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公开(公告)号：KR1020160098875A
公开(公告)日：2016-08-19
申请号：KR1020150021067
申请日：2015-02-11
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0271 , H05K2201/2009
Abstract: 본발명은인쇄회로기판에관한것이다. 본발명의인쇄회로기판은, 비아또는관통홀이구비된절연층; 상기절연층상에형성되며, 패턴을형성하여상기비아또는관통홀과접속되는패드가구비된회로층; 상기절연층중 최외층절연층상에복개되는솔더레지스트층;을포함하고, 상기회로층은이종의금속층이적층된바이메탈(bimetal) 형태로구성된다.
Abstract translation: 印刷电路板技术领域本发明涉及印刷电路板。 根据本发明，印刷电路板包括：具有通孔或通孔的绝缘层; 形成在所述绝缘层上并具有通过形成图案而连接到所述通孔或所述通孔的焊盘的电路层; 以及覆盖在绝缘层的最外层绝缘层上的阻焊层。 电路层被构造成双金属形状，其中层压异质金属层。
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公开(公告)号：KR1020150062558A
公开(公告)日：2015-06-08
申请号：KR1020130147343
申请日：2013-11-29
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4673 , H05K1/115 , H05K3/061 , H05K3/4661 , H05K2201/0191 , Y10T29/49155
Abstract: 본발명은그라비아인쇄를통해층간절연성및 강성을증대시켜층간도통불량을개선할수 있도록절연층의상부및 하부면에동박층을적층하는단계; 상기동박층표면에절연물을도포하는단계; 상기동박층에에칭공정을진행하여회로층을형성하는단계; 상기동박층에절연물과회로층이감싸지도록절연재를적층하는단계; 상기절연재에회로층과연통되도록비아를형성하는단계; 상기절연재에회로패턴을구성하는단계; 를포함할수 있다.
Abstract translation: 本发明包括以下步骤：在绝缘层的上侧和下侧层叠铜箔层，通过凹版印刷增加层间绝缘和刚性来改善层间导电故障; 在铜箔层的表面上喷涂绝缘材料; 通过对铜箔层进行蚀刻处理来形成电路层; 在铜箔层上堆叠绝缘材料以包围绝缘材料和电路层; 在要连接到电路层的绝缘材料上形成通孔; 并且包括在绝缘材料上的电路图案。
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公开(公告)号：KR1020140052609A
公开(公告)日：2014-05-07
申请号：KR1020120118916
申请日：2012-10-25
Applicant: 삼성전기주식회사
CPC classification number: B05B13/0242 , B05D3/00 , B05D3/007
Abstract: The present invention relates to a post-treatment apparatus for a substrate which has a reduced installation space for a stripping process. The post-treatment apparatus includes: a chamber; a transferring roller installed inside the chamber to transfer a substrate; a sensor that senses the substrate transferred inside or outside the chamber; a control part that receives signals sensed by the sensor; a rotation member that rotates the substrate transferred inside the chamber according to the signals of the control part; and a spray that is installed inside the chamber and above the rotation member, and spays an agent to strip a surface layer of the surface of the substrate.
Abstract translation: 本发明涉及一种用于剥离工艺的安装空间减小的基板后处理装置。 后处理装置包括：室; 安装在所述腔室内以转移衬底的转印辊; 感测在室内或室外转移的基底的传感器; 控制部，其接收由所述传感器感测到的信号; 旋转构件，其根据所述控制部的信号旋转在所述室内转移的所述基板; 以及安装在腔室内部和旋转构件上方的喷雾器，并且喷射剂以剥离衬底表面的表面层。
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Patent Agency Ranking
公开(公告)号：KR1020130045609A
公开(公告)日：2013-05-06
申请号：KR1020110109918
申请日：2011-10-26
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat dissipation efficiency. CONSTITUTION: A printed circuit board includes a base substrate(110) and a solder resist(121). The base substrate forms a via which connects a wiring pattern by penetrating insulation material after burying a wiring pattern and forms a connection pad in the wiring pattern. The solder resist exposes the wiring pattern and the connection pad. The solder resist covers the exposed parts of the via and insulation material. The surface of the wiring pattern is formed to be lower than the surface of the insulation material.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以提高散热效率。 构成：印刷电路板包括基底（110）和阻焊剂（121）。 基底基板形成通孔，该通孔在掩埋布线图案之后穿透绝缘材料并连接布线图案，并在布线图案中形成连接垫。 阻焊剂暴露了布线图案和连接垫。 阻焊剂覆盖通孔和绝缘材料的暴露部分。 布线图案的表面形成为低于绝缘材料的表面。
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公开(公告)号：KR101044133B1
公开(公告)日：2011-06-24
申请号：KR1020090112028
申请日：2009-11-19
Applicant: 삼성전기주식회사
Abstract: 본 발명은 인쇄회로기판 제조용 캐리어에 관련되며, 2층의 금속층, 및 상기 2층의 금속층에 적층된 절연층을 포함하는 베이스부재, 및 상기 베이스부재의 측면에 형성된 접착부재를 포함한다.
또한, 본 발명은 인쇄회로기판 제조용 캐리어의 제조방법 및 상기 캐리어를 이용한 인쇄회로기판의 제조방법에 관련된다.
캐리어, 접착부재, 빌드업층-
公开(公告)号：KR1020110060623A
公开(公告)日：2011-06-08
申请号：KR1020090117252
申请日：2009-11-30
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A carrier member for manufacturing a substrate as an insulating layer and a circuit pattern of a coreless substrate and a method for manufacturing a substrate using the same are provided to save the manufacturing cots of a coreless substrate. CONSTITUTION: Metal layers(120) are placed on both sides of an insulating layer(110). A first hole(130) penetrates an edge of the insulating layer in a thickness direction. A fixing member(140) is inserted into the first hole and fixes two insulating layers. A base substrate is placed between the insulating layers. A second hole is formed on the base substrate. The second hole corresponds to the first hole.
Abstract translation: 目的：提供用于制造作为绝缘层的基板的载体部件和无芯基板的电路图案以及使用其的基板的制造方法，以节省无芯基板的制造单元。 构成：将金属层（120）放置在绝缘层（110）的两侧。 第一孔（130）在厚度方向上穿透绝缘层的边缘。 固定构件（140）插入到第一孔中并固定两个绝缘层。 将基底放置在绝缘层之间。 在基底基板上形成第二孔。 第二个孔对应于第一个孔。
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公开(公告)号：KR1020110055133A
公开(公告)日：2011-05-25
申请号：KR1020090112028
申请日：2009-11-19
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A carrier for manufacturing a printed circuit board and manufacturing method thereof are provided to configure a carrier by a part of a printed circuit board, thereby preventing cost loss due to the manufacture of the carrier. CONSTITUTION: A base member functions as a core layer. The base member includes a two-layered metal layer(120) and an insulating layer(110). An adhesive member(200) adheres the two-layered metal layer. The length of the adhesive member is thicker than the thickness of the base member to form a step toward the insulating layer. The adhesive member comprises a protrusion in the thickness direction of the base member.
Abstract translation: 目的：制造印刷电路板的载体及其制造方法，由印刷电路板的一部分构成载体，由此防止由于载体的制造造成的成本损失。 构成：基础成员充当核心层。 基底构件包括双层金属层（120）和绝缘层（110）。 粘合剂（200）粘附双层金属层。 粘合剂部件的长度比基体部件的厚度厚，以形成朝向绝缘层的台阶。 粘合构件包括在基底构件的厚度方向上的突起。
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公开(公告)号：KR100894179B1
公开(公告)日：2009-04-22
申请号：KR1020070108394
申请日：2007-10-26
Applicant: 삼성전기주식회사
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: A substrate strip is provided to accurately inspect the eccentricity of an unit zone pad and an opening of a solder resist layer by using an automatic equipment. A substrate strip(100) comprises an insulating layer(110), a pad, a solder resist layer( 130), an opening, an inspection target and a through hole. The insulating layer is segmented by an unit zone(112) and a dummy region(114) surrounding the unit zone. The pad of NSMD type exposed along with the adjacent insulating layer out is formed in one side of the unit zone. The opening is formed in the solder resist layer so that the zone which is adjacent to the pad of the insulating layer and the pad is exposed. The inspection target placed in one side of the dummy region is used as a sample of the eccentricity inspection of the pad and the opening. The though hole is formed in the solder resist layer so that the zone, which is adjacent to the inspection target of the insulating layer and inspection target, is exposed. The eccentricity between the opening and the pad can be inspected by measuring the eccentricity between the inspection target and the through hole. The inspection target comprises a first test pattern, placed toward the traverse direction and a second test pattern, crossed with the first test pattern, arranged at the longitudinal direction.
Abstract translation: 提供基板条以通过使用自动设备来精确地检查单位区焊盘的偏心度和阻焊层的开口。 衬底条（100）包括绝缘层（110），焊盘，阻焊层（130），开口，检查目标和通孔。 绝缘层由单位区域（112）和围绕单元区域的虚拟区域（114）分段。 在相邻绝缘层外露的NSMD型焊盘形成在单元区的一侧。 在阻焊层中形成开口，使得与绝缘层和焊盘的焊盘相邻的区域露出。 将放置在虚拟区域的一侧的检查对象用作衬垫和开口的偏心检查的样本。 通孔形成在阻焊层中，使得与绝缘层和检查对象的检查对象相邻的区域露出。 可以通过测量检查对象和通孔之间的偏心度来检查开口和垫之间的偏心度。 检查对象包括沿纵向放置的第一测试图案和沿纵向方向布置的与第一测试图案交叉的第二测试图案。
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