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31.发明授权公开(公告)号：US09670340B2
公开(公告)日：2017-06-06
申请号：US15351151
申请日：2016-11-14
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
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32.发明申请INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME 审中-公开无机填充物，包含相同的树脂组合物和使用其的热辐射基材公开(公告)号：US20170058107A1
公开(公告)日：2017-03-02
申请号：US15351151
申请日：2016-11-14
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。
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公开(公告)号：US20150187453A1
公开(公告)日：2015-07-02
申请号：US14140534
申请日：2013-12-26
Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： CHANG-CHIN WU , PEI-RONG SHIEH
CPC classification number: H01B1/16 , G02F1/13452 , H05K3/323 , H05K2201/0221 , H05K2201/0224 , H05K2201/0227 , Y10T428/249983
Abstract: An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. The insulation layer defines a plurality of holes, thus the insulation layer is porous, the insulation layer is capable of being partly exposed from the plurality of holes when the plurality of conductive particles is pressed. A method for manufacturing the anisotropic conductive film is also provided.
Abstract translation: 各向异性导电膜包括基板和涂覆在基板的侧表面上的绝缘粘合剂层。 绝缘粘合剂层包括分散在绝缘粘合剂层中的多个导电颗粒。 多个导电粒子中的每一个包括球形基部，形成在球形基部上的导电膜，以及在导电膜上形成有陶瓷材料的绝缘层。 绝缘层限定多个孔，因此绝缘层是多孔的，当多个导电颗粒被按压时，绝缘层能够从多个孔部分露出。 还提供了制造各向异性导电膜的方法。
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公开(公告)号：US20140054077A1
公开(公告)日：2014-02-27
申请号：US13994253
申请日：2012-10-18
Applicant: Panasonic Corporation
Inventor： Masanori Minamio , Hiroki Ikeuchi
IPC: H05K1/03
CPC classification number: H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
Abstract translation: 半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变 以提高介电强度。 填料7的效果达到具有令人满意的散热和高耐受电压的结构。
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公开(公告)号：US08449143B2
公开(公告)日：2013-05-28
申请号：US12600377
申请日：2008-05-14
Applicant: Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
Inventor： Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
IPC: F21V7/00
CPC classification number: H05K1/0274 , H01L33/60 , H05K1/056 , H05K3/28 , H05K2201/0209 , H05K2201/0227 , H05K2201/0266 , H05K2201/0338 , H05K2201/09909 , H05K2201/10106 , H05K2201/2054
Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.
Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。
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Patent Agency Ranking36.发明授权
公开(公告)号：EP2784808B1
公开(公告)日：2016-07-06
申请号：EP12851940.2
申请日：2012-10-18
Inventor： MINAMIO, Masanori , IKEUCHI, Hiroki
IPC: H01L23/29 , H01L23/31 , H05K1/03 , H05K3/46 , H01L23/498 , H01L23/427 , H01L23/433 , H01L23/495 , H05K1/02 , H05K3/28 , H01L23/00 , H05K1/18
CPC classification number: H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
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37.发明公开
公开(公告)号：EP2784808A4
公开(公告)日：2015-10-07
申请号：EP12851940
申请日：2012-10-18
Applicant: PANASONIC IP MAN CO LTD
Inventor： MINAMIO MASANORI , IKEUCHI HIROKI
IPC: H01L23/29 , H01L23/00 , H01L23/31 , H01L23/427 , H01L23/433 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/28 , H05K3/46
CPC classification number: H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
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公开(公告)号：EP2160082A1
公开(公告)日：2010-03-03
申请号：EP08752683.6
申请日：2008-05-14
Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
Inventor： MIYAKAWA, Takeshi , MIYATA, Kenji , NISHI, Taiki , OKAJIMA, Yoshihiko
CPC classification number: H05K1/0274 , H01L33/60 , H05K1/056 , H05K3/28 , H05K2201/0209 , H05K2201/0227 , H05K2201/0266 , H05K2201/0338 , H05K2201/09909 , H05K2201/10106 , H05K2201/2054
Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.
Abstract translation: 提供了除了用于安装电子部件的传统印刷电路板功能之外，具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层布置在金属板上的电路。 绝缘层至少布置有白色膜。
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公开(公告)号：WO2013187303A1
公开(公告)日：2013-12-19
申请号：PCT/JP2013/065678
申请日：2013-06-06
Applicant: 三菱瓦斯化学株式会社
CPC classification number: H05K1/0366 , B32B5/022 , B32B5/024 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/304 , B32B2307/306 , B32B2307/5825 , B32B2307/726 , B32B2457/08 , C08G59/4014 , C08J5/24 , C08J2363/02 , C08J2363/04 , C08K3/14 , C08K9/02 , C08L63/00 , H05K1/0353 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H05K2201/0224 , H05K2201/0227 , Y10T428/24893 , Y10T442/2721 , Y10T442/3415 , Y10T442/3423 , Y10T442/656 , C08L79/04
Abstract: 放熱性、吸水性、銅箔ピール強度、及び吸湿耐熱性に優れるプリント配線板等を実現可能な樹脂組成物、並びに、これを用いたプリプレグ、積層板、金属箔張積層板及びプリント配線板等を提供する。本発明の樹脂組成物は、エポキシ樹脂（Ａ）、シアン酸エステル化合物（Ｂ）及び無機充填材（Ｃ）を少なくとも含有し、該無機充填材（Ｃ）は、炭化ケイ素粉体の表面の少なくとも一部が無機酸化物で処理された表面処理炭化ケイ素（Ｃ－１）を少なくとも含む。
Abstract translation: 提供：能够提供散热性，吸水性，铜箔剥离强度和吸湿后的耐热性优异的印刷线路板等的树脂组合物。 以及使用该树脂组合物的预浸料坯，层叠体，覆金属箔层压板，印刷布线板等。 本发明的树脂组合物至少含有（A）环氧树脂，（B）氰酸酯化合物和（C）无机填料; 无机填料（C）至少含有通过用无机氧化物处理碳化硅粉末的至少一部分表面而得到的表面处理碳化硅（C-1）。
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公开(公告)号：WO2011096295A1
公开(公告)日：2011-08-11
申请号：PCT/JP2011/051267
申请日：2011-01-25
CPC classification number: C08G18/6674 , C08G18/0852 , C08G18/4833 , C08G18/4845 , C08G18/758 , C08L63/00 , H05K3/285 , H05K2201/0209 , H05K2201/0212 , H05K2201/0227
Abstract: 本発明は、低反り性および長期電気絶縁信頼性に優れ、かつフレキシブル配線板の配線の断線を抑制する絶縁膜を形成しうる熱硬化性組成物を提供することを目的とする。 本発明の熱硬化性組成物は、硬化させることにより、フレキシブル基板上に配線パターンが形成されてなるフレキシブル配線板の上に絶縁膜を形成するための熱硬化性組成物であって、該組成物を硬化させて得られる硬化物の引張弾性率が0.5～2.0GPaであることを特徴とする。
Abstract translation: 本发明提供一种热塑性组合物，其具有低翘曲性和优异的长期电绝缘可靠性，并且可以形成防止柔性布线板上的布线断开的绝缘膜。 具体地说，公开了一种通过在柔性基板上形成布线图形而形成的柔性布线板上固化所述热固性组合物的热固性组合物，其中通过固化所述组合物获得的固化产物具有拉伸弹性 模量为0.5〜2.0GPa。
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