POSITION MEASURING APPARATUS, POSITION MEASURING METHOD, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD
    41.
    发明申请
    POSITION MEASURING APPARATUS, POSITION MEASURING METHOD, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
    位置测量装置,位置测量方法,光刻设备和装置制造方法

    公开(公告)号:WO2014019846A2

    公开(公告)日:2014-02-06

    申请号:PCT/EP2013/064982

    申请日:2013-07-16

    CPC classification number: G03F7/70141 G03F9/7026 G03F9/7034

    Abstract: An apparatus for measuring positions of marks on a substrate, includes an illumination arrangement for supplying radiation with a predetermined illumination profile across a pupil of the apparatus, an objective lens for forming a spot of radiation on a mark using radiation supplied by said illumination arrangement, a radiation processing element for processing radiation that is diffracted by the mark, a first detection arrangement for detecting variations in an intensity of radiation output by the radiation processing element and for calculating therefrom a position of the mark, an optical arrangement, a second detection arrangement, wherein the optical arrangement serves to direct diffracted radiation to the second detection arrangement, and wherein the second detection arrangement is configured to detect size and/or position variations in the radiation and to calculate therefrom a defocus and/or local tilt of the mark.

    Abstract translation: 用于测量基板上的标记位置的设备包括:用于在设备的瞳孔上提供具有预定照明分布的辐射的照明设备;用于在标记上形成辐射点的物镜 使用由所述照明装置提供的辐射;辐射处理元件,用于处理由所述标记衍射的辐射;第一检测装置,用于检测所述辐射处理元件输出的辐射强度的变化,并由此计算所述标记的位置; 光学装置,第二检测装置,其中所述光学装置用于将衍射的辐射引导至所述第二检测装置,并且其中所述第二检测装置被配置为检测所述辐射中的尺寸和/或位置变化并且由此计算散焦并且 /或标记的本地倾斜。

    METROLOGY METHOD AND APPARATUS AND COMPUTER PROGRAM

    公开(公告)号:WO2022008135A1

    公开(公告)日:2022-01-13

    申请号:PCT/EP2021/064156

    申请日:2021-05-27

    Abstract: Disclosed is a method of improving a measurement of a parameter of interest. The method comprises obtaining metrology data comprising a plurality of measured values of the parameter of interest, relating to one or more targets on a substrate, each measured value relating to a different measurement combination of a target of said one or more targets and a measurement condition used to measure that target and asymmetry metric data relating to asymmetry for said one or more targets. A respective relationship is determined for each of said measurement combinations relating a true value for the parameter of interest to the asymmetry metric data, based on an assumption that there is a common true value for the parameter of interest over said measurement combinations. These relationships are used to improve a measurement of the parameter of interest.

    METROLOGY SENSOR, LITHOGRAPHIC APPARATUS AND METHOD FOR MANUFACTURING DEVICES

    公开(公告)号:WO2018206177A1

    公开(公告)日:2018-11-15

    申请号:PCT/EP2018/055394

    申请日:2018-03-06

    Abstract: Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarization state and an optical collection system configured to collect scattered radiation, following scattering of the illumination radiation by the metrology mark. The metrology mark comprises a main structure and changes, relative to the first polarization state, at least one of a polarization state of a first portion of the scattered radiation predominately resultant from scattering by the main structure and a polarization state of a second portion of radiation predominately resultant from scattering by one or more features other than the main structure, such that the polarization state of the first portion of the scattered radiation is different to the polarization state of the second portion of the scattered radiation. The metrology sensor apparatus further comprises an optical filtering system which filters out the second portion of the scattered radiation based on its polarization state.

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