Abstract:
A semiconductor memory device comprising: at least one output data terminal (OB1-OB16,I/O1-I/O16); a matrix of memory cells comprising a plurality of columns (BL) of memory cells; multiplexer means (12) associated to said matrix of memory cells for selectively coupling one of said columns to respective sensing means (13) driving said output data terminal; redundancy columns (RBL) of redundancy memory cells for functionally replacing defective columns in said matrix; first means (RR1-RR4,1) for storing defective addresses of said defective columns in said matrix, for comparing said defective addresses with a current address supplied to the memory device and for selecting a redundancy column when the current address coincides with one of said defective addresses; means for generating an internal timing signal (ATD) activated upon changing of a current address (ADD) supplied to the memory device, the internal timing signal (ATD) remaining activated for a prescribed time starting from the beginning of a read cycle of the memory device. The memory device comprises: redundancy sensing means (10) associated to said redundancy columns (RBL), and redundancy control means (2,3,8,9) supplied by the internal timing signal (ATD) for coupling said output data terminal (OB1-OB16,I/O1-I/O16) of the memory device to said redundancy sensing means (10) in alternative to said sensing means (13) when the current address supplied to the memory device is a defective address, said redundancy control means maintaining the output data terminal of the memory device coupled to said sensing means (13) independently of the current address being a defective address as long as the internal timing signal (ATD) is activated.
Abstract:
A page-mode semiconductor memory device comprises a matrix (1) of memory cells (MC') arranged in rows (R) and columns (C), each row (R) forming a memory page (MP1-MPn) of the memory device and comprising at least one group (MW1,MW2-MW2m-1,MW2m) of memory cells (MC'), memory page selection means (2) for selecting a row (R) of the matrix (1), and a plurality of sensing circuits (3') each one associated to a respective column (C) of the matrix. The memory cells (MC') are multiple-level memory cells which can be programmed in a plurality of c=2 b (b>1) programming states to store b information bits, and the sensing circuits (3') are serial-dichotomic sensing circuits capable of determining, in a number b of consecutive approximation steps, the b information bits stored in the memory cells (MC'), at each step one of said b information bits being determined, said at least one group (MW1,MW2-MW2m-1,MW2m) of memory cells (MC') of a row (R) forming a number b of memory words of a memory page (MP1-MPn).
Abstract:
A semiconductor memory device comprises: a plurality of output data terminals (I/OB1-I/OB16,I/O1-I/O16); a matrix of memory cells comprising a plurality of groups (P) of columns (BL) of memory cells, each group of columns being associated to a respective output data terminal; column selection means (4) associated to the matrix of memory cells for selectively coupling one column (BL) for each of the group (P) of columns to a respective sensing means (5) driving the output data terminal; redundancy columns (RBL) of redundancy memory cells for functionally replacing defective columns in the matrix; redundancy column selection means (1) associated to the redundancy columns (RBL) for selectively coupling one redundancy column to a redundancy sensing means (11); defective address storage means (RR,2) for storing defective addresses of the defective columns and identifying codes (OC0-OC3) suitable for identifying the groups (P) of columns wherein the defective columns are located, for comparing the defective addresses with a current address (CADD) supplied to the memory device and for driving the redundancy column selection means for selecting a redundancy column when a current address supplied to the memory device coincides with one of the defective addresses. A shared bus (INTBUS) including a plurality of signal lines (INTBUSi) is provided in the memory device for interconnecting a plurality of circuit blocks (100) of the memory device and for transferring signals between the circuit blocks, the shared bus (INTBUS) being selectively assignable to the circuit blocks in prescribed respective time intervals. The memory device also comprises first bus assignment means (3) associated to the defective address storage means (RR) and second bus assignment means (8) associated to the sensing means (5). The first bus assignment means (3) assign the shared bus (INTBUS), during a first prescribed time interval of a read cycle of the memory device, to the defective address storage means (RR,2) for transferring the identifying code (OC0-OC3) of an addressed defective column to the output data terminals; the second bus assignment means (8) assign the shared bus (INTBUS), during a second prescribed time interval of the read cycle, to the sensing means (5) for transferring output signals of the sensing means (5) to the output data terminals. The transferred identifying code determining an output data terminal associated to the group (P) of columns to which the addressed defective column belongs to be supplied by an output signal of the redundancy sensing means (11) in alternative to an output of the sensing means (5) associated to the group (P) of columns.
Abstract:
The row decoder includes a predecoding stage (203) supplied with row addresses and generating predecoding signals; and a final decoding stage (204), which, on the basis of the predecoding signals, drives the individual rows in the array. The predecoding stage (203) includes a number of predecoding circuits (15) presenting two parallel signal paths: a low-voltage path (30) used in read mode, and a high-voltage path (31) used in programming mode. A CMOS switch (32) separates the two paths, is driven by high voltage via a voltage shifter (45) in programming mode, and, being formed at predecoding level, involves no integration problems.
Abstract:
The present invention concerns a redundant UPROM cell (1) incorporating at least one memory element (P0) of the EPROM or flash type having a control terminal (CG) and a conduction terminal (X) to be biased, a register (2) with inverters connected to the memory element and MOS transistors (M1,M3) connecting said memory element (P0) with a reference low voltage power supply (Vdd). There is provided a precharge network (5) for the conduction terminal (X) of the flash cell and said network (5) incorporates a complementary pair of transistors (M4,M5). The second transistor (M5) of said pair (M4,M5) is a natural N-channel MOS type. With the UPROM cell (1) is associated a circuit portion (10) for generating at output (U) a live signal (UPCH) to be applied to the control terminal of the second transistor (M5) with the portion (10) comprising a timing section (7) and a generation section (8) for said second live signal (UPCH).
Abstract:
Voltage-controlled oscillator, with high noise rejection of the supply voltage, of the type constituted by a plurality of delay cells (21, 22, 23) in an odd number N ≥3, which are connected to form a first ring oscillator (27, 34) and powered by the difference between a supply voltage Vcc and a variable regulating voltage VR, comprising at least one second ring oscillator (28, 46) formed by a plurality of delay cells (23, 24, 25) in an odd number M ≥3, at least one of which is also a delay cell of the first oscillator (27, 34) and at least two of which (24, 25) do not belong to the first oscillator, at least one of these two cells (24, 25) being powered by a constant voltage (Vcc), in such a manner that the two oscillators operate at the same frequency and the interaction between the two oscillators introduces a high-frequency negative feedback which has the effect of effectively reducing the noise of the supply voltage Vcc.
Abstract:
A circuit (1) for generating biasing signals in reading of a redundant UPROM cell (2) incorporating at least one memory element (FC) of the EPROM or flash type and having a control terminal (GC) and a conduction terminal (DC) to be biased as well as MOS transistors (M1,M2) connecting said memory element (FC) with a reference low supply voltage (Vcc) comprises a voltage booster (3) for generating at output (U1) a first voltage signal (UGV) to be applied to the control terminal (GC) of the memory element (FC) and a limitation network (5) for said voltage signal (UGV) connected to the output (U1) of the voltage booster (3). There is also provided a circuit portion (10) for generating at output (U2) a second voltage signal (Vb) to be applied to the control terminal of one (M2) of the above mentioned transistors (M1,M2). This circuit portion (10) comprises a timing section (7) interlocked with the voltage booster (3) of a section (8) generating the second voltage signal (Vb).
Abstract:
The invention relates to a sense amplifier circuit for reading and verifying the contents of non-volatile memory cells in a semiconductor integrated device including a matrix of electrically programmable and erasable cells, the circuit comprising a sense amplifier which has a first input connected to a reference load column (5) incorporating a reference cell, and a second input connected to a second, matrix load column (6) incorporating a cell of the memory matrix (11). The circuit comprises a small matrix (12) of reference cells connected, in parallel with one another, in the reference column (5). Also provided is a double current mirror (20) having a first mirror column (15) which is connected to a node (A) in the load column (5) connected to the first input, and a second mirror column (16) coupled to the second load column (6) to locally replicate, on the second mirror column (16), the electric potential at said node (A) during the load equalizing step.