A
公开(公告)日：2017-08-17
申请号：KR1020177019456
申请日：2015-12-14
Applicant: 고어텍 인크
Inventor： 순,얀메이
CPC classification number: B81B7/02 , B81B2201/0257 , B81B2201/0264 , B81C1/00158 , B81C2201/0105 , B81C2201/013 , G01L7/08 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003 , H04R31/006 , B81C1/00301
Abstract: 본발명은 MEMS 마이크, 압력센서집적구조및 그제조방법을개시한다. 공용기판에서순차적으로절연층, 제1다결정실리콘층, 희생층과제2다결정실리콘층을퇴적시키고; 제2다결정실리콘층을에칭하여진동막, 상부전극을형성하며; 희생층을부식하여마이크, 압력센서의사각공동을형성하고, 마이크, 압력센서사이의희생층을에칭하며; 제1다결정실리콘층을에칭하여마이크의배극및 압력센서의하부전극을형성하고; 공용기판의마이크배극아래측에위치하는위치를에칭하여백 공동을형성하고; 배극아래측에위치하는절연층을에칭한다. 마이크의콘덴서구조, 압력센서의콘덴서구조를공용기판에집적하여, 마이크와압력센서의집적도를향상시키고, 패키지구조전체의사이즈를크게줄일수 있으며, 또한, 공용기판에서동시에마이크와압력센서를제조할수 있고생산효율을향상시킨다.
Abstract translation: 本发明公开了一种MEMS麦克风，压力传感器一体结构及其制造方法。 在共同的衬底上依次沉积绝缘层，第一多晶硅层和牺牲层任务2多晶硅层; 蚀刻第二多晶硅层以形成隔膜和上电极; 蚀刻牺牲层以形成麦克风和压力传感器的方形空腔，蚀刻麦克风和压力传感器之间的牺牲层; 蚀刻第一多晶硅层以形成偶极子的下电极和麦克风的压力传感器; 通过蚀刻位于公共基板的麦克风基板下侧的位置来形成后腔; 位于阳极下侧的绝缘层被蚀刻。 到麦克风电容器结构中，在公共衬底中的压力传感器的集成电容结构，改善了麦克风的集成度和压力传感器和的程度，并以显著减小封装结构的整体尺寸，并且，在同一时间产生一个麦克风和在共用基板的压力传感器 并提高生产效率。
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公开(公告)号：JP6400693B2
公开(公告)日：2018-10-03
申请号：JP2016522377
申请日：2014-06-11
Inventor： サダカ, マリアム , エスカルノー, ルドヴィック
CPC classification number: B81C1/00047 , B81B1/002 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C2201/0105 , B81C2201/014 , B81C2201/0192
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公开(公告)号：JP2018510533A
公开(公告)日：2018-04-12
申请号：JP2017539537
申请日：2015-12-14
Applicant: ゴルテック.インク
Inventor： スン ヤンメイ
CPC classification number: B81B7/02 , B81B2201/0257 , B81B2201/0264 , B81C1/00158 , B81C2201/0105 , B81C2201/013 , G01L7/08 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: 本発明はMEMSマイクロフォンと圧力センサの集積構造及びその製造方法を開示するものである。共通基板に絶縁層、第1多結晶シリコン層、犠牲層と第2多結晶シリコン層をこの順で堆積する。第2多結晶シリコン層をエッチングして、振動膜、上部電極を形成する。犠牲層を腐食して、マイクロフォンと圧力センサの収容キャビティを形成すると共に、マイクロフォンと圧力センサとの間の犠牲層を腐食する。第1多結晶シリコン層をエッチングして、マイクロフォンの背後電極及び圧力センサの下部電極を形成する。共通基板におけるマイクロフォンの背後電極の下方に位置する部位をエッチングして、バックキャビティを形成する。背後電極の下方に位置する絶縁層をエッチングする。マイクロフォンのコンデンサ構造、圧力センサのコンデンサ構造を共通基板に集積することにより、マイクロフォンと圧力センサの集積度を向上させ、パッケージ構造全体のサイズを大幅に減らすことができる。また、共通基板にマイクロフォンと圧力センサを同時に製造することができ、生産効率の向上が図られている。
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公开(公告)号：KR1020070063163A
公开(公告)日：2007-06-19
申请号：KR1020050123121
申请日：2005-12-14
Applicant: 삼성전기주식회사
Inventor： 장제욱
CPC classification number: G02B26/0858 , B81C1/00388 , B81C2201/0105 , B81C2201/013 , B81C2201/014 , B81C2201/117 , G02B26/0808
Abstract: An optical modulator with a protective film and a manufacturing method thereof are provided to prevent damage of a ribbon by restricting the lateral or lower side of a reflection region of the ribbon from being eroded due to etching gas, and to prevent separation of an interface formed between the ribbon and a light reflecting layer by improving adhesion between the ribbon and the light reflecting layer. An optical modulator with a protective film is composed of a substrate(110); an insulating layer(120) positioned on the substrate; a lower light reflecting layer(120a) positioned on the insulating layer to reflect or diffract the incident light; a structure layer(140) having a center portion separated from the lower light reflecting layer in a predetermined gap and a lower protective film(140d) protecting the underside of a reflection region except for a part of the center portion where a hole is formed; an upper light reflecting layer(140a) disposed on the reflection region to reflect or diffract the incident light; and piezo-electric actuators(150) disposed at both side ends of the structure layer to vertically move the center portion of the structure layer.
Abstract translation: 提供具有保护膜的光学调制器及其制造方法，以通过限制由于蚀刻气体而使该带的反射区域的横向或下侧受到侵蚀而防止带状物的损坏，并且防止形成的界面的分离 通过提高带和光反射层之间的粘合力，在带和光反射层之间。 具有保护膜的光学调制器由衬底（110）组成; 位于所述基板上的绝缘层（120）; 位于所述绝缘层上以反射或衍射所述入射光的下部光反射层（120a）; 具有以预定间隙从下部光反射层分离的中心部分的结构层（140d）以及保护除了形成有孔的中心部分的一部分之外的反射区域的下侧的下保护膜（140d） 设置在反射区域上以反射或衍射入射光的上部光反射层（140a）; 以及设置在结构层的两侧的压电致动器（150），以垂直移动结构层的中心部分。
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Patent Agency Ranking
公开(公告)号：KR1020070063176A
公开(公告)日：2007-06-19
申请号：KR1020050123138
申请日：2005-12-14
Applicant: 삼성전기주식회사
Inventor： 이선호
CPC classification number: G02B26/0858 , B81B2203/0353 , B81C2201/0105 , B81C2201/013 , G02B26/0808
Abstract: An optical modulator having plural driving elements is provided to drive a suspended part of the driving element in both directions and to obtain maximum diffraction efficiency with low driving voltage. An optical modulator having plural driving elements is composed of a substrate(210); a lower reflecting layer stacked on the substrate to reflect the incident light; a ribbon structure(260) having a center portion separated from the lower reflecting layer correspondingly to a driving space, and reflecting or diffracting the incident light through a step formed between the lower reflecting layer and the ribbon structure; a first driving unit(245) disposed between the substrate and the ribbon structure to vertically drive the center portion of the ribbon structure; and a second driving unit(275) positioned on the ribbon structure to provide vertical driving power for vertically moving the center portion of the ribbon structure.
Abstract translation: 具有多个驱动元件的光调制器被设置为在两个方向上驱动驱动元件的悬置部分并且以低的驱动电压获得最大的衍射效率。 具有多个驱动元件的光调制器由基板（210）构成; 层叠在基板上以反射入射光的下反射层; 带状结构（260）具有与下反射层相对应的驱动空间的中心部分，并且通过形成在下反射层与带状结构之间的台阶反射或衍射入射光; 第一驱动单元（245），设置在所述基板和所述带状结构之间，以垂直驱动所述带状结构的中心部分; 以及位于所述带状结构上的第二驱动单元（275），以提供用于垂直移动所述带状结构的中心部分的垂直驱动力。
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37.发明授权公开(公告)号：US11939212B2
公开(公告)日：2024-03-26
申请号：US17412160
申请日：2021-08-25
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chung Chang , Jhih-Jie Huang , Chih-Ya Tsai , Jing-Yuan Lin
IPC: B81C1/00
CPC classification number: B81C1/00015 , B81C1/00476 , B81C1/00531 , B81C1/00539 , B81C2201/0105 , B81C2201/0198 , B81C2203/0172
Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
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38.发明授权公开(公告)号：US11788912B2
公开(公告)日：2023-10-17
申请号：US16972588
申请日：2019-06-28
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber
CPC classification number: G01L9/0048 , B81B3/0021 , B81C1/00182 , G01L9/005 , G01L9/0073 , G01L19/145 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81C2201/013 , B81C2201/0105
Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.
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公开(公告)号：US11767217B2
公开(公告)日：2023-09-26
申请号：US17581972
申请日：2022-01-23
Inventor： Ranganathan Nagarajan , Jia Jie Xia , Rakesh Kumar , Bevita Kallupalathinkal Chandran
CPC classification number: B81B3/0081 , B81C1/0069 , B81B2203/0127 , B81B2203/0307 , B81C2201/0105
Abstract: A method of forming a MEMS device includes providing a substrate having a device stopper. The device stopper is integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may be formed in the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be formed over the thermal dielectric isolation layer and the device cavity.
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40.发明公开公开(公告)号：US20230242393A1
公开(公告)日：2023-08-03
申请号：US18043374
申请日：2021-08-18
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Peter Schmollngruber , Thomas Friedrich
CPC classification number: B81B3/0086 , B81B3/001 , B81C1/00968 , B81C1/00698 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2203/04 , B81C2201/0105 , B81B2201/0221
Abstract: A micromechanical component for a sensor or microphone device. An electrode surface of a first electrode structure is aligned with a second electrode structure. A substructure of the first electrode structure is entirely made of at least one electrically conductive material. The electrode surface and an opposite surface of the first electrode structure are outer surfaces of the substructure. A stop structure protruding from the electrode surface towards the second electrode structure is formed on the first electrode structure. The first electrode structure includes an insulating region which extends from the electrode surface to the opposite surface of the first electrode structure. The stop structure is formed either as a projection of the at least one insulating region protruding from the electrode surface towards the second electrode structure or is bordered by the at least one insulating region.
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