公开(公告)号：JP2010140986A

公开(公告)日：2010-06-24

申请号：JP2008313966

申请日：2008-12-10

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： OSHIMA KAZUHIRO ,  HIRABAYASHI YOSHIKAZU ,  MATSUSHITA NORITAKA ,  NAKAJIMA SHIGEO

IPC: H01L23/12

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a reliable wiring board having a lead pin for ensuring full junction strength between the lead pin and a connection pad formed on the wiring board, and to provide the lead pin used for the wiring board. SOLUTION: In the wiring board 30 having the lead pin 20, the lead pin 20 is jointed to a connection pad 12 formed on a wiring board 10 via a conductive material 14, a projection 20c is formed at a surface side, opposing the connection pad 12 of a head section 20b formed at one end of a shaft section 20a, and tapered sections 20d, 20e are formed between the head section 20b and the base part of the shaft section 20a, and between the head section 20b and the base part of the projection 20c. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可靠的布线板，其具有用于确保引线与形成在布线板上的连接焊盘之间的全结合强度的引脚，并且提供用于布线板的引线引脚。 解决方案：在具有引脚20的布线板30中，引脚20通过导电材料14接合到形成在布线板10上的连接焊盘12上，在表面侧形成有突起20c， 形成在轴部20a的一端的头部20b的连接垫12和锥形部20d，20e形成在头部20b和轴部20a的基部之间，并且在头部20b和 突出部20c的基部。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2006156819A

公开(公告)日：2006-06-15

申请号：JP2004347102

申请日：2004-11-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： ONISHI JUN

IPC: H01L23/50 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component that improves connection reliability. SOLUTION: In a surface-mounted electronic component 10 that extends to the outside from the periphery of a package 11 and comprises an outer lead 12 to be connected to a wired pattern 21 on a printed circuit board 20 via a solder 30, a fold 12a for connecting the outer lead 12 is provided with an opening 12b (12c) open into a side at least adjacent to the solder 30. In this way, a filet 30a is formed in the inner periphery of the opening 12b (12c) provided to the fold 12a of the outer lead, so that the previous connection reliability can be improved. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种提高连接可靠性的电子部件。 解决方案：在从封装11的周边向外延伸的表面安装的电子部件10中，包括经由焊料30连接到印刷电路板20上的布线图案21的外引线12， 用于连接外引线12的折叠部分12a设置有至少与焊料30相邻的侧面开口的开口12b（12c）。这样，在开口12b（12c）的内周形成有file口30a， 提供给外部引线的折叠部分12a，从而可以提高先前的连接可靠性。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2016219814A

公开(公告)日：2016-12-22

申请号：JP2016126290

申请日：2016-06-27

Applicant: ケメット エレクトロニクス コーポレーション

Inventor： マコーネル ジョン イー. ,  ウェブスター アラン ピー. ,  ジョーンズ ロニー ジー. ,  レナー ギャリー エル. ,  ベル ジェフリー

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G2/06 ,  H05K1/18 ,  H05K3/34 ,  H01G4/228

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: 【課題】側面スペースを確保して、部品の転倒といった組み立てにおける問題を回避しつつ、回路基板上の垂直方向のスペースを利用できる部品及び方法を提供する。 【解決手段】積層受動電子部品は、個別の電子コンデンサの積層体10 1 〜10 N と、前記積層体の第1の側面に取り付けられた第1のリード12と、を備える。第2のリード12が前記積層体の第2の側面に取り付けられている。足20が、前記第1のリードに取り付けられ、前記第2のリードに向かって内側に伸びている。安定ピンが、前記足および前記第1のリードの一方に取り付けられている。 【選択図】図2

Abstract translation: 有担保侧空间，同时避免在组装这些部件的问题下降，提供的组件和方法可以利用在电路板上的垂直空间。 一种多层的无源电子元件包括层压101〜10N个别电子电容器，第一引线12附接至层压板的第一侧，所述。 第二引线12附接至层压板的第二侧。 脚20被连接到第一引线，朝向所述第二引线向内延伸。 稳定销附连到所述腿部中的一个和所述第一引线。 .The

公开(公告)号：JP2007059095A

公开(公告)日：2007-03-08

申请号：JP2005240159

申请日：2005-08-22

Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

Inventor： NAKANO HIROSHI

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To enable to control degradation of bonding strength with a base board, even with releasing of foam generated in the solder. SOLUTION: The connector 1 for the base board is provided with a connector housing 10, a male terminal 20, and a fixing metal fitting 30. The fixing metal fitting 30 is of a shape of a metal flat plate folded in L-shape, consisting of a mounting part 31 for mounting on the connector housing 10 and a bonding part 32 for soldering. The bonding part 32 has a connecting piece 33 formed in a shape notched in nearly a gate-shape all through with a part surrounded by the notch cut upward. A gap S is left between a lower-edge tip part of the connecting piece 33 and a hole wall of a through-hole 34 (referred to below) opposing to the lower edge part. The gap S is communicated with the through-hole 34 formed after the connecting piece 33 is cut up. An underside of the connecting piece 33 and inner side faces of the through-hole 34 can be soldered. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：即使在焊料中产生的泡沫的释放，也能够控制与基板的接合强度的降低。 解决方案：用于基板的连接器1设置有连接器壳体10，阳端子20和固定金属配件30.固定金属配件30是以L形折叠的金属平板的形状， 形状，由用于安装在连接器壳体10上的安装部31和用于焊接的接合部32组成。 接合部32具有连接片33，该连接片33形成为大致形状为切口的形状，全部通过，其中被切口向上切割的部分包围。 在连接件33的下边缘部分和与下边缘部分相对的通孔34（以下称为）的孔壁之间留有间隙S. 间隙S与连接片33切断后形成的贯通孔34连通。 可以将连接片33的下侧和通孔34的内侧面焊接。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：KR100959866B1

公开(公告)日：2010-05-27

申请号：KR1020090066089

申请日：2009-07-20

Applicant: 삼성전기주식회사

Inventor： 오흥재 ,  이기택 ,  이동규 ,  정승원 ,  최진원

IPC: H01L23/495

CPC classification number: H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: PURPOSE: A lead pin for a package substrate is provided to prevent the tilt of the lead pin due to the expansion of voids in a solder resist by removing the voids along the curved surface of a head part. CONSTITUTION: A head part(110) is mounted on the pad part of a package substrate. A flat part(112) is formed on one end of a connection pin. A flange part with a diameter larger than the diameter of the flat part is formed. A round part with two different curvature radiuses is formed on the lower side of the flat part. A step part(114) is formed on the connection part between the lateral side of the flat part and the lower side of the flange part.

Abstract translation: 目的：提供用于封装基板的引脚，以通过沿着头部的曲面去除空隙来防止由于阻焊剂中的空隙的膨胀引起的引脚的倾斜。 构成：头部（110）安装在封装基板的焊盘部分上。 在连接销的一端形成平坦部分（112）。 形成直径大于平坦部分直径的凸缘部分。 在平坦部分的下侧形成具有两个不同曲率半径的圆形部分。 台阶部分（114）形成在平坦部分的侧面和凸缘部分的下侧之间的连接部分上。

公开(公告)号：KR100367045B1

公开(公告)日：2003-04-10

申请号：KR1019960705039

申请日：1995-03-09

Applicant: 더 판다 프로젝트

Inventor： 크레인,스탠포드,더블유.,제이알. ,  포르투온도,마리아,엠.

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: 복수 개의 절연 물질층과, 상기 층 중의 최소한 한 층에 형성되고 다층 기판의 외부 표면에서 부터 다층 기판의 내부 면까지 뻗는 최소한 하나의 웰과, 다층 기판 내부 면의 웰내에 형성된 전기적으로 도전성이 있는 구성 요소를 포함하는 다층 기판, 및 상기 웰내로 뻗은 최소한 하나의 전기적으로 도전성이 있는 리이드 또는 와이어를 가지며 다층 기판 내부 면에 형성된 전기적으로 도전성이 있는 구성 요소와 직접 물리적 접촉을 하는 소자를 구비하는 것을 특징으로 하는 기구.
또한, 복수 개의 절연 물질층과 상기 층 중의 최소한 한 층에 형성된 다층 기판의 외부 표면에서 부터 다층 기판의 내부 면까지 뻗는 최소한 하나의 웰과 다층 기판 내부 면의 웰내에 형성된 전기적으로 도전성이 있는 구성 요소를 포함하는 다층 기판을 형성하는 단계; 및 소자에서 나온 최소한 하나의 전기적으로 도전성이 있는 리이드 또는 와이어를 상기 웰내로 뻗게 하여, 상기 리이드 또는 와이어가 다층 기판의 내부 면 위에 형성된 전기적으로 도전성이 있는 구성 요소와 직접 물리적 접촉을 하도록 하는 단계를 구비하는 것을 특징으로 하는 기구 제조 방법.

Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多个绝缘材料层（12a-12d） ），所述层中的每一个包括在所述层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到相应的阱（15）中，该阱完全延伸穿过至少一个层并且在阱（15）未延伸穿过的层中的一个的表面之一的底部处达到底部并且电耦合 连接到形成在其相应的井（15）内的导电接合结构（13）。 ＆lt;图像＆GT;

公开(公告)号：US20150348882A1

公开(公告)日：2015-12-03

申请号：US14727554

申请日：2015-06-01

Applicant: Infineon Technologies AG

Inventor： Alfred Swain Hong YEO

IPC: H01L23/495 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49589 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10772 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

Abstract translation: 一种包括封装的电子器件，包括封装的电子芯片，至少一个至少部分暴露的导电载体引线，用于将封装安装在电子芯片上并将其电连接到载体上;以及至少一个至少部分暴露的导电连接引线 以及与所述封装堆叠的电子部件，以通过所述至少一个连接引线安装在所述封装上并与所述封装电连接。

公开(公告)号：US20150194374A1

公开(公告)日：2015-07-09

申请号：US14590021

申请日：2015-01-06

Applicant: Iinfineon Technologies AG

Inventor： Sergey ANANIEV

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

Abstract translation: 一种封装（120），其中所述封装（120）具有至少一个电子芯片（124），封装所述电子芯片（124）的封装体（138），以及多个端子引脚（122）， 连接所述电子芯片（124），其中所述端子引脚（122）中的每一个具有封装部分（126），所述封装部分至少部分地由所述封装体（138）封装并具有暴露部分（128） 其从所述封装主体（138）突出，并且其中所述暴露部分（128）的至少一部分从所述封装体（138）横向延伸到反转点（130）并且横向从所述反转点（130）向后延伸 ），以使得暴露部分（128）的自由端（132）与封装主体（138）的相应侧壁（134）横向对准或者与相应的封闭主体（138）的相应侧壁（134）间隔开 封闭体（138）的侧壁（134）横向向外。

公开(公告)号：US08988857B2

公开(公告)日：2015-03-24

申请号：US13323916

申请日：2011-12-13

Applicant: John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

Inventor： John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H05K3/30 ,  H01G4/38 ,  H01G2/06 ,  H01G4/232

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Abstract translation: 描述了改进的无源电子堆叠部件。 该组件具有堆叠的单个电子电容器和附接到堆叠的第一侧的第一引线。 第二引线连接到堆叠的第二侧。 脚连接到第一引线并向内延伸到第二引线。 稳定销连接到脚或第一引线之一。

公开(公告)号：US20140185214A1

公开(公告)日：2014-07-03

申请号：US13731127

申请日：2012-12-31

Applicant: Zhen Jia

Inventor： Zhen Jia

IPC: H05K7/20 ,  H05K3/34 ,  G06F1/18

CPC classification number: H05K7/20127 ,  G06F1/185 ,  G06F1/188 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y10T29/49144

Abstract: Disclosed are a method, system, and/or apparatus to stack a processor power module on a populated printed circuit board. A stacked processor power module includes a bare printed circuit board comprising a top surface and a bottom surface. The stacked processor power module also includes a first pair of metal lead legs coupled to an upper region of the bottom surface of the bare printed circuit board and a second pair of metal lead legs coupled to a lower region of the bottom surface of the bare printed circuit board. An integrated circuit board assembly includes a populated printed circuit board having a mounting region upon which to stack the stacked processor power module above the mounting region of the populated printed circuit board by coupling the first pair of metal lead legs and the second pair of metal lead legs to the mounting region.

Abstract translation: 公开了一种在填充的印刷电路板上堆叠处理器电源模块的方法，系统和/或装置。 堆叠的处理器电源模块包括裸露的印刷电路板，其包括顶表面和底表面。 堆叠的处理器功率模块还包括耦合到裸露印刷电路板的底表面的上部区域的第一对金属引线脚和耦合到裸露印刷电路板的底部表面的下部区域的第二对金属引脚 电路板。 集成电路板组件包括具有安装区域的填充印刷电路板，在该安装区域上，通过将第一对金属引线脚和第二对金属引线耦合在堆叠的处理器电源模块上而在堆叠的印刷电路板的安装区域上方 腿到安装区域。