公开(公告)号：WO2010096714A3

公开(公告)日：2011-01-27

申请号：PCT/US2010024817

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES INC ,  DESTA YOHANNES ,  NAMBURI LAKSHMIKANTH ,  LOSEY MATTHEW

Inventor： DESTA YOHANNES ,  NAMBURI LAKSHMIKANTH ,  LOSEY MATTHEW

IPC: H01L21/66

CPC classification number: G01R1/07378

Abstract: A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mouni technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through- hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor aid space transformer substrates.

Abstract translation: 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面摩尼技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而靠近探针接触器基板上的导电元件，该空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器辅助空间变压器基板之间。

公开(公告)号：WO2010096714A2

公开(公告)日：2010-08-26

申请号：PCT/US2010/024817

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

Inventor： DESTA, Yohannes ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

IPC: H01L21/66

CPC classification number: G01R1/07378

Abstract: A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mouni technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through- hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor aid space transformer substrates.

Abstract translation: 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面摩尼技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而靠近探针接触器基板上的导电元件，该空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器辅助空间变压器基板之间。

公开(公告)号：WO2010096707A2

公开(公告)日：2010-08-26

申请号：PCT/US2010024807

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES INC ,  DESTA YOHANNES ,  HUANG CHANG ,  NAMBURI LAKSHMIKANTH ,  LOSEY MATTHEW

Inventor： DESTA YOHANNES ,  HUANG CHANG ,  NAMBURI LAKSHMIKANTH ,  LOSEY MATTHEW

IPC: H01L21/66

CPC classification number: G01R1/07378

Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.

Abstract translation: 多个插入件被锚定在探头的孔或凹槽中。 轴与插入件连接，并且可调整的多部件紧固件连接至轴和加强件。 操作多部件紧固件以移动轴并联接探头，加强件和微电子接触器组件的其他部件。 在一些实施例中，插入件可以使用粘合剂锚定在探头中。 在一些实施例中，探头可以包括多于一个的主基板，并且插入件可以锚定在任一基板中。

公开(公告)号：WO2009075681A1

公开(公告)日：2009-06-18

申请号：PCT/US2007/087173

申请日：2007-12-12

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： KARKLIN, Ken ,  GARABEDIAN, Raffi

IPC: G01R31/28

CPC classification number: G01R1/07364 ,  G01R31/2891

Abstract: A novel planarizing probe card (110) for testing a semiconductor device is presented. The probe card is adapted to come into. contact with a probe card mount (107) that is in adjustable contact with the prober. The probe card includes a printed circuit board (130) affixed to a stiffener (135) and a probe head (115) that is in electrical contact with the printed circuit board The probe head also includes a plurality of probe contactor tips (120) that define a first plane (152). The stiffener further contains at least two planarizing adjusters (137) that comes into contact with the probe card mount The adjusters may be actuated to alter the position of first plane. A surface of the semiconductor device under test (105) may define a second plane, and the adjusters may be adjusted to position the first plane to be substantially parallel to the second plane.

Abstract translation: 提出了一种用于测试半导体器件的新型平面化探针卡（110）。 探针卡适应进入。 与探头卡座（107）接触，探头卡座可与探测器调节接触。 探针卡包括固定到加强件（135）的印刷电路板（130）和与印刷电路板电接触的探针头（115）。探针头还包括多个探针接触器尖端（120），其中 限定第一平面（152）。 加强件还包含至少两个与探针卡座接触的平坦化调节器（137）。调节器可以被致动以改变第一平面的位置。 被测半导体器件（105）的表面可以限定第二平面，并且可以调节调节器以将第一平面定位成基本上平行于第二平面。

公开(公告)号：WO2008153558A2

公开(公告)日：2008-12-18

申请号：PCT/US2007/069896

申请日：2007-05-29

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： KARKLIN, Ken ,  GARABEDIAN, Raffi

IPC: G01R13/02

CPC classification number: G01R1/0735 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2224/48 ,  H01L2924/00

Abstract: A novel device for testing semiconductor chips is disclosed. A benefit with all the embodiments described herein is that the device may experience zero (or near zero) nascent force. The device may be comprised of a printed circuit board (PCB)that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer. When the PCB piercing structure and the substrate piercing structure pierce the elastomer, the PCB becomes electrically connected to the probe contactor. Instead of the piercing structure, the PCB or the probe contractor substrate may be adhered to the elastomer by an adhesive, such that the PCB becomes electrically connected to the probe contactor. The PCB piercing structure and the substrate piercing structure may include a flying lead wire, soldered pins or pressed pins. The adhesives may include, but are not limited to, screenable conductive surface mount adhesives. Finally, a diagnostic computer may be electrically connected to the PCB to assist in testing the semiconductor chips.

Abstract translation: 公开了一种用于测试半导体芯片的新型器件。 本文描述的所有实施例的益处是设备可能经历零（或近零）新生力。 该装置可以包括具有至少一个PCB穿孔结构的印刷电路板（PCB），具有至少一个基板穿孔结构的探针接触器基板，其中基板穿孔结构电连接到探针接触器，以及 具有至少一个由导电弹性体制成的电通孔的插入器。 当PCB穿孔结构和基板穿孔结构刺穿弹性体时，PCB与探针接触器电连接。 代替穿孔结构，PCB或探针承载器基底可以通过粘合剂粘附到弹性体，使得PCB变得电连接到探针接触器。 PCB穿孔结构和基板穿孔结构可以包括飞行引线，焊接引脚或压脚。 粘合剂可以包括但不限于可屏蔽的导电表面贴装粘合剂。 最后，诊断计算机可以电连接到PCB以帮助测试半导体芯片。

公开(公告)号：WO2008127801A3

公开(公告)日：2008-12-11

申请号：PCT/US2008055835

申请日：2008-03-04

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： TEA NIM ,  KHOO MELVIN ,  HU TING ,  AN ZHIYONG

IPC: G01R1/067

CPC classification number: G01R1/06733 ,  G01R1/06727 ,  G01R3/00

Abstract: A novel probe design (2) is presented that increases a probe tolerance to stress, fractures. Specifically three features are disclosed to increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers. The probe presented in the present invention comprises a base (5) that is connected to a substrate, a torsion element (10) connected to the base, and a second element (15) connected to the torsion element through a union angle.

Abstract translation: 提出了一种新颖的探针设计（2），增加探针对应力，骨折的耐受性。 具体地，公开了三个特征以增加应力耐受性。 这些特征包括各种联合角度界面边缘形状，枢轴切口和缓冲区。 本发明提供的探针包括连接到基板的基座（5），连接到基座的扭转元件（10）和通过接合角连接到扭转元件的第二元件（15）。

公开(公告)号：WO2008069967A3

公开(公告)日：2008-10-30

申请号：PCT/US2007024631

申请日：2007-11-30

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： KINGHORN DAVID ,  GARABEDIAN RAFFI ,  YABUKI RICHARD ,  ISMAIL SALLEH

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2435 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/325

Abstract: The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.

Abstract translation: 本发明涉及一种中介层，其具有带有上表面和下表面的中介层基底以及具有上部和下部的至少一个弹性接触元件。 上部以基本垂直的方式在所述插入基板的上表面上方延伸，并且下部在所述插入基板的下表面下方以基本垂直的方式延伸。 弹性接触元件的上部和下部在平行于基板的方向上基本上是弹性的。

公开(公告)号：WO2008008065A1

公开(公告)日：2008-01-17

申请号：PCT/US2006/027272

申请日：2006-07-13

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： LU, Shaoning ,  NIM, Tea ,  MELVIN, Khoo

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/07342

Abstract: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.

Abstract translation: 公开了一种用于将探针卡施加到被测设备（“DUT”）上的横向力平衡的新颖方法和结构。 许多DUT（特别是存储器件）被并行测试（即，一次许多裸片）并且在管芯的顶部与底部和/或右侧与左侧之间具有不相等数量的接触焊盘。 用于测试DUT的探针卡必然具有与接触垫相匹配的探头的不均匀分布，并且因此可能在DUT上施加净侧向力。 通过操纵各个探针的各个特性，构造可以使横向力消除的探针卡。 诸如各个探针的方向和刚度的特征可以变化为零的净侧向力。

公开(公告)号：WO2007102847A3

公开(公告)日：2008-01-17

申请号：PCT/US2006037771

申请日：2006-09-26

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： WALKER STEVEN J

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/06794 ,  G01R1/07342

Abstract: A novel structure for a probe card that comprises a deformable metal or other deformable material for detecting excess overdrive and a method for using the same are disclosed. This detection structure may be positioned on the substrate along the bending path of the probe, such that should the probe experience excess overdrive, then the detection structure will permanently deform where it is hit by any portion of the probe. Alternatively, the detection structure may be embedded in the substrate, and may also function as a fiducial for alignment detection. Inspection of the probe card, and specifically the detection structure, will reveal whether any probe has experienced excess overdrive. Should the inspection reveal that certain regions of the card experienced excess overdrive, this may indicate a planarity problem that affects production line yield.

Abstract translation: 公开了一种用于探针卡的新型结构，其包括用于检测过量过载的可变形金属或其它可变形材料及其使用方法。 该检测结构可以沿着探针的弯曲路径定位在基底上，使得如果探针经受多余的过度传播，则检测结构将在被探针的任何部分撞击的地方永久地变形。 或者，检测结构可以嵌入在基板中，并且还可以用作对准检测的基准。 探针卡的检查，特别是检测结构，将揭示任何探头是否经历过度过载。 如果检查显示卡的某些区域经历过多的过度驱动，这可能表示影响生产线产量的平面问题。

公开(公告)号：WO2007033146A3

公开(公告)日：2007-03-22

申请号：PCT/US2006/035442

申请日：2006-09-13

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： GARABEDIAN, Raffi ,  TEA, Nim, Hak ,  ISMAIL, Saleh

IPC: G01R1/073 ,  H01R13/24

Abstract: An interposer has an interposer substrate (100) with an upper surface and a lower surface and at least one resilient contact element having an upper portion (110A) and a lower portion (HOB). The upper portion extends in a substantially vertical fashion above the upper surface of the interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of the interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.