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公开(公告)号：KR1020100089922A
公开(公告)日：2010-08-13
申请号：KR1020090009103
申请日：2009-02-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J133/04 , C09J7/00
CPC classification number: C09J11/00 , C09J9/00 , C09J163/00 , C09J201/00 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for electronic parts, and an adhesive member for the electronic parts using thereof are provided to secure the excellent heat resistance, high reliability, and mechanical strength of the composition. CONSTITUTION: An adhesive composition for electronic parts contains a thermosetting epoxy resin as a main component, and 0.01~10 parts of dendrimer structure compound by weight. The adhesive composition additionally contains 100 parts of thermosetting epoxy resin by weight, 50~300 parts of thermoplastic resin or hardener by weight, and 1~200 parts of hardener by weight.
Abstract translation: 目的：提供电子部件用粘合剂组合物和使用其的电子部件用粘合剂，以确保组合物的优异的耐热性，高可靠性和机械强度。 构成：电子部件用粘合剂组合物含有作为主要成分的热固性环氧树脂，以及重量比为0.01〜10份的树状聚合物结构化合物。 粘合剂组合物另外含有100重量份的热固性环氧树脂，50〜300重量份的热塑性树脂或硬化剂，和1〜200重量份的硬化剂。
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公开(公告)号：KR1020100083359A
公开(公告)日：2010-07-22
申请号：KR1020090002702
申请日：2009-01-13
Applicant: 도레이첨단소재 주식회사
IPC: H01L21/302 , H01L21/78 , H01L21/301
CPC classification number: H01L21/6836 , C09J7/22 , C09J2203/326 , C09J2433/00 , H01L21/6835 , H01L2221/68327
Abstract: PURPOSE: A wafer support adhesive film for processing a semiconductor thin film wafer is provided to prevent the damage to a semiconductor wafer by not requiring an additional cleaning process in a separation process. CONSTITUTION: An adhesive film is attached to a circuit formation surface of a semiconductor wafer(W) by using a laminator(16). The semiconductor wafer is thinned by grinding the rear of the semiconductor wafer with a grinder(10). The rear of the semiconductor wafer is fixed to a dicing tape(11). The dicing tape has adhesion and is maintained in a frame(12).
Abstract translation: 目的：提供用于处理半导体薄膜晶片的晶片支撑粘合膜，以通过在分离过程中不需要额外的清洁处理来防止对半导体晶片的损坏。 构成：通过使用层压机（16）将粘合膜附着到半导体晶片（W）的电路形成表面。 通过用研磨机（10）研磨半导体晶片的后部来减薄半导体晶片。 半导体晶片的后部固定在切割胶带（11）上。 切割带具有附着力并保持在框架（12）中。
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公开(公告)号：KR1020100073612A
公开(公告)日：2010-07-01
申请号：KR1020080132328
申请日：2008-12-23
Applicant: 도레이첨단소재 주식회사
IPC: C09J11/04
CPC classification number: C09J11/00 , C08K3/32 , C09J9/00 , C09J2205/102
Abstract: PURPOSE: A non-halogen flame retardant adhesive composition for a semiconductor device is provided to obtain excellent non-halogen retardant effect while maintaining properties of the adhesive by making a non-halogen phosphate flame retardant dispersed uniformly within the adhesive. CONSTITUTION: A non-halogen flame retardant adhesive composition for a semiconductor device includes a thermosetting resin, a hardener, a rubber having carbon-carbon double bond, and a non-halogen phosphate-based flame retardant. The non-halogen phosphate-based flame retardant is an energy ray-curable flame retardant compound which contains phosphorous physically or chemically and has an energy ray-curable structure.
Abstract translation: 目的：提供一种用于半导体器件的非卤素阻燃剂粘合剂组合物，以通过使非卤素磷酸酯阻燃剂均匀分散在粘合剂中而保持粘合剂的性能而获得优异的非卤素阻燃效果。 构成：用于半导体器件的非卤素阻燃剂粘合剂组合物包括热固性树脂，硬化剂，具有碳 - 碳双键的橡胶和非卤素磷酸酯类阻燃剂。 无卤素磷酸酯类阻燃剂是能量射线固化型阻燃化合物，其在物理或化学上含有磷并且具有能量射线固化性结构。
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公开(公告)号：KR1020090080783A
公开(公告)日：2009-07-27
申请号：KR1020080006748
申请日：2008-01-22
Applicant: 도레이첨단소재 주식회사
IPC: C09J109/02 , C09J163/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/20 , C09J11/00 , C09J109/02 , C09J2203/326
Abstract: A halogen free coverlay adhesive composition, and a coverlay film using the composition are provided to improve adhesive strength and peel strength. A halogen free coverlay adhesive composition comprises an epoxy resin 100 parts by weight; a carboxyl group-containing acrylonitrile-butadiene rubber 50 ~ 250 parts by weight; a polyester resin or a phosphorus-containing polyester resin 10 ~ 100 parts by weight; at least one curing agent selected from amine-based and acid anhydride-based compounds 1 ~ 50 parts by weight; a phosphate-based flame retardant 20 ~ 100 parts by weight; and an inorganic flame retardant 20 ~ 100 parts by weight.
Abstract translation: 提供无卤覆层粘合剂组合物和使用该组合物的覆盖膜以提高粘合强度和剥离强度。 无卤覆层粘合剂组合物包含100重量份的环氧树脂; 含羧基的丙烯腈 - 丁二烯橡胶50〜250重量份; 聚酯树脂或含磷聚酯树脂10〜100重量份; 至少一种选自胺类和酸酐类化合物1〜50重量份的固化剂; 磷酸酯类阻燃剂20〜100重量份; 和无机阻燃剂20〜100重量份。
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公开(公告)号：KR1020090078051A
公开(公告)日：2009-07-17
申请号：KR1020080003819
申请日：2008-01-14
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J113/00 , C09J1/00
CPC classification number: C09J11/06 , C08K5/5313 , C09J9/00 , C09J11/04 , C09J109/00 , C09J163/00 , C09J2203/30 , C09J2205/102 , C09J2479/086
Abstract: An adhesive composition for a halogen-free coverlay film is provided to ensure excellent fire retardant characteristic, adhesive force, heat resistance, bleed out and fluidity required for the cover lay film. An adhesive composition for a halogen-free coverlay film(1) comprises a nitrile butadiene rubber which contains a carboxyl group, has molecular weight of 10,000~200,000 and acrylonitrile content of 20~40 weight%; a non-halogen polyfunctional epoxy resin which has two or more epoxy groups per 1 molecule and molecular weight of 200 ~ 1,000 or less; a hardener; a curing accelerator; a non-halogen phosphorous-based flame retardant which has a phosphorous content of 10 mass % or greater and a thermal decomposition temperature of 300°C or more; and inorganic particles such as aluminium hydroxide, magnesium hydroxide, magnesium oxide, zinc oxide, antimony trioxide or silica.
Abstract translation: 提供了一种无卤覆膜的粘合剂组合物，以确保覆盖膜所需的优异的阻燃特性，粘合力，耐热性，渗流性和流动性。 无卤覆层膜（1）的粘合剂组合物包含含有羧基的丁腈橡胶，分子量为10,000〜200,000，丙烯腈含量为20〜40重量％。 每1分子具有2个以上的环氧基，分子量为200〜1000以下的无卤多官能环氧树脂; 硬化剂 固化促进剂; 磷含量为10质量％以上且热分解温度为300℃以上的无卤磷系阻燃剂， 和无机颗粒如氢氧化铝，氢氧化镁，氧化镁，氧化锌，三氧化锑或二氧化硅。
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Patent Agency Ranking
公开(公告)号：KR1020090053062A
公开(公告)日：2009-05-27
申请号：KR1020070119697
申请日：2007-11-22
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 다이싱·다이본드용 점착테이프에 관한 것으로서, 보다 상세하게는 다이싱테이프가 따로 필요하지 않으며, 접착필름에 페녹시 골격을 함유한 에폭시 수지와 에너지선 중합형 화합물의 첨가로 자외선 경화함에 따라 다이의 픽업성능이 향상되고, 접착특성이 우수한 다이싱·다이본드용 점착테이프에 관한 것이다. 이를 위해 본 발명에 따른 다이싱·다이본드용 점착테이프는 반도체 다이싱 및 다이본딩에 사용되는 다이본드용 점접착테이프에 있어서, 기재와 그 위에 형성된 점접착제층을 포함하되, 상기 점접착제층은 (A)점착성분, (B)에폭시수지, (C)경화제, (D)잠재성 경화촉진제, (E)에너지선 경화형 올리고머 및 (F)광개시제를 포함하며, 상기 (B)에폭시수지는 페녹시 골격을 포함하는 에폭시 수지인 것을 특징으로 한다.
다이싱, 다이본드, 점착테이프, 점접착제층, 에폭시수지, 페녹시 골격-
公开(公告)号：KR100845978B1
公开(公告)日：2008-07-11
申请号：KR1020070040263
申请日：2007-04-25
Applicant: 도레이첨단소재 주식회사
CPC classification number: H01L21/6836 , H01L21/566 , H01L2221/68327
Abstract: An adhesion tape for semiconductor dicing is provided to prevent generation of a burr on a substrate due to high speed blade when dicing a semiconductor chip and prevent contamination of the semiconductor chip. A base film includes an inner layer formed by mixing polypropylene(2) of 20 to 30 wt% and ethylene-based rubber-propylene compound(3) of 70 to 80 wt%. The ethylene-based rubber-propylene compound is dispersed in a matrix of the polypropylene. The base film has a thickness of 25 to 200 mum, and the inner layer has a thickness of a quarter as thick as the thickness of the base film. The base film has an outer layer(1) of polypropylene.
Abstract translation: 提供了用于半导体切割的粘合带，用于当切割半导体芯片并防止半导体芯片的污染时，防止由于高速刀片而在基板上产生毛刺。 基膜包括通过混合20〜30重量％的聚丙烯（2）和70〜80重量％的乙烯系橡胶 - 丙烯化合物（3）而形成的内层。 乙烯类橡胶 - 丙烯化合物分散在聚丙烯的基质中。 基膜的厚度为25〜200μm，内层的厚度为基膜的厚度的四分之一。 基膜具有聚丙烯的外层（1）。
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公开(公告)号：KR100836158B1
公开(公告)日：2008-06-09
申请号：KR1020060126281
申请日：2006-12-12
Applicant: 도레이첨단소재 주식회사
IPC: C09J109/02 , C09J163/00 , C09J11/00
CPC classification number: C09J109/02 , C08L63/00 , C08L83/04 , C09J5/06 , C09J11/04 , C09J11/06 , C09J2203/326
Abstract: A heat-curable adhesive film is provided to prevent the damage of a reinforcing material or flexible printed circuit board when the reinforcing material adheres to the flexible printed circuit board, and to enhance reliance and yield of a product. A heat-curable adhesive film is a laminate comprising an adhesive layer(20), a release paper(30) formed on one surface of the adhesive layer, and an exfoliative film(10) formed on the other surface of the adhesive layer. The adhesive layer comprises 100 parts by weight of acrylonitrile butadiene rubber containing a carboxyl group, 50-100 parts by weight of an epoxy resin, 1-20 parts by weight of at least one hardener selected from amine-based or acid anhydride-based hardeners, and 0.01-1 parts by weight of a silicone-based surface treatment agent. The silicone-based surface treatment agent is a polysiloxane-based or organically modified polysiloxane.
Abstract translation: 提供一种可热固化的粘合剂膜，以防止当增强材料粘附到柔性印刷电路板上时增强材料或柔性印刷电路板的损坏，并且增强产品的依赖性和屈服性。 热固性粘合剂膜是包含粘合剂层（20），形成在粘合剂层的一个表面上的剥离纸（30）和形成在粘合剂层的另一个表面上的剥离膜（10）的层压体。 粘合剂层包含100重量份含有羧基的丙烯腈丁二烯橡胶，50-100重量份的环氧树脂，1-20重量份的至少一种选自胺系或酸酐系硬化剂的硬化剂 ，和0.01-1重量份的硅氧烷基表面处理剂。 硅氧烷类表面处理剂是聚硅氧烷类或有机改性聚硅氧烷。
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公开(公告)号：KR1020080011779A
公开(公告)日：2008-02-11
申请号：KR1020060072190
申请日：2006-07-31
Applicant: 도레이첨단소재 주식회사
IPC: C09J113/00 , C09J163/00 , C09J7/02
CPC classification number: C09J7/35 , C09J11/06 , C09J113/00 , C09J163/00 , C09J2203/326
Abstract: An adhesive composition for coverlay films is provided to ensure excellent physical properties such as heat resistance, adhesion, flame retardancy, flowability, etc. An adhesive composition for coverlay films comprises (a) NBR containing carboxyl groups, (b) a polyfunctional epoxy resin having at least two epoxy groups per molecule, (c) a brominated epoxy resin having at least two epoxy groups per molecule, (d) an amine-based or acid anhydride-based hardener, and (e) inorganic particles. The coverlay film is a laminate of an insulating film, an adhesive, and a release film.
Abstract translation: 提供了用于覆盖膜的粘合剂组合物以确保优异的物理性能如耐热性，粘合性，阻燃性，流动性等。用于覆盖膜的粘合剂组合物包括（a）含有羧基的NBR，（b）多官能环氧树脂，其具有 每分子至少两个环氧基，（c）每分子具有至少两个环氧基的溴化环氧树脂，（d）胺基或酸酐类固化剂和（e）无机颗粒。 覆盖膜是绝缘膜，粘合剂和剥离膜的层压体。
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公开(公告)号：KR1020070050661A
公开(公告)日：2007-05-16
申请号：KR1020050108144
申请日：2005-11-11
Applicant: 도레이첨단소재 주식회사
CPC classification number: C01G23/04 , B82Y30/00 , B82Y40/00 , C01G15/006 , C01P2004/64
Abstract: 본 발명은 인듐틴옥사이드 나노 입자의 제조방법 및 이로부터 소결체를 제조하는 방법에 관한 것으로서, 보다 상세하게는, 착체중합공정을 이용하여 ITO 나노 분말의 최적합성 조건을 확립하여 안정하고 재현성 있는 제조방법과 그 방법에 따라 제조된 ITO 분말을 이용하여 상압소결을 통한 저온에서 치밀화를 이룸으로서 상업적으로 유용하면서 우수한 특성 발현이 가능한 증착용 타겟으로 사용가능한 인듐틴옥사이드 소결체를 제조할 수 있는 인듐틴옥사이드 나노 입자의 제조방법 및 이로부터 소결체를 제조하는 방법에 관한 것이다.
이를 위해 본 발명은 (a) 킬레이트제를 용매에 용해시킨 용액에 인듐착물 및 주석착물을 첨가하여 금속킬레이트 복합체를 제조하는 단계와, (b) 상기 금속킬레이트 복합체에 적정온도를 가하여 폴리에스터화 반응을 통하여 중합수지를 제조하는 단계와, (c) 상기 중합수지를 가열하여 고분자 전구체를 제조하는 단계와, (d) 상기 고분자 전구체를 하소하는 단계와, (e) 상기 하소된 고분자 전구체를 결정화시켜 인듐틴옥사이드 나노입자를 제조하는 단계를 포함하는 것을 특징으로 한다. 또한 본 발명은 상기 방법에 따라 제조된 인듐틴옥사이드 나노입자를 성형 및 소결함으로써 인듐틴옥사이드 소결체를 얻는 것을 특징으로 한다.
인듐틴옥사이드, 도전성 필름, 나노분말
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