Abstract:
Method of measuring nanoscale deformations in a portion (B) of a crystalline specimen, comprising the following steps: i) a lamella-shaped specimen comprising a measurement zone (B) and a reference zone (A), the latter being assumed to be free of deformations and coplanar with the measurement zone, is prepared; ii) one face of said specimen is illuminated by an electron beam (Fin); iii) a beam (F1 B) of the radiation diffracted by the measurement zone (B) is superposed on a beam (F1 A) of the radiation diffracted by the reference zone (A) so as to cause these two beams to interfere; iv) the spatial periodicity and the orientation of the fringes of the interference pattern (FI) are measured; and v) a difference in crystal parameter and/or orientation between said reference zone and measurement zone is deduced therefrom, this being indicative of a state of nanoscale deformation of said measurement zone. Device and system for implementing such a method.
Abstract:
An electron microscope capable of re-constructing a microscope image free of the imaging aberration due to the imaging lens by using a hologram of diffraction pattern and a composite irradiation lens used in such an electron microscope. The electron microscope comprises an electron source (11), a condenser lens (12), a biprism (13) for splitting an electron beam fed from the condenser lens (12) into first and second coherent electron beams (L1, L2) parallel to each other, a composite irradiation lens (15) for making the first electron beam (L1) a parallel wave and making the second electron beam (L2) a converging wave converging at a predetermined distance, a specimen stage (16) for holding a specimen irradiated with the first electron beam (L1), a detector (17) for detecting a hologram of the diffraction pattern formed by the interference between the first and second electron beams (L1, L2), a computing unit (18) for re-constructing a microscope image of the specimen by subjecting the hologram fed from the detector (17) to predetermined Fourier transform, and a display (19) for displaying the re-constructed microscope image.
Abstract:
A method for examining the results after the manufacturing process of an LSI (Large scale integration) device, particularly, an examining method used for quickly and accurately examining the cross section fine structure of an LSI device produced after the manufacturing process. Its examining device and a semiconductor device suited to the examination are also disclosed. The examining method is characterized by comprising a sample making step of thinning a semiconductor chip in such a way that the substrate crystal and a portion added in the manufacturing process are included, a step of applying an electron beam to the semiconductor chip, a step of detecting an electron beam passing through the semiconductor chip to create an electron beam diffraction image, a step of removing the electron beam diffracted by the substrate crystal, and a step of comparing the lattice fringes obtained from the substrate crystal with the thickness of the portion added in the manufacturing process.
Abstract:
A high voltage feedthrough assembly 100 for providing an electric potential in a vacuum environment comprises a flange connector 10 being adapted for a connection with a vacuum vessel 201, wherein the flange connector 10 has an inner side facing to the vacuum vessel 201 and an outer side facing to an environment of the vacuum vessel 201, a vacuum-tight insulator tube 20 having a longitudinal extension with a first end facing to the flange connector 10 and a second end being adapted for projecting into the vacuum vessel 201, and an electrode device coupled to the second end of the insulator tube 20, wherein the electrode device has a front electrode 31 facing to the vacuum vessel 201 and a cable adapter 32 for receiving a high-voltage cable 214, wherein a flexible tube connector 40 is provided for a vacuum-tight coupling of the insulator tube 20 with the flange connector 10, and a manipulator device 50 is connected with the insulator tube 20 for adjusting a geometrical arrangement of the insulator tube 20 relative to the flange connector 10. Furthermore, an electron diffraction apparatus 200 including the high voltage feedthrough assembly 100 and a method of manipulating an electrode device in a vacuum environment are described.
Abstract:
A high voltage feedthrough assembly 100 for providing an electric potential in a vacuum environment comprises a flange connector 10 being adapted for a connection with a vacuum vessel 201, wherein the flange connector 10 has an inner side facing to the vacuum vessel 201 and an outer side facing to an environment of the vacuum vessel 201, a vacuum-tight insulator tube 20 having a longitudinal extension with a first end facing to the flange connector 10 and a second end being adapted for projecting into the vacuum vessel 201, and an electrode device coupled to the second end of the insulator tube 20, wherein the electrode device has a front electrode 31 facing to the vacuum vessel 201 and a cable adapter 32 for receiving a high-voltage cable 214, wherein a flexible tube connector 40 is provided for a vacuum-tight coupling of the insulator tube 20 with the flange connector 10, and a manipulator device 50 is connected with the insulator tube 20 for adjusting a geometrical arrangement of the insulator tube 20 relative to the flange connector 10. Furthermore, an electron diffraction apparatus 200 including the high voltage feedthrough assembly 100 and a method of manipulating an electrode device in a vacuum environment are described.
Abstract:
An electron beam device includes a first electron biprism between an acceleration tube and irradiation lens systems, and an electron biprism in the image forming lens system. The first electron biprism splits the electron beam into first and second electron beams, radiated to differently positioned first and second regions on objective plane of an objective lens system having a specimen perpendicular to an optical axis. The first and second electron beams are superposed on the observation plane by the electron biprism of the image forming lens system. The superposed region of those electron beams is observed or recorded. Optical action of the irradiation lens system controls each current density of the first and second electron beams on the objective plane of the objective lens system having the specimen, and distance on electron optics between first electron biprism and the objective plane of the objective lens system having the specimen.
Abstract:
The present invention relates to a method for preparing and analyzing an object (16, 36) comprising a region of interest to be analyzed. The method comprises removing material from a first surface of the object (16) using a second particle beam and monitoring the first surface of the object (16) using a first particle beam and using a second detector, wherein a second surface of the object (16) is generated when the material is removed from the first surface of the object (16), removing material from the second surface of the object (16) using the second particle beam and monitoring the step of removing the material from the object (16) using the first particle beam and using the second detector, wherein the step of removing the material generates a first side (39) of the region of interest and a second side of the region of interest (33), wherein the region of interest (33) to be analyzed is arranged between the first side (39) and the second side (40), guiding the first particle beam to the first side (39) of the region of interest, detecting first charged particles of the first particle beam being transmitted through the region of interest using a first detector (EBSD detector 1000), generating detection signals using the detected first charged particles and acquiring at least one Kikuchi diffraction pattern of the region of interest, and analyzing the region of interest using the diffraction pattern
Abstract:
A first electron biprism is disposed in a condenser optical system and an observation region of a specimen is irradiated simultaneously with two electron beams of different angles. The two electron beams that have simultaneously transmitted the specimen are spatially separated and focused with a second electron biprism disposed in an imaging optical system and two electron microscopic images of different irradiation angles are obtained. The two picture images are obtained by a detecting unit. Based on the two picture images, a stereoscopic image or two images having different kinds of information of the specimen is/are produced and displayed on a display device.
Abstract:
The present invention relates to a device and method which enable a transmission electron microscope to measure very precisely electron diffraction patterns of a sample, said patterns suitable for structure determination therefrom, wherein the electron beam is precessed by means of deflector coils (6) in the transmission electron microscope before the sample (4), in combination with a similar precession of the electron diffraction pattern by means of deflector coils (9) situated after the sample. The electron diffraction pattern is scanned by means of deflector coils (9) situated after the sample.