公开(公告)号：KR101754396B1

公开(公告)日：2017-07-06

申请号：KR1020160098861

申请日：2016-08-03

Applicant: (주)큐엠씨

Inventor： 유병소 ,  장현삼

IPC: G01R31/28

CPC classification number: G01R31/2893 ,  G01R31/2863 ,  G01R31/2891

Abstract: 광소자테스트장치는복수의광소자가부착된광소자필름이안착되는워크스테이지, 워크스테이지의상부에위치하고, 복수의광소자의각 광소자와순차적으로접촉되는프로브핀을포함하는프로브유닛및 일측이개방되는개구를가지는적분구를포함하고, 워크스테이지의하부에서복수의광소자의특성을순차적으로측정하는측정유닛을포함한다.

Abstract translation: 该光学器件测试装置位于所述多个工件的光学装置自附着的光学元件薄膜被安置阶段的上部，工件托架，探头单元和所述开口包括一个探针接脚的一侧被顺序地接触与每个光学装置的多个光学元件中的 以及测量单元，用于依次测量工件台下部的多个光学元件的特性。

公开(公告)号：KR1020160023444A

公开(公告)日：2016-03-03

申请号：KR1020140109874

申请日：2014-08-22

Applicant: (주)큐엠씨

Inventor： 유병소 ,  장현삼 ,  이병식 ,  김종수 ,  오효영 ,  김현형

IPC: B05B15/02 ,  B05B13/00

CPC classification number: B05B9/03 ,  B05B1/3013 ,  B05B12/02 ,  B05B17/06 ,  B05D1/02

Abstract: 피에조액츄에어터기반의도우징장치가개시되며, 본피에조액츄에어터기반의도우징장치는공정용액이저장되는공정용액저장부; 클리닝용액이저장되는클리닝저장부; 상기공정용액저장부와상기클리닝저장부에연결되어, 상기공정용액또는클리닝용액을노즐부로공급하는용액공급부; 상기용액공급부로부터공급받은용액을분사구를통해외부로분사하는노즐부; 상기분사구를개폐하기위해상하방향으로승강가능하도록결합되는태핏; 및제어신호에따라상기태핏을상하방향으로구동하는피에조액츄에이터를포함한다.

Abstract translation: 公开了一种基于压电致动器的计量装置。 基于压电致动器的计量装置包括：存储处理液的处理溶液存储单元; 存储清洁溶液的清洁储存单元; 连接到处理液存储单元和清洁存储单元的解决方案供应单元，以将处理溶液或清洁溶液供应到喷嘴单元; 所述喷嘴单元被配置为通过喷射孔将从所述溶液供应单元供应的溶液喷射到外部; 挺杆，其联接成可垂直移动以打开或关闭喷孔; 以及压电致动器，被配置为根据控制信号垂直地驱动挺杆。 因此，定量给料装置容易洗涤喷嘴单元。

公开(公告)号：KR1020140059875A

公开(公告)日：2014-05-19

申请号：KR1020120125415

申请日：2012-11-07

Applicant: (주)큐엠씨

Inventor： 유병소 ,  장현삼 ,  이병식

IPC: G01R31/26 ,  H01L21/66

Abstract: The present invention relates to an electronic component inspection and classification device for classifying electronic components by characteristic after inspecting the electronic components. The purpose of the present invention is to provide the electronic component inspection and classification device capable of improving efficiency by quickly and accurately classifying the electronic components that inspection is complete according to the characteristic. The electronic component classification device according to an embodiment quickly and accurately performs a task of classifying the electronic components.

Abstract translation: 本发明涉及一种电子部件检查和分类装置，用于在检查电子部件之后通过特性对电子部件进行分类。 本发明的目的是提供一种电子部件检查和分类装置，其能够根据特性快速准确地对检查完成的电子部件进行分类，从而提高效率。 根据实施例的电子部件分类装置快速且准确地执行对电子部件进行分类的任务。

公开(公告)号：KR1020140031516A

公开(公告)日：2014-03-13

申请号：KR1020120097263

申请日：2012-09-03

Applicant: (주)큐엠씨

Inventor： 김정식 ,  송성호 ,  오효영 ,  정유석 ,  유병소 ,  장현삼 ,  이형권

IPC: H01L21/78 ,  H01L21/301 ,  H01L33/48

CPC classification number: H01L33/58 ,  H01L21/78 ,  H01L2933/0058

Abstract: A method for processing a chip package is disclosed. The method for processing a chip package comprises the steps of: (a) forming a release material layer on the bottom surface of a substrate part having a plurality of chips to be installed on a substrate; (b) processing a lens part on the top surface of the substrate part ; and (c) fully cutting the substrate using a laser beam. [Reference numerals] (AA) Start; (BB) End; (S100) Step of forming a release material layer on the bottom surface of a substrate part; (S200) Step of processing a lens part on the top surface of the substrate part; (S300) Step of processing the substrate part

Abstract translation: 公开了一种处理芯片封装的方法。 处理芯片封装的方法包括以下步骤：（a）在具有要安装在基板上的多个芯片的基板部分的底表面上形成剥离材料层; （b）在所述基板部的上表面上加工透镜部; 和（c）使用激光束完全切割衬底。 （附图标记）（AA）开始; （BB）结束; （S100）在基板部的底面上形成剥离材料层的工序; （S200）在基板部的上表面上加工透镜部的工序; （S300）处理基板部的工序

公开(公告)号：KR1020130136736A

公开(公告)日：2013-12-13

申请号：KR1020120060377

申请日：2012-06-05

Applicant: (주)큐엠씨

Inventor： 장현삼

IPC: H01L21/301

CPC classification number: H01L21/56 ,  H01L21/67028 ,  H01L21/67092 ,  H01L21/78

Abstract: A method for processing a chip package is disclosed. The method for processing a chip package includes (a) a step for processing the sealing part of the chip package by using the ultra sonic vibration of an ultra sonic vibration unit, and (b) a step for processing the substrate part of the chip package by using the laser of a laser process unit. [Reference numerals] (AA) START;(BB) END;(S10) Process a sealing part using ultra sonic vibration;(S20) Process a substrate unit using a laser

Abstract translation: 公开了一种处理芯片封装的方法。 用于处理芯片封装的方法包括：（a）通过使用超声波振动单元的超声波振动来处理芯片封装的密封部分的步骤，以及（b）用于处理芯片封装的基板部分的步骤 通过使用激光处理单元的激光。 （参考号）（AA）START;（BB）END;（S10）使用超声波振动处理密封部件;（S20）使用激光器处理基板单元

公开(公告)号：KR1020130118709A

公开(公告)日：2013-10-30

申请号：KR1020120063559

申请日：2012-06-14

Applicant: (주)큐엠씨

Inventor： 김승규 ,  유병소 ,  장현삼 ,  이병식 ,  김종수

IPC: G01R31/26

Abstract: PURPOSE: A device for classifying electronic devices is provided to stably implement a classification process of the electronic devices. CONSTITUTION: A device for classifying electronic devices includes a first stage (10) and a second stage (20). The first stage and the second stage load the electronic devices and are arranged to be faced with each other in both sides of a pickup device (50). The first stage and the second stage are perpendicularly arranged to the ground and moves in a plane direction. The pickup device includes a swing arm (51) and a driving unit (53). The swing arm picks up or places the electronic devices. The swing arm is extended in a radial direction around a rotation axis and a driving unit having the rotation axis. The driving unit is equipped in an end unit of the swing arm. The driving unit picks up the electronic devices from the first stage or places the electronic devices to the second stage according to the rotation of the swing arm.

Abstract translation: 目的：提供一种用于分类电子设备的设备，以稳定地实现电子设备的分类过程。 构成：用于分类电子装置的装置包括第一级（10）和第二级（20）。 第一阶段和第二阶段加载电子设备并被布置为在拾取装置（50）的两侧彼此面对。 第一阶段和第二阶段垂直地布置在地面上并在平面方向上移动。 拾取装置包括摆臂（51）和驱动单元（53）。 摆臂拿起或放置电子设备。 摆臂围绕旋转轴径向径向延伸，驱动单元具有旋转轴。 驱动单元配备在摆臂的端部单元中。 驱动单元从第一级拾取电子设备，或者根据摆臂的旋转将电子设备放置到第二级。

公开(公告)号：KR1020130104046A

公开(公告)日：2013-09-25

申请号：KR1020120025177

申请日：2012-03-12

Applicant: (주)큐엠씨

Inventor： 장현삼

IPC: G01R31/26 ,  G01R31/28

Abstract: PURPOSE: An electronic part inspection apparatus is provided to prevent the leakage of light emitting from an electronic part to the outside. CONSTITUTION: An electronic part inspection apparatus includes a carriage unit and a measurement unit. The carriage unit includes a mount member (21) and a driver. An electronic part is mounted on the mount member. The driver rotates or elevates the mount member. The measurement unit includes an integrating sphere (41) having an aperture with one side opened. The integrating sphere installs a socket member (43) having an insertion unit in which the electronic part is inserted formed. The socket member prepares a probe pin (44) contacting an electrode of the electronic part when the electronic part is inserted into the insertion unit.

Abstract translation: 目的：提供电子部件检查装置，以防止从电子部件向外部发出的光的泄漏。 构成：电子部件检查装置包括滑架单元和测量单元。 托架单元包括安装构件（21）和驱动器。 电子部件安装在安装部件上。 驱动器旋转或升高安装构件。 测量单元包括具有一侧打开的孔的积分球（41）。 积分球安装具有插入单元的插座构件（43），电子部件插入其中形成。 当电子部件插入到插入单元中时，插座构件准备与电子部件的电极接触的探针（44）。

公开(公告)号：KR101262859B1

公开(公告)日：2013-05-09

申请号：KR1020100074628

申请日：2010-08-02

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소 ,  김학용 ,  곽종호

IPC: B23K26/073 ,  G02B26/00 ,  G02B27/09

Abstract: 본발명은레이저빔을생성하는레이저광원; 상기레이저빔의발산각을교정하는빔 정형모듈(beam shaping module); 교정된상기레이저빔을대상물의내부에집광하여스폿을형성하는집광렌즈(focusing Lens); 및상기레이저광원, 상기빔 정형모듈및 상기집광렌즈와연결되어이들을제어하는제어부를포함하며, 상기빔 정형모듈은복수의전환식렌즈군(群)을포함하는것을특징으로하는레이저를이용한대상물가공장치를제공한다.

公开(公告)号：KR101171817B1

公开(公告)日：2012-08-14

申请号：KR1020100016425

申请日：2010-02-23

Applicant: (주)큐엠씨 ,  전남대학교산학협력단

Inventor： 유병소 ,  이준기 ,  권광우

IPC: H01L33/32

Abstract: 본원은, 전기화학적 정전위법(electrochemical potentiostatic method)을 이용하여 질화갈륨계 화합물 반도체에 함유된 p-형 도판트를 활성화시킴으로써 p-형 질화갈륨계 화합물 반도체 층의 정공 농도를 증가시키고 전기적 특성을 개선할 수 있는 방법을 제공하고 이러한 방법을 이용하여 제조되는 질화갈륨계 화합물 반도체 디바이스 및 발광 디바이스를 제공하고자 한다.

公开(公告)号：KR101151216B1

公开(公告)日：2012-06-14

申请号：KR1020090109822

申请日：2009-11-13

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G01J1/58

Abstract: 본 발명의 목적은 수광과정에서 광손실이 발생하지 않는 적분구 유닛, 및 이를 구비한 엘이디 칩 테스트장치와 엘이디 칩 분류장치를 제공하는 것이다.
이를 위해 본 발명은, 광원의 광특성을 측정하기 위한 적분구 유닛에 있어서, 내측에 중공부가 형성되어 있으며, 이 중공부로 광을 전달하는 수광공을 가진 적분구본체; 상기 본체에 일체로 형성되며, 상기 수광공을 향하여 광을 전달하는 삽입공을 가진 프로브카드를 포함하는 것을 특징으로 하는 적분구 유닛을 제공한다.
적분구, 프로브카드, 수광공, 삽입공, 엘이디 칩