公开(公告)号：US07630210B2

公开(公告)日：2009-12-08

申请号：US11604710

申请日：2006-11-28

Applicant: Mark W. Gailus ,  Leon M. Khilchenko

Inventor： Mark W. Gailus ,  Leon M. Khilchenko

IPC: H05K7/00

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在邻近引线的位置，用于更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

公开(公告)号：US20070205497A1

公开(公告)日：2007-09-06

申请号：US11604710

申请日：2006-11-28

Applicant: Mark Gailus ,  Leon Khilchenko

Inventor： Mark Gailus ,  Leon Khilchenko

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

公开(公告)号：US06593523B2

公开(公告)日：2003-07-15

申请号：US09883946

申请日：2001-06-20

Applicant: Masaaki Okada ,  Hitoshi Matsudaira

Inventor： Masaaki Okada ,  Hitoshi Matsudaira

IPC: H05K900

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  Y10S174/35

Abstract: The invention provides a shield structure that allows an easy installment of a shield case on a circuit board with more strength and firmness even if the shield case is warped or distorted. The proposed shield case includes a frame member consisting of four sidewalls and a cover member covering a farther end of the frame member from the circuit board. The frame member comprises a supporting member for sustaining the frame member on the circuit board and end faces confronting the circuit board. The supporting member comprises three projections protruding from the end face toward the circuit board.

Abstract translation: 本发明提供了一种屏蔽结构，即使屏蔽壳体翘曲或变形，也能够在电路板上容易地安装屏蔽壳体，并具有更强的强度和坚固性。 所提出的屏蔽壳包括由四个侧壁构成的框架构件和覆盖框架构件与电路板的更远端的盖构件。 框架构件包括用于维持电路板上的框架构件的支撑构件和面对电路板的端面。 支撑构件包括从端面朝向电路板突出的三个突起。

公开(公告)号：US11696396B2

公开(公告)日：2023-07-04

申请号：US17585363

申请日：2022-01-26

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H05K1/0268 ,  H05K1/0283 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US20190191565A1

公开(公告)日：2019-06-20

申请号：US16283858

申请日：2019-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Oka ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami ,  Yukio Yamamoto ,  Kensuke Otake

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K1/11 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/18 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US20130283608A1

公开(公告)日：2013-10-31

申请号：US13926069

申请日：2013-06-25

Applicant: Interplex Industries, Inc.

Inventor： Jack Seidler

IPC: H05K3/00

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

公开(公告)号：US08379402B2

公开(公告)日：2013-02-19

申请号：US12633443

申请日：2009-12-08

Applicant: Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

Inventor： Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

IPC: H01R9/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Abstract translation: 提供具有引脚的布线板。 具有引线销的布线板包括形成在布线板上的连接焊盘，引导销通过导电材料接合到该连接焊盘。 引导销包括：轴部; 头部，其设置在所述轴部的一端; 形成在所述头部的与所述连接垫相对的表面侧的突出部; 以及形成在所述头部与所述轴部的基部之间的第一锥形部。

公开(公告)号：US20090317948A1

公开(公告)日：2009-12-24

申请号：US12432075

申请日：2009-04-29

Applicant: Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

Inventor： Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

IPC: H01L21/50 ,  H01L21/60

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method is provided for manufacturing a QFN type semiconductor integrated circuit device using a multi-device lead frame having a tie bar for tying external end portions of plural leads, wherein sealing resin filled between an outer periphery of a mold cavity and the tie bar is removed by a laser and thereafter a surface treatment such as solder plating is performed.

Abstract translation: 提供一种使用具有用于捆扎多个引线的外端部的连接杆的多器件引线框架来制造QFN型半导体集成电路器件的方法，其中填充在模腔的外周和连接杆之间的密封树脂是 通过激光去除，然后进行诸如焊料镀覆的表面处理。

公开(公告)号：US20090008759A1

公开(公告)日：2009-01-08

申请号：US12215168

申请日：2008-06-25

Applicant: Tomoyuki Yoshino

Inventor： Tomoyuki Yoshino

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H05K3/3426 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a semiconductor device having an element covered with a resin mold and a metal lead protruding from the resin mold in which a lead-tip portion thereof is entirely covered by solder plating and in which a lead-tip end surface, which is not covered by solder plating, has an area less than half of a cross-sectional area of the metal lead, whereby solder wettability of the metal lead is improved and a bonding strength to a circuit board is also improved.

Abstract translation: 提供一种半导体器件，其具有被树脂模具覆盖的元件和从树脂模具突出的金属引线，其中引线顶端部分被焊接电镀完全覆盖，并且其中未覆盖的引线端面表面 通过焊料镀覆，具有小于金属引线横截面面积的一半的面积，从而提高了金属引线的焊料润湿性，并且还提高了与电路板的接合强度。